職缺描述
★馬來西亞‧檳城儲備 召集令★ 馬來西亞‧檳城，我們來了！ 全球最大金凸塊封裝測試廠 -頎邦科技-即將在馬來西亞‧檳城設廠！ 廣召願意於馬來西亞發展的夥伴們一起迎向未來，共創幸福感與成就感的生命共同體！ ● 如果您是擁有滿腔熱誠or具備深厚產業技術＆積極尋求海外發展機會的技術人才 ● 如果您是長年客居台灣＆累積札實產業技能＆期望赴馬（返馬）發展的海外人才 ● 如果您是（即將）完成在台學業＆對科技業有興趣＆希望回國發揮 不用遲疑，快速投遞履歷，掌握發展舞台，就是現在！ 【職缺類別】生產製造、設備、製程、產品、整合、品保、生管、IE、IT、自動化工程、廠務、財務、會計、人資(招募尤佳) 【工作班制】常日班（08:30-17:30）、輪班（07:20-19:20／19:20-07:20） 【台灣地點】新竹工業園區／新竹科學園區 【馬來西亞】檳城，須配合工作需求先於台灣受訓後，依時程派駐馬來西亞。 –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ★Malaysia Talents Recruiting★ Chipbond Technology is coming to Malaysia ‧ Penang! As the world‘s largest gold bump packaging and testing corporation, we are looking for talented partners to be part of our exciting journey! WE WANT YOU IF ● Taiwanese Professionals: You are a skilled technical professional with solid industry knowledge and experience, eager for new opportunities abroad. ● International Talents: You lived in Taiwan for several years, accumulated solid industry knowledge and experience, seeking career growth in Malaysia. ● Malaysian Students: You are a Malaysian student about to complete your studies in Taiwan, passionate about technology, and want to return to Malaysia. Submit Your Resume Now and Join Chipbond! 【Job Category】 Manufacture, Equipment, Process, Product, Quality Assurance, Production Management, Industrial Engineering, Information Technology, Automation Engineering, Facility, Financial Accounting, HR Recruiter 【Work Schedule】Day-time (08:30-17:30), Shift (07:20-19:20 / 19:20-07:20) 【Taiwan Work Location】 Hsinchu Industrial Park / Hsinchu Science Park 【Malaysia Work Location】Penang. Training in Taiwan is required before expatriation to Malaysia based on work schedule.
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