05 / 06
1. 執行半導體機台維護及維修作業。 2. 協助安裝、修改、偵錯各種軟體。 3. 工作場域為晶圓廠，須於無塵室進行廠內機檯維修。 4. 檢查物料/清點報表了解產線所需。 5. 主管交辦事宜。
05 / 06
*For Logic/RF IC application Technical Manager 1.Follow up department directions to complete assigned tasks 2.Accountability in Logic/RF/MS technologies production marketing 3.Logic/RF IC application study and exploration, W2PH2WG2M direction plan and execution 4.Capable to communicate with internal teams, including TD, sales, IPDS, FAE, CE and COP etc. 5.Capable to do customer facing activities, including promotion, market sensing, channel establishment etc. 6.Analyze product segments to define market SAM, foundry technical trends, UMC opportunity, competition, solutions and business proposals *For advanced package technology Technical Manager 1.Follow up department directions to complete assigned tasks Accountability in promote and present advanced package technologies(2.5D/3DIC...ect.) 2.Capable to communicate with TD 3.Enrich advanced package technology & MFG promotion materials 4.Provide technology presentation 5.Analyze product segments to define UMC opportunity, solutions and proposals 6.Provide product market trend, supply chain/ BOM, technology spec., IP requirements and product competition in the market 7.Support advanced package technology benchmark and foundry competition 8.Evaluate capacity demand and forecast 9.Predict market trend up and down 10.Support to build capacity simulation model with internal 11.Cooperate with Sales teams/ CP/ P&L/ CE/ FAE to increase market share, product margin and profit in UMC business *For BCD technology Technical Manager 1.Follow up department directions to complete assigned tasks 2.Accountability in promote and present BCD technologies 3.Capable to communicate and work with TD 4.Update technology promotion materials quarterly 5.Analyze product segments to define UMC opportunity, solutions and proposals 6.Provide product market trend, supply chain/ BOM, technology spec., IP requirements and product competition in the market 7.Support advanced Technology benchmark and foundry competition 8.Evaluate capacity demand and forecast 9.Predict market trend 10.Cooperate with Sales teams to increase UMC business *For Silicon Photonic technology Technical Manager 1.Follow up department directions to complete assigned tasks 2.Accountability in promote and present Silicon Photonic technologies 3.Capable to communicate and work with TD 4.Update technology promotion materials quarterly 5.Analyze product segments to define UMC opportunity, solutions and proposals 6.Provide product market trend, supply chain/ BOM, technology spec., IP requirements and product competition in the market 7.Support advanced Technology benchmark and foundry competition 8.Evaluate capacity demand and forecast 9.Predict market trend 10.Cooperate with Sales teams to increase UMC business
04 / 26
• New product implementation, especially in Flip Chip related products • Assembly yield improvement, issue and RMA resolving • Package technology development and process improvement
04 / 07
•重點開發技術: 系統軟韌體開發、高速資料實體層(physical layer) 資料傳輸軟體開發、優化硬體效能及產品量產品質控管 •主要目標: 完成Enterprise/AI/xPU等相關產業客製化IC的軟韌體開發與系統整合，並協助客戶產品量產 •負責新產品的系統設計與開發，確保符合公司及客戶的需求 •協助量產過程中的技術問題解決，並提供專業建議以提升生產效率與品質 •與跨部門團隊合作，確保產品從設計到量產的順利過渡 •分析並改善現有系統和流程，以提高產品質量和生產效率 •參與產品測試和驗證，確保產品符合相關標準和規範
04 / 07
1. Define the roadmap and product portfolio of tablet, eReader, OTT, smart display and wearable. Drive product positioning and value propositions. 2. GTM strategy planning and execution, win design awards, and deliver revenue. 3. Customer engagement and relationship build up. 4. Collaborate closely with internal RD, PM team to understand product architecture, roadmap, and differentiating features, ensuring marketing deliverables are technically accurate. 5. Work with sales teams to support customer engagements, respond to technical inquiries, and drive product adoption.