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    • 聲光學硬體理級主管能外派

      台北市南港區|月薪面議(經常性薪資四萬(含)以上)
      月薪面議(經常性薪資四萬(含)以上)|5年工作經驗以上|大學

      聲光學硬體理級主管  

      1.As a Hardware Manager in Compal of Nanjing, you’ll be engaged in active development of companies audio/optical cutting edge technology for products, involved in advanced and challenging embedded and consumer audio/optical products.  

       

      2.The role will also require working with company internal software engineering as well as company customers/partners.  

      3.In this position you will be responsible for leading the development, design and project management and also work “hands-on”  

       

      4Experience in Embedded processor based product.  

       

      5.Advantage for Qualcomm/MTK/Intel based product development experience.  

      6.Some level of knowledge of working with Android/Linux operating system.  

      7.Deep understanding of High Speed Board design concepts.  

      8.Deep understanding of EMC.  

      9.Experience in Acoustic Design/Requirements for mobile phone.  

      10.Experience in Camera Image Quality tuning.  

      11.Experience in Display/Touch Panel Design.  

      12.Experience with Product Mass Deployment.  

      13.Wide system level understanding.  

      14.Independent, strong self-learning and self-management skills.  

      15.Experience with customer engagement.  

      展開收合
      2018-12-10
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    • Project Management Leader經理/處長能外派

      台北市南港區|月薪面議(經常性薪資四萬(含)以上)
      月薪面議(經常性薪資四萬(含)以上)|6年工作經驗以上|大學

      Project Management Leader經理/處長  

       

      1. 掌握成員工作進度並且適時分配  

      2. 掌握專案進度, 參與重要會議, 面對客戶主要窗口  

      3. 適時處理重大事件並回報主管  

      4. 每週專案進度報告update

      展開收合
      2018-12-10
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    • Telematics RD Head技術經理~處長

      台北市南港區|月薪面議(經常性薪資四萬(含)以上)
      月薪面議(經常性薪資四萬(含)以上)|5年工作經驗以上|大學

      Telematics RD Head技術經理~處長  

      台北  

      1Lead Telematics product development engineering team,and build up team  

      2.Realize product development according to product roadmap and/or customer's requirement  

      3.Technology roadmap planning and realization  

      4.Support Product Manager and Sales/Marketing Team for product roadmap scoping  

      5.Co-work with 3rd party design house for outsourced design  

      6.Support global sales and business manager to promote Telematics product  

      1.碩士以上EE相關科系  

      2.Have more than 20years experience in  

      Embedded system development  

      Familiar with WWAN and WiFi technology  

      3.Experience in leading product development team  

      4..Experience in automotive electronics will be a plus

      展開收合
      2018-12-10
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    • Visual Product Devices產品工程主管能外派

      台北市南港區|月薪面議(經常性薪資四萬(含)以上)
      月薪面議(經常性薪資四萬(含)以上)|8年工作經驗以上|大學

      Visual Product Devices產品工程主管能外派  

      10年以上EMS廠 產品工程相關工作經驗  

      5年以上主管經驗  

      TOEIC 730 above  

      1. 部門工作規劃, 績效指標訂定及管理.  

      2. 新產品導入及量產品維護與管理.  

      3. 工程資料確認及維護.  

      4. 跨部門工作推動與協調.  

      5. 推動降低生產製造成本.  

      6. 檢討簡化產品生產作業流程及作業工時的合理化, 以提升競爭力.  

      7. 定期拜訪客戶及維持良好溝通與互動.  

      8. 新客戶開發.  

      9. 工作流程檢討及改善.  

      10. 人員培養及強化

      展開收合
      2018-12-10
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    • Wireless Product工程經理以上能外派

      台北市南港區|月薪面議(經常性薪資四萬(含)以上)
      月薪面議(經常性薪資四萬(含)以上)|6年工作經驗以上|大學

      Wireless Product工程經理以上  

      G9經理以上經歷條件  

      1. Factory PE,TE,FA Experience 10Y+, well know PE,TE,FA integration.  

      2. English Communication skill (TOEIC 650+), Capable to discuss with the customer.  

      3. Well Leadership to handle the Engineering Team (50 Headcount) is Plus.  

      4. EE Background and RF Product Knowledge is Plus.  

      Well Leadership to handle Test Eng. Team, product engineering team, failure  

      Analysis team, and testing team  

      展開收合
      2018-12-10
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