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晶圓製造服務
About公司簡介
台積公司是全世界最大的專業積體電路製造服務公司.
台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。
領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。
台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。
企業經營理念
一、堅持誠信正直
二、專注於「專業積體電路製造服務」本業
三、放眼世界市場,國際化經營
四、注意長期策略,追求永續經營
五、客戶是我們的夥伴
六、品質是我們工作與服務的原則
七、鼓勵在各方面的創新,確保高度企業活力
八、營造具挑戰性、有樂趣的工作環境
九、建立開放型管理模式
十、兼顧員工福利與股東權益,盡力回饋社會
台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。
領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。
台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。
企業經營理念
一、堅持誠信正直
二、專注於「專業積體電路製造服務」本業
三、放眼世界市場,國際化經營
四、注意長期策略,追求永續經營
五、客戶是我們的夥伴
六、品質是我們工作與服務的原則
七、鼓勵在各方面的創新,確保高度企業活力
八、營造具挑戰性、有樂趣的工作環境
九、建立開放型管理模式
十、兼顧員工福利與股東權益,盡力回饋社會
Product/Service產品/服務
「成為大家的代工廠」(Be Everyone’s Foundry)是台積公司策略的核心。
透過技術與服務的擴展,我們打造了一個開放平台,歡迎所有半導體產業的創新者能夠實現創新,並將其產品快速量產上市。2019年,台積公司全球總產能超過1,200萬片之十二吋晶圓約當量,台積公司並提供最廣泛的製程技術,全面涵蓋自2微米製程至最先進的製程技術,即現今的7奈米製程。台積公司係首家提供7奈米製程技術為客戶生產晶片的專業積體電路製造服務公司,同時亦領先業界導入極紫外光(EUV)微影技術協助客戶產品大量進入市場。
台積公司的眾多客戶遍布全球,為客戶生產的晶片被廣泛地運用在電腦產品、通訊產品、消費性、工業用及標準類半導體等多樣電子產品應用領域。
透過技術與服務的擴展,我們打造了一個開放平台,歡迎所有半導體產業的創新者能夠實現創新,並將其產品快速量產上市。2019年,台積公司全球總產能超過1,200萬片之十二吋晶圓約當量,台積公司並提供最廣泛的製程技術,全面涵蓋自2微米製程至最先進的製程技術,即現今的7奈米製程。台積公司係首家提供7奈米製程技術為客戶生產晶片的專業積體電路製造服務公司,同時亦領先業界導入極紫外光(EUV)微影技術協助客戶產品大量進入市場。
台積公司的眾多客戶遍布全球,為客戶生產的晶片被廣泛地運用在電腦產品、通訊產品、消費性、工業用及標準類半導體等多樣電子產品應用領域。
Benefits公司福利
更多說明
【重視人才,重視未來】
人才是台積電保持領先的關鍵,只有幸福的夥伴,才能打造有競爭力的團隊,
每一位在台積的夥伴都能享有遠超其他企業的薪資與福利。
【優質的環境,帶來更多活力】
對台積人而言,生活的豐富和專業的成就同等重要;從食衣住行
的滿足到精神層面的提升,台積人獲得充分的照顧。
1.優質的工作環境
2.員工餐廳與果汁吧、咖啡廳、便利商店及書店
3.運動館及健身房
4.幼兒園
5.員工協助方案及健康中心
6.運動會、家庭日與野餐日
詳見企業網站 http://www.tsmc.com/chinese/careers/compensation_benefits.htm
如欲投遞其他履歷,請上台積官網 http://www.tsmc.com/chinese/careers/index.htm
人才是台積電保持領先的關鍵,只有幸福的夥伴,才能打造有競爭力的團隊,
每一位在台積的夥伴都能享有遠超其他企業的薪資與福利。
【優質的環境,帶來更多活力】
對台積人而言,生活的豐富和專業的成就同等重要;從食衣住行
的滿足到精神層面的提升,台積人獲得充分的照顧。
1.優質的工作環境
2.員工餐廳與果汁吧、咖啡廳、便利商店及書店
3.運動館及健身房
4.幼兒園
5.員工協助方案及健康中心
6.運動會、家庭日與野餐日
詳見企業網站 http://www.tsmc.com/chinese/careers/compensation_benefits.htm
如欲投遞其他履歷,請上台積官網 http://www.tsmc.com/chinese/careers/index.htm
注意!本區全部福利項目可能依不同職缺有所不同,實際職缺福利請依面試時與公司面談結果為準
Resources其他資源
Jobs工作機會
共 258 個職缺
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15453&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
We are seeking a highly skilled and experienced Senior Data Analyst to join our dynamic team. This role is pivotal in transforming how our organization utilizes data in the Compensation and Benefits domain. The ideal candidate will have a deep understanding of global data analysis and a proven track record of delivering data-driven insights that inform strategic decision-making. You will work closely with cross-functional teams to understand their data needs and provide innovative solutions that drive efficiency and enhance data integrity.
Responsibilities:
1. Gather and meticulously analyze global data from diverse sources and systems related to Compensation and Benefits.
2. Partner with cross-functional teams to comprehend data requirements and deliver tailored solutions.
3. Design and craft interactive dashboards and comprehensive reports utilizing Tableau and other advanced tools and technologies.
