56

1. Minimum of 2-year sales working experience in Thermal Pad 2. Understand the process, material, and various application of Thermal pad either silicone or non-silicone in automotive and non-automotive industry. 3. Able to make recommendation based on application to customer on what type of Thermal interphase materials are required and related specification. 4. Good communication & interpersonal skill and presentation skill 5. Ability to expand new customers.

應徵人數|1-5 人

2024/03/26

〝1. Minimum of 2-year sales working experience in Thermal Pad 2. Understand the process, material, and various application of Thermal pad either silicone or non-silicone in automotive and non-automotive industry. 3. Able to make recommendation based on application to customer on what type of Thermal interphase materials are required and related specification. 4. Good communication & interpersonal skill and presentation skill 5. Ability to expand new customers.〝

應徵人數|1-5 人

2024/03/26

1. Develop innovative liquid cooling solutions (Cold plate & Immersion Cooling) 2. Communicate with internal and external department to solve issues and make sure to meet target on time - Capable to find out adequate resource & solutions to deliver fastest response to customers - Excellent teamwork and communication (verbal and writing) skills - Show initiatives and has strong drive for customer satisfaction - Systematically & logically thinking and do support management Designing and consulting of Thermal, Acoustic, Mechanical solutions 1. Liquid cooling, cold plate and immersion system 2. Fin-tube and plate heat exchanger 3. Single / two phase heat transfer, mass transfer enhancement structure 4. Thermal and acoustic test, issue debug 5. Vendor management 6. New technology study機械工程學類

應徵人數|1-5 人

2024/03/29

Summary: For an employee who is full of passion and is always willing to learn. Detail oriented, responsible and dedicated attitudes, and an outgoing personality are traits highly preferred. The position will be major in charge of server system thermal/ liquid cooling designs and validations. Essential Duties and Responsibilities: • Conceptualize, plan, and execute the design and development of liquid cooling solutions for server platforms; • Validate thermal compliance of systems and components with regards to industry standards; • Thermal measurements and analysis of cooling systems and components; • Summarize and present lab results to engineering teams, vendors, and customers; • Investigate and identify new techniques to advance thermal developments and validations; • Collaborate with HW, ME, Lab and PM teams for system designs and environmental tests; • Interface with contract vendors for product developments and improvement recommendations機械工程學類

應徵人數|1-5 人

2024/03/29

Summary: For an employee who is full of passion and is always willing to learn. Detail oriented, responsible and dedicated attitudes, and an outgoing personality are traits highly preferred. The position will be major in charge of server system thermal/ liquid cooling designs and validations. Essential Duties and Responsibilities: • Conceptualize, plan, and execute the design and development of advanced cooling solutions for server platforms • Validate thermal compliance of systems and components with regards to industry standards •Thermal measurements and analysis of cooling systems and components • Cross-function work with HW/ Thermal/ PM/ ME/ etc… • Projects test status & schedule control/ update • Thermal solution design review & optimization • Investigate and identify new techniques to advance thermal developments and validations • Lab Thermal Testing Equipments management & maintain •Lab Thermal Testing Equipments calibration機械工程學類,電機工程學類,電子工程學類

應徵人數|1-5 人

2024/03/29

Summary: We demand thermal engineers to develop thermal solutions for servers: 1. Standard Servers: 1U/ 2U/ 3U/ Blade server thermal solutions, more than 5 years-experience is preferred, or 2. Edge computing application: Wide operating temperature thermal solutions for servers, including cooling and heating solutions in outdoor harsh environment. Both of thermal, fluid and acoustic knowledge / experience are required for this job role. Candidates should be experts in system / board level thermal solutions, need to have good communication skills to engage with customer earlier, fulfil current / future requirements. Essential Duties and Responsibilities: 1. Develop wide operating temperature solutions for Telco customers 2. Communicate with internal and external department to solve issues and make sure to meet target on time -Capable to find out adequate resource & solutions to deliver fastest response to customers -Excellent teamwork and communication (verbal and writing) skills -Show initiatives and has strong drive for customer satisfaction -Systematically & logically thinking and do support management Designing and consulting of Thermal, Acoustic, Mechanical solutions 1. Hybrid thermal solutions both of heating and cooling for server 2. Familiar with heating elements, and related safety certifications 3. Heat transfer, mass transfer enhancement structure desgin 4. Thermal and acoustic test, issue debug 5. Vendor management 6. New technology study機械工程學類普通小型車,普通重機車

