366筆
1.協助現場主管交辦事宜 2.維護現場環境秩序及協助調機/製程工程進行 3.需著無塵服於廠內進行工作 4.可配合輪班制 5.需配合外派出差.時間/地點依公司規定機械工程學類,電子工程學類,電機工程學類
應徵人數|0-10 人
科學園區半導體廠設備維護工程。 1.設備維修保養、巡檢,維持設備正常運轉 2.設備改機、零件耗材更換 3.無經驗可,有經驗者薪面談。 4.需配合輪值夜間on-call待命,待命中不需入廠,有問題才進廠處理。 5.主管交辦事項。 6.依照公司承接案件地區,須配合出差外派。普通小型車,普通重機車普通重機車
應徵人數|0-10 人
2024/10/13
1.負責新產品封裝後段製程(Molding/DDTF/Laser marking), 試產及製程改善 制訂製造程序 2.協助制訂產品標準 3.協助新產品開發及可行性評估 4.協助開發文件建立與管理 5.協助推動新產品APQP、PPAP工程學門
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=433&source=1111 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區,歡迎領有身障手冊或證明者加入台積公司! 說明: 1.3DIC晶片級、封裝級與系統級散熱方案探索及評估 2.數值模擬與量測 多元、公平與共榮呼應台積公司的核心價值和經營理念,對公司未來的成功至關重要。台積公司對多元、公平與共融的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。台積公司致力營造公平且無障礙的職場環境,對不同特質與需求的身心障礙同仁提供所需的資源。我們承諾促進共融文化,讓每位員工都感到被重視,且有能力為我們的企業使命做出貢獻,並為全球客戶提供卓越服務。
應徵人數|0-10 人
2024/10/13
台達於近年開始導入碳化矽SiC相關技術,運用在電動車電源與充電技術方案上,打造最佳電源解方,我們積極招募相關領域專業人才加入台達! 1. 第三代功率半導體模組產品封裝工程專案推展 2. 第三代功率半導體模組市場趨勢及產品技術調研 3. 第三代功率半導體模組電路模擬與寄生參數分析 4. 第三代功率半導體模組電源模塊系統應用評估 5. 第三代功率半導體模組材料評估及可靠度驗證、失效分析及流程建立 6. 第三代功率半導體模組良率改善計劃推展 7. 第三代功率半導體模組成本改善計劃推展 8. 第三代功率半導體模組產品設計與應用之相關技術文件編寫工程學門
應徵人數|0-10 人
2024/10/13
台達於近年開始導入碳化矽SiC相關技術,運用在電動車電源與充電技術方案上,打造最佳電源解方,我們積極招募相關領域專業人才加入台達! 1. 第三代功率半導體模組產品封裝工程製程改善 2. 第三代功率半導體模組材料評估及失效分析及流程建立 3. 第三代功率半導體模組產品封裝工程製程最佳化參數評估及最佳化製程流程建立 4. 第三代功率半導體模組產品封裝製程異常處理分析改善及流程建立 5. 第三代功率半導體模組良率持續改善計劃推展 6. 第三代功率半導體模組成本持續改善計劃推展 7. 第三代功率半導體模組規範之相關技術文件編寫工程學門
應徵人數|0-10 人
2024/10/13
1.能夠與廠務端合作相關各種機台設備的水、電、氣的管線配置,廢氣體洗滌機台的管線配置,廢酸鹼液體回收排放管線配置的問題。 2.能夠與製程工程端討論相關機台的關鍵硬體組件與良率相關性的問題。 3.積極靈活的解決問題的能力,提供技術指導,分享技術方案和方法論,解決疑難問題。 4.在曝光機台/光阻塗佈機台/乾溼蝕刻機台/離子佈植機台/爐管機台/金屬薄膜沉積機台/介電質薄膜沉積機台/化學機械研磨機台方面有 10 年的最低實踐經驗。 5.參與12吋晶圓廠的28nm或28nm以下先進機台技術尤佳。電機工程學類,電子工程學類,機械工程學類
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=427&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區,歡迎領有身障手冊或證明者加入台積公司! Responsibilities: 1. Risk assessment and provide mitigation plan for IC packages by simulation and experiment. 2. Development and evaluation of new materials. 3. Continue improvement in simulation methodology, material modeling and script automation. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.機械工程學類,材料工程學類,化學工程學類
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=269&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Extract SPICE model parameters. 2. Device characterization. 3. Customer support. 4. Model document creation. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=255&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Provide module business process re-engineering services for IT project related to achieve development process effectiveness. 2. Provide comprehensive solutions to improve infrastructure and working process effectiveness. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=435&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台灣積體電路製造股份有限公司(台積公司)致力於維護身心障礙者就業權益。依身心障礙者權益保障法, 特別規劃聘僱身障人才專區,歡迎領有身障手冊或證明者加入台積公司! Responsibilities: 1. Advanced 3DIC process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability 3. 需值小夜班 (1-2週/per year), 假日值班 (1次/2月) Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.機械工程學類,材料工程學類,化學工程學類
應徵人數|0-10 人
2024/10/13
1.元件電性量測與分析 2.RC參數萃取 (Raphael) 3.建立Synopsys Sentaurus 28 HKMG MOS 2D/3D TCAD元件與製程模擬 4.與原廠合作校正模擬參數模型 5.以TCAD原廠提供的新模型校正TCAD 與 Si data間差異 6.與製程整合團隊合作,建立基礎製程條件和實驗設計 7.協助實驗電性量測物理學類,電機工程學類,電子工程學類
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=266&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Manage the overall training process by partnering with different training platforms to identify training needs, assess training materials, constantly collecting feedback and refine the training roadmap and review goals. 2. Build and maintain strong relationships with training platform and department training managers to ensure training requests are fulfilled and training objectives are aligned. 3. Monitoring training progress and quality and identify potential issues by generating and analyzing reports and KPIs. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.材料工程學類,化學工程學類,化學學類
