需求單位： 職缺隸屬於測試廠的研發單位，本單位為一個整合性的團隊，成員涵蓋軟體研發、機台研發、產品測試工程 與 製程整合等，大家會一起負責公司的重點客戶，因此除了能累積來自國內外第一線客戶端的大量人脈之外，還能培養您跨界、跨領域的合作能力。 工作內容： 1、負責測試機台自控程式、光譜儀外掛程式等團隊軟體開發業務。 2、熟悉Python、Labview、C等程式語言(面談時需提供作品集)。 3、擁有ATE相關機台(Advantest、Teradyne)經驗尤佳。

Analog circuit design and testing 1. Use Virtuoso/ADS software for circuit connection, Hspice/Spectre software for analog circuit (memory, CIM, power circuit) simulation, and Laker/Virtuoso to check or optimize the layout. 2. Characterize IC chip by using power supply, Function generator, Oscilloscpe; plan test procedures and design testing board for IC chip. or High frequency research and development: 1. Integrated design of high-frequency IC, circuit board modules, antennas and other components 2. Participate in new ventures and new company plans. or AI/Hardware security applications: 1. Develop AI algorithm in verilog HDL. 2. Realization cryptography algorithm in FPGA.電機工程學類,電子工程學類

需求單位： 職缺隸屬於測試廠的研發單位，本單位為一個整合性的團隊，成員涵蓋軟體研發、機台研發、產品測試工程 與 製程整合等，大家會一起負責公司的重點客戶，因此除了能累積來自國內外第一線客戶端的大量人脈之外，還能培養您跨界、跨領域的合作能力。 工作內容： 1、負責與客戶討論軟體相關合作專案、並匯報進度。 2、擁有程式語言底子。 3、擁有流利英文口說能力。 4、無相關經驗可。

需求單位： 職缺隸屬於測試廠的研發單位，本單位為一個整合性的團隊，成員涵蓋軟體研發、機台研發、產品測試工程 與 製程整合等，大家會一起負責公司的重點客戶，因此除了能累積來自國內外第一線客戶端的大量人脈之外，還能培養您跨界、跨領域的合作能力。 工作內容： 1、代表測試團隊(Optical Testing)與客戶討論矽光子專案。 2、於矽光子領域擁有相關研究經驗。 3、擁有流利英文口說能力。

1. Performing reliability testing including Mechanical, Environmental, IPX and chemistry tests...etc. 2. Reliability test equipment customs clearance, setup, calibration, maintenance and test data analysis 3. Arranging technician to perform every reliability tests, track the test schedule, collect the test datas and compose test report. 4. Providing reliability test report and highlight reliability test issues 5. Optimizing the reliability test methods and test specifications 6. Training on testing skills and ensure the SOP has been followed strictly; 7. Follow-up and push-up with the test to meet the schedule;

1.熟悉IC ATE 測試機台, 如 ETS 800 等 2.熟電源產品測試相關經驗 3.具備Digital, high speed interface testing 與debug 的實作經驗電機工程學類,電子工程學類

工作項目： 1. Software and utility development for ARM Architecture based Complex CPU Subsystem Platform 2. CPU function validation and testing software development 3. CPU post-silicon issue analysis, debug & resolving 應徵條件： 1. 碩士以上; 資訊工程、資訊科學、電機工程、電子工程等相關科系畢業。 2. 熟悉 ARMv7/v8/v9-A CPU 架構，有 ARM Cortex-A CPU system software 經驗尤佳。 3. 熟悉以下經驗者： (a) CPU 之系統程式或工具開發。 (b) CPU/OS之 debug 及問題分析。 (c) CPU post-silicon issue analysis, debug & resolving。 (d) 具備 Verilog RTL 及相關工具軟體開發經驗。 4. 積極負責、溝通協調能力強、勇於迎接挑戰，對於 High-Performance CPU Technology 有興趣者。電機工程學類,電子工程學類,資訊工程學類

