台灣半導體研究中心-(114-021)半導體製程技術人員_微影光罩組

1.蝕刻先進製程開發,熟悉實驗流程(實驗、評價解析、方案報告) 

2.協同客戶導入新裝置製程及新技術開發。 

3.維持現有Process Of Record及Trouble-shooting解決問題的能力。 

4.具良好溝通能力,理解客戶需求及跨部門有效溝通。

我們需要對支援生產各項事宜有熱情的夥伴,，共同完成下列工作： 

1. MES作業系統改善規劃  

2. 跨系統作業自動化改善規劃 

3. 生產相關報表規劃 

4. 相關系統設備採購與管理 

5. KM、 提案改善執行 

6. 人工作業系統化 

7. 產線稽核 

8. 料帳相關事務處理 

薪資將依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘 

期待您的加入！！！

工作項目： 

先進製程平台整合與管理、元件設計開發、FA及可靠度分析 

應徵條件： 

1. 碩士以上，電機工程、電子工程、物理、材料、化學、光電等相關科系畢業者為佳 

2. 具4年以上先進製程平台整合，有7nm~2nm FinFET/Nanosheet先進製程/元件技術相關經驗者為佳

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 

Responsibilities: 

1. Advanced panel level packaging development for CoPoS technology. 

2. Exploratory panel level packaging process/material/tool development for new applications. 

3. Process stability/manufacturability improvement for yield and reliability qualification. 

4. Responsible for transferring the process/material/tool for mass production. 

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. 產品測試資料報告整理 

2. 產品 FAILURE 分析 

3. 製程改善分析

1.設備裝機支援。  

2.新竹、台中及台南據點支援。  

3.半導體化學研磨機設備售後服務及客訴處理。  

4.設備機台裝機及機台故障問題處理。  

5.需在無塵室作業。  

6.需值班on-call。  

※錄取後須先在湖口進行1-3個月的教育訓練。 

※教育訓練結束後視情況可能會先行安排至新竹或台南支援，之後才回高雄。 

※需具備TOEIC 450以上或日語檢定N4以上。

1.Perform various product and technology development tasks, analyze problems and handle exceptions. 

2.Responsible for managing the process flow and parameters of products. 

3.Material and product failure analysis 

4.Improve component characteristics and increase product yield. 

5.Self training & cross training

1. Has Electrical Failure Analysis experience. 

2. Operate measurement and analyzer. 

3. Equipment Installation and Maintenance. 

4. Provide Technical Consult to Sales. 

5. Application Engineering 

*物理、電子物理、材料、電機、電子大學畢業相關科系者。 

*需駐點(台南)

1.FAB巡檢/點檢 

2.單位稽核協助 

3.客戶稽核陪同人員 & 稽核異常時準備相關回覆資訊 

3.標準作業流程新增或修改與撰寫教育訓練報告及宣導 

4.設備相關文件改版作 

5.與量測工具送校管理與防護用具使用及管理 

6.製程工程部 & 製造部 & 品質工程部 & 技術開發部專案協助完成目標 

7.消耗品領用控管與設備各課使用消耗品申請發放 

8.TCS人員授證系統 

9. PTI 新系統導入部門作業 

10. 年度預算規劃 

11.WLPEE 機台節能計畫相關數據計算 & 執行

1.開發、實施和維護RPA解決方案，自動化重複性任務和流程。 

2.分析業務流程，識別自動化機會，設計高效的RPA工作流程。 

3.跨部門合作，收集需求，確保RPA解決方案符合業務需求。 

4.配置RPA軟體機器人，進行測試以優化性能和可靠性。 

5.監控RPA流程，解決問題，提供及時支援，確保運作順暢。 

6.為知識共享和培訓記錄RPA工作流程、配置和維護程序。 

▶▶▶期間限定大放送◀◀◀ 

✅ 新人獎金最高 NT$47,000 

加入景碩，立刻獲得肯定! 

✅新人績優留任獎金最高 NT$180,000 

努力不會被忽視，表現越好，獎金越豐厚! 

✅ 介紹獎金最高 NT$60,000 

邀請好友一起共享雙倍獎金!

