醫療產品韌體開發高工到副理級

大學以上電子/電機/醫工/資工系所畢, 5 年以上C、C++ / Keil C或embedded platform, Linux system開發經驗,具MCU/DSP/FPGA韌體設計撰寫能力,良好溝通技巧。 

工作內容 

醫療產品開發處負責專案除醫療產品外， 亦包括更廣泛的領域， 

如：AI、IOT、健康、運動、休閒、娛樂等智慧裝置 

韌體開發部門主要任務有： 

1. System building, including OS (Linux, RTOS) and nonOS platform 2. Bootloader, kernel, OTA mechanism 3. Driver programming and integration 4. System configuration and performance turning 5. Algorithm development and optimization 6. Protocol definition and development 7. Test tool development and maintenance 

使用技術包括： 

1. MCU: ST, MTK, Nordic, Nuvoton, TI, NXP, microchip, … 2. Communication: BLE, WIFI, Ethernet, NFC, RFID, … 3. Sensor: IMU sensor, pressure sensor, flow sensor, light sensor, thermal sensor, Humidity sensor ,ECG, PPG, … 4. others: IIC, SPI, RS-232, RS-485, ADC, PWM, LCM, USB, SD, switch, security, BLDC, RTC, timer, DMA, WDT, flash, … 

所需人力條件： 

1. 具single chip embedded system coding 2年以上經驗 

2. 熟悉OS以及開發環境/工具 

3. 具Driver coding and system configuration能力 

4. 具基本硬體能力,能了解電路圖 

5. 具通訊及感測器開發經驗者佳 

6. 具醫療產品相關開發經驗及撰寫過確效文件者佳 

7. 會撰寫android or windows program者佳