Application Engineer-Bonder(新竹)_半導體設備大廠 (3008899)

職責要求 

- Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. 

- Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. 

- Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. 

- Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. 

- Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. 

- Oversee process validation and testing, ensuring compliance with industry standards. 

- Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. 

- Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 

任職資格 

- Master’s degree in Engineering related field or Material Science. 

- Minimum 6 years of experience in semiconductor lithography and bonding processes. 

- Minimum 3 years of team management experience. 

- Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. 

- Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. 

- Fluent in English; knowledge of Mandarin is an advantage.