1.展機 - 展機失敗調查 / 處置 

2.Process alarm & M/C alarm- Process與M/C alarm調查 / 診斷 / 處置 

3. 製程能力提升- 製程能力提升 Fan out (參數 / 機台 / Tooling)

運用製程設備專業知識及統計分析手法針對工廠設備相關資料(FDC,Inline monitor..)加以解析，進而達到降低機台異常，改善機台能力，增加工廠生產效率 

及成本降低 

異常問題解析 

專案領導及協調 

當責性 

創新分析方法

1.微波加熱技術開發。 

2.半導體微波退火技術開發。 

3.電磁波加熱技術開發。 

4.微波加熱設備模擬、設計、製造及開發。

1.科系：碩士以上，理工相關系所(資管/科管/工業工程系畢業尤佳)。 

2.班制：常日班。 

3.工作內容： 

3.1 Support 3rd party account manager on handling 3rd party IP tapeout, IP database maintain in project and IP system. 

3.2 Coordinate 3Rd party IP license request between 3rd party IP vendor and VIS. 

3.3 Maintain customer request status after receiving request from VIS sales side. 

4.說明： 

(1)請於履歷表中註明論文主題(方向)及所學專長。 

(2)請檢附學士(含)以上之成績單。

1.新製程機台保養技術導入.2.設備規範建立與維護.3.設備異常處理,設備保養維修系統建立&執行.4.保養料件收送及維修5.需配合輪班

1. 負責Hybrid Bonding前後段製程整合，建立並優化整體製程流程。 

2. 協調前段晶圓製程 (FEOL) 與後段封裝製程 (BEOL) 的技術需求，確保製程無縫銜接及性能最佳化。 

3. 分析並解決製程整合中出現的問題，提出改善計畫，確保量產穩定性及良率提升。 

4. 支援製程開發中的跨部門合作，協調設計、製程、封裝與測試團隊，推動技術整合與創新。 

5. 開發並實施製程可靠性分析及故障模式研究，確保製程符合品質與可靠性要求。 

6. 撰寫製程技術規格書及整合報告，提供技術支持並推動製程最佳化改進。 

7. 評估並導入新材料、新技術或新設備以支援製程整合需求。

1. 執行光阻測試，包括光阻塗佈、曝光、顯影及參數調整，確保新型光阻材料符合製程需求。 

2. 收集與分析光阻材料的關鍵參數（如臨界尺寸控制、均勻性、感光特性等），提供材料適用性評估報告。 

3. 其他主管交辦事項。

1.製程問題解決與分析 

2.良率改善 

3.專案改善規劃、執行(cost down, productivity) 

4. 客戶需求溝通

Job Summary 

AOI is looking for a VCSEL Chip Product Engineer who will be responsible for VCSEL mask layout, process, and test procedure, tracking the operation process of chip products, optimizing the production process and operation process. This role is also responsible for assisting in the failure analysis of related products, and coordinate resource design DOE to confirm the source of abnormalities to help improve product quality. This position will report to the AVP of the R&D VCSEL department. 

Responsibilities 

Responsible for VCSEL chip design, mainly responsible for mask layout, process, test procedure, wafer qual and BI procedure, etc 

Track the operation process of chip products, optimize the production process and operation process 

Responsible for tracking the abnormality of the chip process, summarizing and analyzing the root cause of the abnormality, and recommending corrective measures 

Responsible for R&D-related data analysis, feedback information to help optimize product design and manufacturing process, and improve product performance and yield 

Assist in the failure analysis of related products, and coordinate resource design DOE to confirm the source of abnormalities to help improve product quality 

Prepare production work instructions and production process documents, implement the implementation of corresponding specifications and give regular feedback 

Qualifications 

Bachelor degree or above, or recent PhD graduate, major in optoelectronics, semiconductor materials, physics and other related majors. 

Familiar with the principle of semiconductor devices, the basic principles of laser chips (VCSEL, EEL, etc.), understand the basic fab process and related test parameters 

Strong data analysis ability, proficient in using one or more of Excel, JMP, Minitab, AutoCAD and other software is preferred 

Python, VB, Matlab programming skills are preferred 

Good learning ability, team spirit, communication and coordination skills

1.Physical design RC extraction flow development and build up. 

2.EDA collaboration to enhance RC extraction methodology 

3.FOM RC analysis to propose DTCO opportunities