Skills/Experience： • With working experience in the class 1000 or higher level clean room. • With experience of equipment operation on the process equipment such as coater, printers, dispensers, cleaners, or ovens. • Or experience working on instrument operation as an optical microscope, surface profiler, or other electrical testing instrument. • Familiar with the tool operation principles, troubleshooting, and maintenance in the slit coater or photolithography, ACF bonder, COF bonder, and Resin laminator. • Good communication skills in both written and oral. Responsibilities： • Line operation Mon-Fri. AM9:00 to PM 6:00. • Daily tools startup, calibration, and setup for processes. • Tool troubleshooting and PM. • Process setup for the experiments and execution. • Data collection and/or basic analysis. • Mask/Screen design capability with CAD is a plus. 此職缺為派遣職，一年一簽

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 JD • The candidate needs to engage a team across geos and possesses solid knowledge of 802.11AX/BE MAC protocols, embedded systems, and testing infrastructure. • The job requires following the timeline strictly and having the capability of a fast turn-around for solutions to highly complex, challenging issues. • The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with worldwide design team to complete the pre-silicon verification, ASIC bring-up for MAC/FW/Host, as well as system performance tuning and customer support. Qualification • Master’s degree in Engineering, Electronic Engineering, Computer Science, or a related field. • 2+ years of proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. • Comprehensive understanding of IEEE802.11 MAC protocol design, including data transfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience with 11AX/BE is a plus. • Linux/firmware/embedded-system design, kernel driver development. • Pre-silicon bring-up and verification. PHY layer experience is a plus. • Understanding of the ASIC verification process, and WIFI testing/issue analysis. IEEE Lab certification experience is a plus. • Source code management systems such as Perforce, and GIT. • Electrical Engineering or Computer Science/Networking • Solid understanding of WIFI networks and IEEE802.11 stds. • Solid knowledge of using bench equipment (e.g. oscilloscope, Litepoint tester, sniffer,…). • C/C++ programming skills. Python/Perl/Shell script is a plus. • Fluent English capability. 此職缺為派遣職，一年一簽

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 工作內容： 1. 協助實驗室的日常運作，測試樣品/夾具準備、測試、報告生成以及跟進，並支援先進封裝技術 2. 將負責熱機械材料測試（如：熱分析儀、萬能試驗機、剪切測試儀等）、工具/加工以及驗證電路封裝材料和加工方法 3. 熟悉ASTM、JEDEC、IPC或相關行業規範為佳 4. 了解熱機械測試方法，如：熱分析儀、萬能試驗機、剪切測試儀和工具顯微鏡等為佳。 5. 具有測試方法學或材料開發經驗尤佳。 Job Description： The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation, and follow-up in support of advanced packaging technologies. This technician will be responsible for thermal and mechanical materials tests (ex: thermal analyzers, universal testing machines, shearing testers, etc.), tool/machining, and methodologies to validate the materials and processing of the IC package. 此職缺為派遣職，一年一簽

職責要求 •Work on current and next generation SoC FPGA products • Perform electrical failure isolation and physical failure analysis of field returns and production failure • Collaborate with different teams across geographies (including Design, Technology Development, Customer Support, Product/Test Engineering, Quality) • Generate failure analysis reports, estabilish corrective actions and communicate with customers 任職資格 • 3+ years of experience in SoC/VLSI design • Knowledge of IC assembly packaging design, process and testing • Self-motivated with strong logical/analytical thinking • fluent in English reading/writing/speaking • experiences with failure analysis techniques or tools is a plus

