找工作

1.熟悉半導體封裝測試產業 2.熟悉IC設計公司產業 3.客戶拜訪開發及關係維護 4.客戶意見回饋及售後滿意度維持 (如: 顧客抱怨及問題反應處理、維持顧客對公司及業務員信賴度) 5.具備專業知識與研發設計部門溝通

1.半導體專利案件審核。 2.半導體專利提案評估與委外管控。 3.執行半導體專利分析與布局。 4.協助專利加值運用。 5.處理訴訟/非訟專利分析。 6.專案執行。

黃光設備塗佈，清洗和自動化相關設備經驗 能獨自至客戶端進行維修保養及故障排除作業 1.熟悉半導體設備或機械手臂（光阻塗佈機） 2.設備售前需求分析、規格溝通、定制解決方案 3.負責更換、調整及維修機械設備及故障排除

1.半導體大廠客戶拜訪開發並推銷產品 2.依顧客需求做報價及簽約 3.有半導體設備銷售經驗佳 4.曾有海內外SEMICON參展經驗佳

職責要求 - Provide the design guidance to control software and algorithm team. - Investigate the possible application scenarios of advanced semi manufacturing. - Work closely with system architect to develop solutions for improving the tool performance. - Participate in Alpha tests 〝in-house〝 and Beta tests at customer sites. - Performs other duties as assigned. 任職資格 1 Requires a minimum of a master’s degree in electrical engineering, physics, or relevant engineering discipline, plus 5 years of industrial experience. - Deeper understanding of inspection areas, especially optical inspection. - Thoroughly understands engineering principles and techniques related to project activities. - Show a high degree of proficiency in several other related technical areas. - Ability to recognize system-wide issues and design accordingly. - Strong working knowledge of testing techniques - Strong working knowledge of various applications. - Ability to independently resolve complex problems. - Strong presentation skills.

在全球半導體競逐的關鍵時刻，臺灣的半導體產業產值位居全球第二名，正站在定義未來的最前線。

負責內外部AI應用文化建立，提升數位賦能。我們期待這個角色結合知識管理與AI大語言技術，建立持續的學習動機，確保知識的更新和正確性，並支持AI應用的落地。 主要職責包含： 1.

流程優化與數位工具應用：善用 AI 或其他數位工具於報表編製與分析，推動作業流程優化，提升團隊整體效率與品質。

職責要求 1. Develop and maintain the server BMC firmware. 2. Develop new features for BMC to enhance server management. 3. Collaborate with the hardware and BIOS teams to clarify questions and resolve bugs. 4. Conduct code reviews, unit testing, and debugging to ensure the quality and reliability of the BMC firmware. 任職資格 1.3+ years experience with BMC firmware, preferably OpenBMC 2.Experience with BMC hardware, preferably AST2500, AST2600

1.協助半導體設備或模組與專案之開發設計 2.協助半導體相關產品零件、治具之產品開發設計 3.協助設備.模組.實驗之開發及預組裝組立 4.協助新產品製程規劃，BOM製作架設 5.協助逆向工程繪圖，規格討論