4. Identify and propose process enhancements to optimize data collection and analysis workflows.
5. Establish and uphold data quality standards, ensuring the highest level of data integrity.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 14 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士
10年以上
日班
02 / 14 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111
Responsibilities:
R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations.
1. Research & Pathfinding
(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.
2. Integration
(1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc.
(2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc.
(3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies.
(4) Customer design enablement: SPICE Modeling and IP qualifications.
3. Module
(1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies.
(2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification.
(3) Transfer process and tool to high volume manufacturing fab.
4. R&D Process Center
(1) PE: Advanced module process development and baseline sustaining.
(2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment.
(3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 60+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班
02 / 13 | 已被閱覽 60+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers.
Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area.
Opening roles for you:
1. Physical Designer
2. Standard Cell Engineer
3. Layout Engineer
4. System and Chip Design Solutions Development
5. FE design & DFT
6. SRAM Engineer
7. Design Flow/Methodology
For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15379&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications.
1. Integration
(1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline.
(2) Package level reliability, failure mode analysis and improvement plan.
(3) Customer technical interface, new tape out and lot handle.
(4) Handover developed technologies to manufacturing groups for production.
2. Module Development
(1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects.
(2) New technology, materials survey, and process improvement on 3DIC package structures.
(3) Process development and tool transfer to mass-production development.
3. Simulation
(1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment.
(2) Practice FEM and DOE in problem solving and path finding particularly on packaging.
(3) Continue improvement in simulation methodology, material modeling and script automation.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15378&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
1. Novel devices developing for specialty technology.
2. Device Simulation, Test-chip design tape out and measurement system developing.
3. Process flow developing for production.
4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15380&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
The Job Role:
1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era.
2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry.
Responsibilities:
1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling.
2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking.
3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect (w/ focus on parallel processing and high-speed networking).
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15381&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
我們確保晶片的品質、持續提升良率,提供給客戶具有競爭力且高品質的晶片,讓電子產品不但先進且效能穩定;製程整合工程師為半導體製造中的重要協調者,需要與客戶溝通了解客製化的晶片應用需求,再將訊息帶回廠內,與各工程單位合作。良率精進工程師監控晶片的良率與缺陷,使用量測機台監測晶片的缺陷,找出可能的問題,再與製程解決問題。
1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products.
2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements.
3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班、晚班、大夜班、假日班、輪班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15382&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。
1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements.
2. Identify and solve IC process and device problems.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班、晚班、大夜班、假日班、輪班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15383&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Responsibilities:
機台是工廠穩定運作的基礎,我們在生產線上,負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題;如此可減少機台當機的時間與提升機台可運轉的時間,進而降低生產成本並提升公司的獲利能力。
1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment.
2. Sustain and troubleshoot issues with high-tech equipment.
3. Improve and enhance the efficiency and productivity of equipment.
4. Plan and execute the analysis or defect detection projects.
5. Communicate with cross-functional engineers or vendors.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
02 / 13 | 已被閱覽 60+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
大學
經驗不拘
日班、晚班、大夜班、假日班、輪班
02 / 13 | 已被閱覽 60+ 次 | 1~5 人應徵
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15384&source=1111&tags=domestic+campus+2025_1111
Responsibilities:
As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment.
Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background.
1. MFG Intelligent Manufacturing Engineer
As an Intelligent Manufacturing Engineer, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations.
(1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide.
(2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency.
(3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity.
2. CIM Intelligent Manufacturing Engineer
(1) Software Developers:
Design and develop intelligent manufacturing solutions for factory automation, manufacturing scheduling and dispatching, decision making and engineering analysis.
(2) Dispatching Algorithm Developers:
Heterogeneous data integration and corresponding solution design and development.
(3) Quality Management Engineer:
Server maintenance and related setting support including routine upgrades, troubleshooting with AP teams, high-availability architecture, virtual machines solutions, firewall rule, IIS, Nginx, database middle etc.
3. Data Analyst & Data Scientist
(1) Application of statistics, machine learning, data mining, pattern recognition and other data analysis by AI techniques.
(2) Your main responsibility will be to collect, explore, and extract insights from very large scale structured and unstructured data and explain these insights with the help of data visualization tools to support fab operations.
4. AMHS (Automated Material Handling System) Engineer
(1) AMHS (Software) system & AI development/(Hardware) layout design & transport simulation.
(2) Enhance System Performance, Quality and Reliability.
(3) Coordinate cross-organization AMHS projects.
5. PIDS/WAT (Wafer Acceptance Test) Engineer
(1) New WAT tool data matching and release.
(2) WAT quality/manufacturing efficiency improvement.
(3) WAT tool, recipe, and system management.
(4) WAT productivity and quality improvement.
(5) WAT tool and systematic issue troubleshooting.
6. PIDS/NTO (New TapeOut) Engineer
(1) Handle mask tapeout and manufacturing flow creation.
(2) Manage projects related to NTO system development and enhancement.
7. Quality Management Engineer
(1) Manage audit, defense, and quality systems.
(2) To perform data analysis and simulation.
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
新竹縣寶山鄉
待遇面議
碩士、博士
經驗不拘
日班、晚班、大夜班、假日班、輪班
02 / 13 | 已被閱覽 30+ 次 | 1~5 人應徵
台灣積體電路製造股份有限公司(台積電)(03)5636688