【職缺類型】 此職缺剛開始合約為8個月，依工作表現最多可沿簽至2年。 The Design Verification and Testing (DVT) organization within QCA is responsible for verifying system-level performance of reference designs with leading-edge wireless IC technologies. Tests currently encompass TX and RX RF evaluation including NXN MIMO performance, under an extensive number of conditions. 【Responsibilities】 The role involves hands-on DVT evaluation of reference designs in a controlled environment, working closely with other DVT engineers and lab technicians, driving data gathering and consolidation, and presenting results to engineering teams. 【job description】 1. Utilize internal automation tools to verify system-level performance of WLAN reference designs 2. Conduct DVT entry reviews in preparation for DVT 3. Generate DVT exit review material and conduct data reviews for engineering team 4. Generate DVT reports for internal and external customer release 5. Be responsible for integrity of DVT data. Address discrepancies promptly and verify solution 6. Contribute to internal DVT standards and procedures 7. Identify and enable new test capabilities using solid scripting/programming skills 8. Work with lab technicians to design and implement new test setups as needed 9. Provide timely feedback to the engineering teams with regards to progress and status of DVT 【工作福利】 1. 報到即享有年假。 2. 全薪病假15天。 3. 生日/新年/端午/中秋禮金

▼ 此工作一開始合約為8個月,後續視工作表現,做久可在內部任職2年 (此工作適合短期兩年有其他工作規劃 或是 有出國進修打算的你加入) The Design Verification and Testing (DVT) organization within QCA is responsible for verifying system-level performance of reference designs with leading-edge wireless IC technologies. Tests currently encompass TX and RX RF evaluation including NXN MIMO performance, under an extensive number of conditions. —————————————————————————————— 【Responsibilities】 The role involves hands-on DVT evaluation of reference designs in a controlled environment, working closely with other DVT engineers and lab technicians, driving data gathering and consolidation, and presenting results to engineering teams. - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - As part of the DVT team: 1. Utilize internal automation tools to verify system-level performance of WLAN reference designs 2. Conduct DVT entry reviews in preparation for DVT 3. Generate DVT exit review material and conduct data reviews for engineering team 4. Generate DVT reports for internal and external customer release 5. Be responsible for integrity of DVT data. Address discrepancies promptly and verify solution 6. Contribute to internal DVT standards and procedures 7. Identify and enable new test capabilities using solid scripting/programming skills 8. Work with lab technicians to design and implement new test setups as needed 9. Provide timely feedback to the engineering teams with regards to progress and status of DVT - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 【Minimum Qualification】 1. Bachelors in EE. Fresh graduate or engineer with 0-3 years industry experience 2. Good understanding of electronics engineering fundamentals, RF circuits and RF performance metrics (Sensitivity, Intermodulation, Tx Power, ACLR, EVM, S-parameters) 3. Hands-on knowledge of RF instrument operation: Signal Generators, Spectrum Analyzers, Power meters, Network Analyzers etc. 4. Knowledge of statistical data processing using data analysis tools (Extensions, JMP, data power, etc.) 5. Basic programming (QDART tree) and debugging skills —————————————————————————————— Ean Liu Email：ean.liu@manpowergrc.tw LINE ：@356gezfb

【Responsibility】 - The position is focused on laboratory daily operation, test samples/fixture preparation, testing, report generation and follow up in support of Qualcomm advanced packaging technologies. - This technician will be responsible for thermal and mechanical materials test (ex: thermal analyzers, universal testing machine, shearing testers, and etc. ), tool/machining, and methodologies to validate the materials and processing of IC package. 【Requirement】 - Bachelor‘s, Materials Science and/or Mechanical Engineering or 3+ years industry experience or possibly an associate’s degree - Minimum of 3+ years work experience with mechanical or materials testing - Laboratory experience such as: ISO 17025, ITAF 16949 of quality, reliability, failure analysis/test laboratory. - Experience in tooling, measuring, technical drawing and etc. of the test specimen fabrication. - Knowledge of industry thermal-mechanical test methodologies such as: thermal analyzers, universal testing machine, shearing testers and tool microscope. - Experience of test methodology or materials development. - Knowledge of ASTM, JEDEC, IPC, or relevant industry specification. - Laboratory management experience such as: ISO 17025 or equivalent quality system lab. - Experienced with statistical analysis software(ex: JMP, Minitab…) or Programming language (Python, R…) - Good project management and communication skills with teams. - Able to work flexible hours and different shifts. - Fluent in Mandarin and basic in English. ————————————————————— Ean Liu Email：ean.liu@manpowergrc.tw LINE ：@356gezfb