全職
大學、碩士
面議（經常性薪資達 4 萬元或以上）
1.Own end-to-end RF module/SIP development to bring products from concept to mass production
2.Responsible for module/SIP technology selection, part selection, vendor evaluation, and perform cost/technology/performance analysis
3.Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing
4.Perform simulation analysis (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs
5.Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level
6.Evaluate new advanced packaging technology, including design and validate prototypes
法定項目：
福利制度：
更多說明：
注意！福利項⽬可能依不同職缺有所不同，實際職缺福利請依⾯試時與公司⾯談結果為準
查看薪資水平
