SIBCO

SIBCO is an engineering company with offices in The Netherlands, USA, Taiwan, Hong Kong, and China. SIBCO specializes in semiconductor and chip packaging focusing on micro-wave and MEMS designs and module manufacturing in Hybrid Integrated Circuit ceramic, HIC, and multi-layer Low-Temperature Co-fired Ceramic, LTCC, technologies. Our extensive expertise and world-wide partner network allow us to:
Partner with R&D institutes and companies to transfer knowledge, designs, technology, products, and equipment with extensive design, process, and manufacturing & equipment training of the R&D, Process, and Manufacturing engineers, technicians, and operators. As well as on-site process development to help our customers understand and master RF/MW and MEMS designs in multi-layer ceramic technology and HIC and LTCC manufacturing processes.
SIBCO assists in the transfer of Technology and Intellectual Property. With an application engineering team with expertise in installing equipment, service, support, maintenance, and process development, our customers get the value they expect from any technology supplier.Not only provides SIBCO turn-key production lines, process, and manufacturing technology to the RF/MW and MEMS module design and manufacturing industry, also stand-alone equipment and assistance in process development to optimize existing production lines.

With over 40 years of expertise and experience in RF/MW and MEMS designs and our own LTCC module designs and manufacturing processes, we have developed programs, processes, and test substrates to qualify HIC and LTCC manufacturing lines for specific substrate and module design rules.