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  • Software Architect_知名通訊設備公司 (3006171)

    新竹市東區|面議(經常性薪資4萬/月含以上)
    面議(經常性薪資4萬/月含以上)|8年工作經驗以上|大學、碩士、博士

    職責要求 

    • Architect for embedded development LINUX platform for easily adapt to different chipset SDK and add-on feature development 

    • Actively seek a way to enhance the existing software infrastructure, debugging methodology and mentoring team member 

    • Continues and constant customer-oriented activities of requirements and design level. 

    • Performing feasibility studies of new technologies and software packages; including developing prototype code for proof-of-concept when needed. 

    • Accompanying the SW development process and providing technical leadership. 

     

    任職資格 

    • Bachelor degree and above in Computer science, EE or related fields. Master degree is preferred 

    • 8+ year experience of software development in embedded Linux/C 

    • Hand-on Experience of Linux kernel / driver / data packet flow and capable of using tool in debugging the system level issue 

    • Proven experience as software architect for developing a common embedded platforms for broadband products 

    • Troubleshoot coding problems quickly and efficiently to ensure a productive workplace 

    • In-depth of understanding the software development process and actively seek a way to improve software development process to shorten the development cycle and improve software quality 

    • Strong communication skills, both written and verbal is a plus

    展開收合
    2022-04-07
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  • 新竹-AOI工程師_知名光電公司 (3006135)

    新竹市東區|面議(經常性薪資4萬/月含以上)
    面議(經常性薪資4萬/月含以上)|經驗不拘|碩士、博士

    職責要求 

    1. 光學模組軟體整合及影像資料串接。 

    2. 光學模組參數校正及補償演算法開發。 

    3. AOI機器視覺檢測及量測演算法開發。 

     

    任職資格 

    1. 熟悉C#物件導向程式設計。 

    2. 熟悉OpenCV、Halcon或其他機器視覺軟體。 

    3. 熟悉WPF和WinForm開發尤佳。 

    4. 研究所資訊/電機/電子工程相關科系畢業。


    要求條件
    • 資訊科學學門,電子工程學類,電機工程學類 相關科系
    展開收合
    2022-04-07
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  • Senior Engineer - Software (Wireless)_知名半導體公司 (3005680)

    新竹市東區|面議(經常性薪資4萬/月含以上)
    面議(經常性薪資4萬/月含以上)|經驗不拘|碩士、博士

    職責要求 

    • Bluetooth LE firmware development under embedded RTOS platform. 

    • Bluetooth LE Link Layer Protocol development, performance optimization and troubleshooting. 

     

    任職資格 

    • Familiar with C Programming Skill 

    • Familiar with Bluetooth LE Protocol spec. 

    • Familiar with Embedded SoC and RTOS architecture. 

    • Familiar with ARM Cortex / MIPS is good. 

    • Experienced in Bluetooth LE software development. 

    • Experienced in embedded MCU software development. 

    • Experienced in Bluetooth LE embedded application development. 

    • Master‘s degree: Computer Science and Information Engineering/ Communication Engineering related

    展開收合
    2022-04-07
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