representing Quality on new product/process development and product care projects. • Ensures that all design

Mediatek Analog Design and Circuit Technology (ADCT) is currently seeking experienced analog circuit

- RTL/Logic Integration and Verification - Develop Timing Constraints for RTL-Synthesis and PrimeTime-STA for the blocks and the top level including SOC. - Use cdc tool to check RTL/SDC quality - Develop Power Intent Specification in UPF for the multi-vdd designs.

Power management IC design Audio IC design Data converter IC design high speed serdes IC design

Processor ISA design 2. Cache and bus interface 3. DSP and machine learning library design 4.

In this role, you will be a member of the System-Level-Cache (SLC) design team, working with architecture

We‘re looking for a Technical Writer / Document coordinator that focus on IC design macro and micro architecture

1. Perform trade-off analysis on various 5G modem technologies (sub6 and mmWave) and architectures 2. Analyze front-end impairments impact on modem performance 3. Implement advanced algorithms on system platform with C/Matlab/Python

A.I. technology/application research, design and development. 2.

Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs

Work on 7nm~3nm design implementation, methodology, and sign-off 2.

SoC physical design technology & methodology development for optimal PPA, including floorplan, design

Design CMOS Image Sensor (CIS) & depth sensor related test chips for process development 2.

1) Manage and develop in-house design automation programs 2) Analyze and summarize memory usage profiling

- Co-work w/ foundry/EDA vendors to define best PD imp recipes - Explore EDA tool new features and introduce to project team - Define proper FOM to project DTCO opportunities - Optimize PG structure for best resource and IR/EM concerns, including pillar types, via stacking layers - Help project team revise scripts, provide guidelines/checkers to check PD quality and feedback potential issues - Build physical-aware timing diagnosis utilities

Logic design, Server Motherboard design, overlook board layout and design verification.

【About us】 We are part of Garmin global design team and are based in Taiwan.

1. Responsible for schematics capture, layout checking , BOM generating, and debugging and testing of server mother boards/add-in cards/backplane / GPU products. 2.Collaborate with layout engineers, validation engineers, software engineers, firmware engineers, power engineers and other teams to discover and solve any issues of designs in early stage to ensure and enhance the quality of the products. 3.Accomplish the products to conform to engineering specifications , customer performance expectations. 4. Perform other duties as assigned.

1.具備設計科技或相關領域的學位，深化專業知識框架。 2.持有教學證照，尤以具備IB教學經驗者為佳。 3.熟悉IB文憑課程的核心概念，掌握創新與人體工學。

1.擁有設計科技或相關領域的學士或碩士學位，附加工程與工業設計背景。 2.持有教學證照，優先考慮具有IB教學經驗者，增強教育專業性。 3.熟悉IB文憑課程，涵蓋如創新、可持續性及人體工學等核心理念。

工作項目： 負責下列工作項目之一 1. High performance core physical implementation 2. Project Implementation and flow development. 應徵條件： 1. 碩士以上；電機、資訊科學、資訊工程相關科系畢業為主。

工作項目： IC physical designer (APR) 應徵條件： 碩士以上; 電機工程、電子工程、資訊工程相關科系畢業為主

1.負責ARM M系列處理器的韌體維護與開發 2.建立和管理韌體設計和驗證團隊 3.主導光模塊嵌入式韌體和引導程式設計 4.熟悉硬體設計與電路原理，能與客戶緊密合作 5.維護韌體驗證和故障分析流程

Logic design, board design, overlook board layout and design verification.

Architecture design and RTL implementation of Camera system 2. Verification of Camera system

The ideal candidate should have a strong design background, and a keen sense of artistic detail.

1.協助車體包膜師進行車輛外觀包膜。 2.協助貼膜材料的裁切、拼接、調整和安裝。 3.根據車體包膜師的要求進行工具和材料的準備。 4.協助確保貼膜質量符合標準，避免出現泡泡、皺摺、漏氣等問題。 5.參與相關培訓和學習，進行貼膜技能的學習和提高。 6.保持工作場所的整潔和安全。

高速類比電路與記憶體介面類比電路設計

建立IC設計後段驗證流程，並撰寫自動化程式。 2. 建立並維護DRC/LVS/SVS/LVL/ERC/PERC相關檔案及流程。 3. 分析並解決PV相關問題。 應徵條件： 1.

1.光收發模組產品的開發設計,輸出原理圖、PCB加工文件、PCB貼片文件等設計文檔 2.光收發模組產品樣品製作,輸出驗證報告 3.引入新物料的技術評估,並驗證及導入 4.編寫項目文檔、技術專利及其他有關技術文檔