應徵人數|1-5 人

2024/03/29

〝Worked in thermal pad production > 2 years Able to understand various chemicals and relationship of those chemicals to improve the material /product performance in terms of reducing or increasing thermal conductivity Use polymer/ material science to identify those chemicals that can improve performances in removing/ reducing heat in electrical components Manage material test in Chemical Laboratory Identify equipment, create test standards, and register those standards in the company system. Develop materials to meet customer thermal pad application. English skill is required With strong initiative to develop new product. Know-how about Quality Management System/ISO Standard such as; ISO I9001, IATF 16949, ISO 14001, VDA 6.3 etc. Know-how about quality control to avoid any reject/defect of the product. Able to work under pressure and in minimal supervision.〝

應徵人數|1-5 人

2024/03/26

1.Participate & lead project thermal development independently. 2.Release RFP/RFQ 3.Create & maintain the thermal document ,thermal model ,and test plan for customer request. 4.Optimize thermal design by simulation and experiment. 5.Design thermal experiment and complete thermal test plan. 6.Search & study new thermal solution. 7.Measure & evaluate the fan loundness & fan performance.機械工程學類,航太工程學類

應徵人數|1-5 人

2024/03/26

Qualifications: Worked in thermal pad production > 2 years Able to understand various chemicals and relationship of those chemicals to improve the material /product performance in terms of reducing or increasing thermal conductivity Use polymer/ material science to identify those chemicals that can improve performances in removing/ reducing heat in electrical components Manage material test in Chemical Laboratory Identify equipment, create test standards, and register those standards in the company system. Develop materials to meet customer thermal pad application. English skill is required With strong initiative to develop new product. Know-how about Quality Management System/ISO Standard such as; ISO I9001, IATF 16949, ISO 14001, VDA 6.3 etc. Know-how about quality control to avoid any reject/defect of the product. Able to work under pressure and in minimal supervision.

應徵人數|1-5 人

2024/03/26

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃,提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類,物理學類

應徵人數|1-5 人

2024/03/26

Provide technical guidance based on market trend customers’ requirements. Represents the voice of the customer, partner, and the market across the organization in business decisions affecting design and process. Strong design project management experience in outdoor edge computing systems (IP65) and network equipment building system (NEBS). Lead internal teams in system design review from concept, prototype, to final product. Take lead in resolving both pre and post sales issues in timely manner. Collaborate with cross-functional teams, dig into the root cause and come up with improvement/enhancement plan.

應徵人數|1-5 人

2024/03/29

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃,提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類,物理學類普通小型車,普通重機車

應徵人數|1-5 人

2024/03/26

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃,提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 5.112年度研發替代役 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類,物理學類

應徵人數|1-5 人

2024/03/26

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃,提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類普通小型車,普通重機車

應徵人數|1-5 人

2024/03/26

Summary: Sr. Hardware engineer complete assigned project until product end of life including drawing schematics, check layout, component survey, specification and datasheet study, motherboard and system bring up, bug fix, customer issues analyze,innovation new application, BOM creation, second source verify . Co work with other team member for project needs. Must have system level knowledge about Thermal, EMI, ME. Essential Duties and Responsibilities: 1.In-depth knowledge of PCB layout, OrCAD/Allegro tools, circuit design, and PCB structure. 2.Prepare technical documentation including product specifications, layout instructions, test procedures, etc. 3.Transfer products to manufacturing with clear documentation, and help C.M. and technical support to solve problems. 4.Hardware engineer need co work with PM,BIOS,IPMI,EMI,Thermal,ME RD friendly. Need have good team work. Need to have the concept of project ownership. 5.Need have power VR and component design knowledge 6.Resolve complicated issues and drive to root cause on critical engineering problems.電機工程學類,電子工程學類

