1.Working with customers & manufacturing teams on NPI execution, from technical risks assessment, DFM, qualification to product launch.
2.Develop new package and process qualification programs for integrated circuit assembly /packaging and EMS/PCB/SMT. Define DOEs for new material selection, risk assessment, process optimization to meet thermal, mechanical, and electrical requirements
3.Troubleshooting qualification and field related failures utilizing various destructive and non-destructive analysis tools such as x-ray, SAT, cross section, SEM, FTIR, etc.
4.Collaborate with R&D groups for new technology development and promotion.
5.Working with cross functional teams on NPI execution.