應徵人數|0-10 人
2024/10/13
工作技能 1. 電源設計 2. 模擬軟體操作 工作內容: 1. 系統應用評估: A. 協助釐清客戶使用需求,傳達正確需求訊息,給內部團隊。 B. 協助客戶選擇適當電源模塊 2. 應用手冊撰寫,審核 3. 功率模組樣品、文件等,送樣及維護 4. 規劃建立功率模組資料庫 5. 跨Function team 溝通。 其他說明: 1.具備電力電子產品,如AC/DC, DC/DC Converter, Inverter 設計經驗佳 2.熟悉車用產品開發流程佳 3.熟悉 SIMPLIS, LT Spice, Matlab/Simulink軟體操作 (必要條件) 4.熟悉半導體量測設備操作佳 5.具中等以上英文能力電子工程學類,電機工程學類,其他工程學類
應徵人數|0-10 人
2024/10/13
1.Ownership of SRAM bit-cells for all technology extensions. 2.Own and co-optimize competitive SRAM devices to meet electrical, and reliability specifications at optimum yield levels. 3.Clear understanding of SRAM bit-cell design, electrical test structures, test conditions, and familiar with layout optimization techniques. 4.Design layout and experiments dedicated to the continuous SRAM development for leading-edge CMOS technologies. 5.Interface with device and integration teams on cross-functional issues affecting SRAM related performance, yield, or reliability impacting products.物理學類,電機工程學類,電子工程學類
應徵人數|0-10 人
2024/10/13
1.執行原創性或高複雜性之設計 2.依據製程技術及供應商製造能力新建立標準化規範 3.執行訓練計劃,指導工程師工業工程學類,工業技藝及機械學門
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=254&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: About Corporate Planning Organization: 1. We ensure customers’ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We look for talents: IE, Business, or Semiconductor Industry Experiences; Logical thinking and communication skills; Learning agility; Business acumen. Following is detailed job description: Account PC Planner: 1. Provide delivery schedule and logistic services to key customer. 2. Coordinate the internal planning team including planning team and Back-end for delivery. 3. Manage logistic service related projects and Hub. Fab Production Control Planner: 1. 300mm fabs’ Production planning: Capacity support and customer demand fulfillment. 2. Fab operation management: NTO pilots and priority lots management, production delivery management, CT management and key bottleneck tool performance monitor. 3. Operation KPI monitor and achievement. IE Engineer: 1. Long-term capacity planning and management. 2. Long-term Capital investment planning and control. 3. Cost evaluation and management. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
應徵人數|0-10 人
2024/10/13
1.薄膜部門管理 2.薄膜部門生產製程運營體系建立 3.薄膜部門成本管控 4.薄膜部門製程開發電機工程學類,電子工程學類,材料工程學類
應徵人數|0-10 人
2024/10/13
工作內容: 1. Die 模擬模型建立、維護 2. Die level特性評估驗證(包含導通/切換/特殊參數…) 3. Die level實驗設備平台規劃、建置 4. 新SiC供應商Die評估 5. 針對工程需求、協助問題分析並提供建議 6. 跨國/跨單位技術問題討論 其他說明: 1. 熟悉晶片設計、製造,或對第三代SiC半導體特性 2. 熟悉半導體測試設備操作 3. 具備SiC晶圓設計,製程經驗尤佳 4. 具基礎英語文能力(TOEIC:550)電子工程學類,電機工程學類,其他工程學類
應徵人數|0-10 人
2024/10/13
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=258&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Advanced module process development and baseline sustaining. 2. Process stability/manufacturability improvement for yield and reliability qualification. 3. Process/tool transfer to volume manufacturing. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.物理學類,電子工程學類,電機工程學類
應徵人數|0-10 人
2024/10/13
工作項目: 1. FinFET製程記憶體設計開發。 2. 客製化記憶體設計開發。 3. 支援記憶體智財量產性能,良率提升。 應徵條件: 1. 碩士以上; 電機工程、電子工程相關科系畢業為主。 2. 熟悉 Hspice, Spectre, XA, Solido等 simulation tool, Virtuso, Laker等 layout tool. 3. 具3年以上下列經驗之一者為佳 (1) 熟知 CMOS元件與 SRAM/其他記憶元件特性。 (2) 熟稔並執行過 SRAM/CAM電路開發工作。 (3) 具 FinFET電路設計與佈局設計經驗。電機工程學類,電子工程學類
應徵人數|0-10 人
2024/10/13