應徵人數|1-5 人

2024/03/29

1.帶領研發團隊人員共同達成專案目標 2.協助NB機種Thermal review 3.產品之系統熱流或主板熱流設計 4.客戶對應、供應商及工廠溝通協調 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類,物理學類普通小型車,普通重機車

應徵人數|1-5 人

2024/03/26

〝Worked in thermal pad production > 2 years Able to understand various chemicals and relationship of those chemicals to improve the material /product performance in terms of reducing or increasing thermal conductivity Use polymer/ material science to identify those chemicals that can improve performances in removing/ reducing heat in electrical components Manage material test in Chemical Laboratory Identify equipment, create test standards, and register those standards in the company system. Develop materials to meet customer thermal pad application. English skill is required With strong initiative to develop new product. Know-how about Quality Management System/ISO Standard such as; ISO I9001, IATF 16949, ISO 14001, VDA 6.3 etc. Know-how about quality control to avoid any reject/defect of the product. Able to work under pressure and in minimal supervision.〝

應徵人數|1-5 人

2024/03/26

1.帶領研發團隊人員共同達成專案目標 2.協助機種Thermal review 3.NB產品之系統熱流或主板熱流設計 4.客戶對應、供應商及工廠溝通協調 ※依學經歷、工作年資敘薪機械工程學類,航太工程學類,物理學類

應徵人數|1-5 人

2024/03/26

1. Minimum of 2-year sales working experience in Thermal Pad 2. Understand the process, material, and various application of Thermal pad either silicone or non-silicone in automotive and non-automotive industry. 3. Able to make recommendation based on application to customer on what type of Thermal interphase materials are required and related specification. 4. Good communication & interpersonal skill and presentation skill 5. Ability to expand new customers.

應徵人數|1-5 人

2024/03/26

Summary/Objective: The successful candidate will be responsible for all mechanical and optical designrelated aspects of optical products including thermal and optical optimizations. Essential Functions/ Responsibilities: 1. Design and validation of all aspects of optical transceiver mechanical components and systems. 2. Opto-mechanical design of precision components. 3. Design of thermal components such as heat spreaders and heatsinks. 4. Work closely with Electrical and Process Design engineers. 5. Design for Manufacturing for transceiver assembly and component design. 6. Help with defining customer specifications related to mechanicals and thermals. 7. Vendor interaction for component specifications and first article inspections. “The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities” Required Experience: 1. 5+ years in transceiver or equivalent opto-mechanical industries. 2. Strong, proven technical design and validation skills 3. Strong attention to detail 4. Expert user of Solidworks 5. Experience with optical components and products 6. Demonstrated hands on experience supporting designs, processes, tooling and materials used in the industry. 7. Exceptional organizational and tracking skills 8. The candidate must be self-motivated with excellent verbal and written documentation skills, able to present design and data for peer review 9. Team player and able to build and maintain relationships both internal and external entities 10. Flexible to change and open to constructive feedback 11. Able to work independently with minimal supervision 12. Familiar with opto-mechanical and thermal design of transceiver components preferred機械工程學類,光電工程學類

應徵人數|1-5 人

2024/03/25

Focus on optical/thermal images captured by drones, research and develop machine learning or deep learning for image positioning, detection, identification, and analysis, such as bridge crack detection, traffic flow analysis, subtle obstacles Identify.電子工程學類,資訊工程學類,電機工程學類

應徵人數|1-5 人

2024/03/27

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4278&source=1111&tags=2024DomesticCampus_1111 Description: 1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era. 2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry. Job Description: 1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling. 2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking 3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect with focus on parallel processing and high-speed networking. Qualifications: 1. Solid skills build-up with hands-on operation. 2. Positions are reserved for those who have strong interest in emerging, exciting and disruptive technologies and for those who enjoys an intellectual-stimulating environment with work-life balance. Engineers and scientists from well-experienced to new in system integration and relevant fields are encouraged to apply. 3. Master’s degree or above in Science/Engineering related field with strong motivation to grow in new field 4. Senior position in system-level pathfinding, innovative heterogeneous system integration, and technology road-mapping 5. Project/team management experience for management position.電機工程學類

