產品測試工程經理_IC封裝代工大廠 (3009278)

1.封裝工程驗證 

2.封裝製程條件設定

1、新產品導入與測試環境建立。 

2、提供客戶與外單位測試工程技術支援。 

3、有半導體測試廠TE經驗者尤佳。

【本職缺僅接受台積電官方網站投遞】  

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=4672&source=1111  

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Responsibilities: 

1. Define advanced testing hardware technology architecture. 

2. Create world-class method and role model tech structured problem solving. 

3. Conduct advanced electrical/mechanical/thermal analysis and PI/SI improvement. 

4. Be a focal contact between customer and tsmc testing for test validation and release to production. 

5. Exhibit good and open communication skills, be able to work within cross-functional teams. 

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.執行異常貨批Remote需求 

2.暫扣電性報告製作 

3.執行客戶暫扣批處置指令 

4.Online異常排除 

5.其他上級交辦事項

1.零件燒錄，不需搬重物、不需久站，無工作經驗可。 

2.上下料加工生產 

3.分裝操作、線上包裝作業

1. Performing reliability testing including Mechanical, Environmental, IPX and chemistry tests...etc. 

2. Reliability test equipment customs clearance, setup, calibration, maintenance and test data analysis 

3. Arranging technician to perform every reliability tests, track the test schedule, collect the test datas and compose test report. 

4. Providing reliability test report and highlight reliability test issues 

5. Optimizing the reliability test methods and test specifications 

6. Training on testing skills and ensure the SOP has been followed strictly; 

7. Follow-up and push-up with the test to meet the schedule;

【職務說明】 

1.產品維護及管理  

2.測試效率提升 

3.產品異常分析 

4.國內外客戶稽核(Con-call、實體、帶線) 

5.單位稽核文件撰寫修改、系統品質建立提升 

6.對外異常報告撰寫 

7.內部作業稽核改善 

【薪資說明】 

◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。

英業達近年進攻各種 AI 邊緣運算應用領域，我們是英業達 AI 晶片設計研發團隊，具備多年 AI 與 Processor IC 設計經驗，現正積極投入類神經網路加速器 IP 研發。 

我們主要工作為應用 Verilog 與 Python，導入來自國際知名 GPU 公司的設計觀念，開發極具競爭力的 AI processor IP，建立完整的 Hardware / Software Co-sim 的環境，所有軟硬體皆 in-house 獨立自主研發，2023 年推出已被數家台灣知名上市 IC 設計公司採用，市場需求踴躍；2024年也於兩家上市 IC 設計公司的 AI 高整合晶片達到 First Cut Work 目標，並通過系統性驗證。現正積極擴大招募新血，歡迎對 IC 設計、CPU 開發、AI 加速器開發有熱誠的朋友加入！ 

主要工作內容如下： 

1. Design test plan (inclding identify and write all types of coverage measures for stimulus and corner-cases.) 

2. Creating verification plans to test/verify our AI acceleration IP or testchip. 

3. Test automation to improve the validation flow. 

4. Porting embedded system and linux system test patterns.

1.負責熱像感測器測試方法(晶圓級測試或產品測試)開發。  

2.測試系統整合控制軟體開發。  

3.測試系統韌體開發。

工作項目： 

1. 新封裝型態導入&可行性評估/驗證。 

2. 封裝線圖確認及管理。 

3. 封裝工程品驗證及時程跟催。 

4. 封裝 品質 & KPI 持續性改善。 

5. 封裝廠稽核。 

6. RMA/8D報告審查及相關改善措施成效確認。 

7. 客戶問卷填寫及匯整。 

應徵條件： 

1. 具5年以上封裝廠製程/產品工程相關經驗。

1.產品分析。 

2.新產品，新客戶程式開發及流程導入。 

3.新設備軟硬體需求評估。 

4.具測試廠測試程式開發經驗尤佳。

1、產品分析報告 

2、新產品導入 

3、測試程式撰寫、維護 

4、異常分析及處理 

5、良率改善 

6、報表製作及工程分析

1.執行 & 配合公司晶圓技術研發, 規劃先進之Au Bumping, COF/COG/COP & DPS 封裝技術, 負責產品 turnkey & shuttle 生產工程支援與異常改善，以確保生產品質與生產順暢, 專案及技術藍圖與負責之各項事務。 

2.執行 Au Bump & COF/COG/COP, DPS / shuttle 專案及藍圖 

3.與 OSATs 進行Au Bump & COF/COG/COP, DPS / shuttle 技術之討論 

4.負責Au bump & COF/COG/COP, DPS / shuttle 失效分析與改善 

5.研發與蒐集先進封裝技術

1. 各種產品類型之封裝設計及規畫。  

2. BGA substrate設計及佈局。  

3. 與封裝廠合作，完成封裝圖面設計。  

4. 先進封裝技術之開發。  

5. 封裝設計平台之開發。

工作地點:桃園市中壢區中園路188號 

工程師助理技術員 

工作職缺說明▶ 

1. 無塵室機台操作 2. 系統操作  

3. 具備基本作業能力、刻苦耐勞,細心 4.可負重 (約15~20KG)  

休假制度▶二休二 (先日班3~6個月會安排輪班) 

上班時間▶ (先日班3~6個月會安排輪班) 

日班07:30~19:40 

夜班19:30~07:40 

二休二 (依照單位發績效獎金) 

日班薪資▶32,925 ~ 37,025 

夜班薪資▶40,775 ~ 44,875 

三休一 (約休9~10天) 

日班薪資▶41,145 ~ 46,265 

夜班薪資▶50,945 ~ 56,065 

《任職滿6個月再領期滿獎金共計14,000元》 

✨請投履歷or截圖+賴優先安排唷 (請LINE為主，手機撥打為輔) ✨ 

☑️【電洽☎0266050629，找Tina面試】  

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