系統分析工程師

1.光罩資料統合彙整檢查and Mask tape out 

2.Mask CD量測文件製作. 

3.光罩規格訂定. 

4.光罩系統的優化改善. 

5.Linux工作環境操作。 

『具工作經驗者，薪資另議』

1.半導體晶圓TF薄膜製程開發值班工程師。 

2.需配合日夜值班工作。 

3.理工相關科系，有經驗者佳。 

『具工作經驗者，薪資另議』

1. DRAM RMT分析整理 

2. DRAM高速訊號量測與分析 

3. DRAM相關失效分析 

『具工作經驗者，薪資另議』

1. 分析可靠度問題，並進行改善。 

2. 負責試產、量產時的產品異常分析與良率改善。 

3. 負責新產品導入及產品良率改善。 

4. 制定合適的IC測試計劃，以降低量產測試成本提高良率。 

5. 撰寫、修改以及維護晶片測試（CP）、最終測試（FT）等測試程式。 

6. 驗證產品正確性與效能，並進行特性與電性的分析。

1.晶圓轉運出貨目標之達成 

2.晶圓裝箱打包、堆高機運送執行 

3.晶圓出貨與達交，及作業改善 

『具工作經驗者，薪資另議』

R&D Pilot Line Fab 

• Updating the Fab engineers on customer issues and technology needs. 

• Supporting root cause defect and unique fail mode analysis. 

Process Integration 

• Delivering advanced technology to meet future product nodes. 

• Developing recipes to meet structural & electrical requirements. 

• Managing wafers though Wet&Dry etch levels in support of special requirements. 

Other Process Areas 

• Working in cross-functional teams to jointly develop device structures. 

• Supporting cross-functional failure analysis and yield improvement. 

Wet or Dry Etch peers 

• Maintaining or developing expertise in multiple process, hardware, or technology areas. 

• Serving as a resource for peers in recipe & process development. 

Qualifications:  

• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena 

• Solid trouble shooting, experimental design and data analysis skills 

• Strong computer skills, including MS Office 

• Basic understanding of wet process /plasma etching 

• Understanding in the principles of wet etch or dry etch processing 

• Rudimentary understanding of process control and Statistical Process Control (SPC) 

Education/Experience:  

BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 

『具工作經驗者，薪資另議』

1. 製程變更會議召開/協調,變更案件預審核, 案件風險管控 

2. 新產品EDA參數設定 (Process flow 參數設定/修改/檢查) 

3. 製程變更工程資料審核/導入 (Process change review/record)

1.電性測試機台操作與recipe設定 

2.量測程式編寫 

3.機台硬體維護與異常排除 

4.Probe card 維護與管理 

5.物料採購管理作業與工程案管制作業 

6.量測異常分析與排除 

『具工作經驗者，薪資另議』

1. 低功率行動型記憶體開發  

2. 新測試覆蓋率程式開發  

3. 新產品電性及物性除錯分析 

『具工作經驗者，薪資另議』

1. 負責研發/生產線運作相關參數設定 (半導體工廠run貨相關參數設定) 

2. 新產品流程參數設定 (Process flow 設定/修改/檢查) 

3. 製程變更資料處理 (Process change recipe/tool/SPC etc.設定)

1. 生產線上異常產品之處理 

2. 協助工程實驗排run 

3. Handle生產線異常機台status 

4. 生產線異常機台復機lot handling 

5. 薄膜新機台驗機及製程管理 

6. 薄膜製程規範編撰建立 

7. 製程改善及良率提升 

8. 製程配方調整及最佳化 

9. 維護產品製程品質及穩定度 

『具工作經驗者，薪資另議』

(1) Advantest機台操作與測試 

(2) Verigy機台操作與測試 

(3) Unitest機台操作與測試 

(4)協助實驗室各種IC/DIMM Module測試 

(5)簡易的平台(NB/MB/Server/手機/平板)故障排除 

(6)主管交辦事項 

『具工作經驗者，薪資另議』

DRAM數位邏輯電路設計 

『具工作經驗者，薪資另議』

1.新產品記憶體晶圓測試程式設計與開發 

2.記憶體功能分析驗證 

3.測試良率異常分析與問題解決及電性測試分析 

『具工作經驗者，薪資另議』

1. DRAM記憶體系統驗證除錯. 

2. DRAM component/U-DIMM/SO-DIMM/R-DIMM量產導入驗證. 

3. 記憶體驗證 - 取得Intel/AMD AVL認證. 

4. DRAM示波器及邏輯分析儀量測. 

5. DIMM module零件評估/BOM表建立

1. 產品系統分析 

2. 產品分析失敗資料統整 

3. 產品分析跨部分溝通與跟催 

4. 客訴案件報告整理 

『具工作經驗者，薪資另議』

1. 客製與代工客戶工程服務支援 

2. Customer engagement, market survey, business model establishment. 

3. Alignment and resource allocation with TD/Design/PD and other related dept. 

『具工作經驗者，薪資另議』

1. 新產品開發驗證、除錯及測試。 

2. 電子電路設計及韌體程式設計。 

3. 跨部門合作、鑑定、確認及解決相關研發的問題。 

[如具相關工作經驗, 薪資另議]

1. 元件2D/3D TCAD模擬 

2. 3D元件結構模擬 (Process Explorer) 

3. 2D/3D電阻電容萃取 

4. DRAM元件電性分析 

5. New Memory研究

R&D Pilot Line Fab 

• Updating the Fab engineers on customer issues and technology needs. 

• Supporting root cause defect and unique fail mode analysis. 

Process Integration 

• Delivering advanced technology to meet future product nodes. 

• Developing recipes to meet structural & electrical requirements. 

• Managing wafers though Wet&Dry etch levels in support of special requirements. 

Other Process Areas 

• Working in cross-functional teams to jointly develop device structures. 

• Supporting cross-functional failure analysis and yield improvement. 

Wet or Dry Etch peers 

• Maintaining or developing expertise in multiple process, hardware, or technology areas. 

• Serving as a resource for peers in recipe & process development. 

Qualifications:  

• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena 

• Solid trouble shooting, experimental design and data analysis skills 

• Strong computer skills, including MS Office 

• Basic understanding of wet process /plasma etching 

• Understanding in the principles of wet etch or dry etch processing 

• Rudimentary understanding of process control and Statistical Process Control (SPC) 

Education/Experience:  

MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 

『具工作經驗者，薪資另議』