應徵人數|1-5 人

2024/03/25

1.筆電擴充基座(Docking Station)開發 2.電路設計(OrCAD)、驗證、除錯 3.PCB Layout review (Allegro) 4.對Thunderbolt, USB Type-C , HDMI, DP, 等產品研發有興趣或是具有經驗 5.與其他單位如ME, SW, Thermal, Safety協同合作 6.產品問題之分析處理。 7.主管交辦事項電機工程學類,電子工程學類普通小型車,普通重機車

應徵人數|1-5 人

2024/03/29

1. 提出系統層次的軟硬體競爭分析 2. 分析系統架構: 從系統效能/功耗/散熱面及跨不同軟/硬體模組 3. 研發次世代系統架構: 提出有競爭力且系統最佳化軟體演算法與軟硬體架構設計最佳方案 1. Propose competitive analysis of system-level SW/HW and applications 2. Research systemic issues from performance/power/thermal analysis cross software and hardware modules 3. Propose competitive analysis, near-optimal software algorithm, and/or hardware suggestion for next-generation system architecture電機工程學類,電子工程學類,資訊工程學類

應徵人數|1-5 人

2024/03/25

負責IPC之EC韌體設計 : 1. 執行產品韌體之撰寫,並維護量產產品。 2. 執行、協助或配合韌體新技術之研發、導入。 3. 配合完成HW/BIOS/Power/Thermal整體系統之韌體設計 4. 執行產品韌體測試。 5. 控制韌體開發進度、品質與成本。 ※依學經歷、工作年資敘薪電機工程學類,電子工程學類,資訊工程學類

應徵人數|1-5 人

2024/03/26

1. Thermal simulation 2. Thermal measurement (including thermal resistance Rthj-a, Rthj-b, Rthj-c and junction temperature)工程學門

應徵人數|1-5 人

2024/03/29

1. 負責新產品線及創新產品Thermal評估,及散熱驗證 2. 執行部門Leader交辦任務,完善專案報告 3. 跨專業合作,共同提供與完善各項對策與解決方案,協助相關單位定義標準 4. 審查與協助專案成員各項報告 5. 指導與培訓新人 6. 依據產品開發資料, 完成Thermal設計與設計報告 7. 散熱系統設計, 流場模擬分析與最佳化, 震動與噪音控制 8. 研究與開發散熱技術與材料並完成導入可行性驗證機械工程學類,物理學類

應徵人數|1-5 人

2024/03/25

1.NB/DT/POS產品設計的方案建議以及研討。 2.硬體零件挑選以及線路 Review。 3.進行Layout Placement and Traces Routing review。 4.需跨單位(如 Power/ME/RF/Thermal..)進行專業溝通以及合作。 5.新機種的RFQ proposal規劃以及報告。電機工程學類,電子工程學類,資訊工程學類

應徵人數|1-5 人

2024/03/25

1. 根據專案規格, 制訂測試計劃與執行 2. 電子與電源硬體功能驗證測試、分析與製作測試報告 3. 環境可靠度實驗執行、分析與製作測試報告 4. 與開發端設計者如EE、Power、Thermal等合作, 驗證與解決設計問題 5. 參與專案開發會議與整合測試部門進度與報告 6. 回報測試進度與提供報告給客戶電機工程學類,電子工程學類,資訊工程學類

應徵人數|1-5 人

2024/03/25

1.執行新產品開發系統散熱設計、開發與驗證熱解決方案 2.熟悉CFD模擬、系統溫度驗證分析及Thermal issue問題解決與提供熱解決對策提案 3.熱流分析設計. 產品設計檢討. 散熱元件開模檢討. 4.設計分析驗證與技術資料建立. 熱固耦合分析專案執行 5.材料特性測試. FACA 問題分析與DOE規劃. 改善專案執行機械工程學類

