職缺描述
1.Own end-to-end RF module/SIP development to bring products from concept to mass production 2.Responsible for module/SIP technology selection, part selection, vendor evaluation, and perform cost/technology/performance analysis 3.Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing 4.Perform simulation analysis (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs 5.Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level 6.Evaluate new advanced packaging technology, including design and validate prototypes
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