CP/FT PCB Hardware Engineer

美商迪艾司科技有限公司台灣分公司

15個職缺
  • 全職

面議(經常性薪資達4萬元或以上)

  • 大學以上

新竹縣竹北市

  • 應徵人數

    1 ~ 5 人
  • 需求人數

    1 人
  • 到職日期

    不限
  • 更新日期

工作內容

職缺描述

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

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工作待遇

面議 (經常性薪資達4萬元或以上)

查看薪資水平

職務類別

  • PCB-Layout佈局工程師

  • IC佈局工程師

  • IC封裝/測試工程師

工作性質

  • 全職

工作時間

  • 日班

休假制度

  • 週休二日

工作地點

新竹縣 竹北市 台元街18號4樓-10 (台元科技園區)

要求條件

學歷要求

  • 大學以上

工作經驗

3 年以上經驗

外語能力

  • 英文 聽| 中等、 説| 中等、 讀| 中等、 寫| 中等

工作技能

  • 繪製電子電路圖表

  • PCB電路板設計與規劃

具備駕照

  • 自排小型車

附加條件

擅長工具 RF、Circuit Design 其他條件 · Bachelor’s or Master’s degree in Electrical Engineering (EE) preferred. · Minimum of 3 years of relevant working experience. · Solid knowledge of electronics and signal/power integrity routing techniques. · Proficiency in Cadence Allegro PCB CAD design tools. · Experience with other PCB CAD tools (e.g., Mentor Graphics Expedition, PADS) is a plus. · Strong verbal and written communication skills in both English and Chinese, with the ability to engage in technical discussions with suppliers, customers, and global design teams. · Willingness to communicate across different time zones (Europe and the U.S.) when required. · Proactive, positive, and “can-do” working attitude. · Ability to manage multiple projects simultaneously in a fast-paced environment. · Capable of working under pressure and adapting to frequent changes in requirements.

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其他說明

需出差

歡迎身份

    歡迎所有求職者

公司資訊

產業類別

  • 其他半導體相關

公司人數

10 人

資本額

100 萬

公司環境

聯絡資訊

聯絡人員

HR

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