應徵人數|1-5 人

2024/03/07

1.執行新產品開發系統散熱設計、開發與驗證熱解決方案 2.熟悉CFD模擬、系統溫度驗證分析及Thermal issue問題解決與提供熱解決對策提案 3.熱流分析設計. 產品設計檢討. 散熱元件開模檢討. 4.設計分析驗證與技術資料建立. 熱固耦合分析專案執行 5.材料特性測試. FACA 問題分析與DOE規劃. 改善專案執行機械工程學類

應徵人數|1-5 人

2024/03/25

1. 負責EE工作進行Docking Station產品電路設計 2. USB, DP, Type-C, HDMI, Ethernet等介面等產品線路設計, PCB Layout設計檢討. 3. 協調其他單位如ME, SW, Thermal, Safety一起澄清並解決設計問題 4. 規劃產品設計架構, 並選定Key Parts 5. 回覆客戶RFQ並與客戶直接面對面討論產品設計與問題電機工程學類,電子工程學類

應徵人數|1-5 人

2024/03/28

1. 具備3D CAD繪圖能力。(會使用Autodesk Inventor軟體者尤佳。) 2. 使用ANSYS軟體進行公司產品CAE分析,包括靜態結構分析(Static structure)及熱分析(Steady-state thermal & Transient thermal)領域。 3. 可協助執行新產品開發與現行產品改善專案任務: 3.1. 產品設計,如:技術資料搜尋、工程規格開立、新零件詢商及產品3D模型建立。 3.2. 產品驗證,如:建立測試計畫、執行測試驗證作業及撰寫測試報告。 3.3. 專案管制,如:建立負責專案時程管制、新產品開發進度管制及跨部門工作協調。機械工程學類,航太工程學類Acrobat,MOS:Microsoft Office Word,MOS:Microsoft Office Excel,MOS:Microsoft Office Powerpoint,MOS:Microsoft Office Outlook

應徵人數|1-5 人

2024/03/29

1. Electrical package warpage and component stress simulation and analysis (FBGA, FCBGA, FOWLP, FOPLP, 3D IC CIS CSP, TSOP, QFN, QFP......). 2. Electrical package thermal simulation and analysis (JESD51 standard). 3. Electrical package mold flow and wire sweep simulation and analysis. 4. Board level drop test experiment and analysis (JESD22-B111 standard). 5. Warpage measurement by shadow moire (JESD22-B112 standard). 6. Database establishment and utility development. 7. New simulation capability development. *實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 *資深人員薪資另議。工程學門

應徵人數|1-5 人

2024/03/24

1. X86主機板電路設計,問題分析與解決。 2. DIN-rail 系統架構之專板設計開發,Thermal整合能力與機構協調合作。 3. 解決客戶技術問題,及客製衍生品處理。 4. 需有獨立執行產品設計完整專案經驗,RFQ可獨立評估處理。 *彈性工作時間,薪優福利佳,並備有新店/中和線交通車*電機工程學類,電子工程學類

應徵人數|1-5 人

2024/03/26

1.System viewpoint, thermal design, thermal analysis and thermal simulation 2.Thermal and Acoustic test and solution approval 3. Good Communication with Customer/BU/factory/vendors 4. System thermal verification 5. System performance tuning

應徵人數|1-5 人

2024/03/28

1. Project thermal simulation, thermal measurement. 2. Lead team member finishing thermal relative design. 3. Study for advanced thermal solution.機械工程學類,河海及船舶工程學類,航太工程學類

應徵人數|1-5 人

2024/03/27

1. Thermal/ acoustics debug and test. 2. Thermal simulation.航太工程學類,機械工程學類

應徵人數|1-5 人

2024/03/27

CVD,thermal spray鍍膜製程、膜層材料檢測分析,以及相關研究計畫與技術開發之工作化學工程學類,材料工程學類,其他工程學類

應徵人數|1-5 人

2024/03/28

1.Thermal test 、 數據資料分析 2.包含NB/DT/AIO 系統散熱及噪音測試 3.具研發設計、3D電腦繪圖經驗尤佳 4.具耐心並對NB/DT/AIO溫度量測有興趣者佳

應徵人數|1-5 人

2024/03/24