網通業硬體工程研發經理/副理

大學以上 

電機電子工程相關 

英文中等 

其他條件 

1. Ethernet Switch 相關產品研發與設計經驗 

2. 具有Switch Team leader 經驗尤佳 

3. 具有與客戶溝通經驗尤佳 

4. 熟悉 OrCAD Capture 及 Allegro PCB layout 相關軟體 

1. Ethernet Switch硬體架構評估 

2. Ethernet Switch 硬體設計開發 

3. 協助與客戶技術溝通 

4. 協助硬體測試與除錯 

5. 協助 EMC測試與問題排除

在竹科你一定聽過的公司，全球知名手機晶片IC設計大廠，限時加開炙手可熱且歡迎所有無經驗/有經驗者的夢幻職缺！ 

✦ 美商公司優於勞基法福利，高度彈性 

✦ 月薪3萬5UP，有經驗者依學經歷另敘薪 

✦ 無經驗者但有熱忱學習者，可另外培訓 

✦ 全方位、持續的職能培訓與激勵 

✦ 公開透明的調薪與轉正管道 

【公司地點】 

新竹市東區展業二路16-1號 

【工作內容】 

- 測試：晶片焊接測試、網通產品 

- 組裝維修部門：產線包裝、組裝 (細心謹慎、負責任、產線經驗) 

- 庫房：庫房管理、包料發料等 

【公司福利】 

✧ 加入即享有7天特休與15天全薪病假 

✧ 生日禮金NTD1,000 

✧ 春節禮金NTD2,000 

✧ 中秋及端午禮金各NTD1,000 

✧ 員工團體保險，給予你最多的保護 

✧ 公司實行舊制休假，意即見紅就休假、週六遇補班無須上班也不須扣特休 

★ 長期約聘合約，一年一簽，工作環境乾淨明亮，長期且穩定！

熟悉自動控制  

熟悉PLC軟體撰寫佳  

5年以上工作經驗  

有證照佳:工業電子技術士/室內配線技術士/工業配線  

Working Location: Hsinchu  

3) Report to : VP  

4) Qualification:  

1.Ideal candidate must be self-motivated with a proven track record and domain knowledge in 3G/4G PA(功率放大器)/FEM(射頻前端模組) module design.  

Sufficient knowledge with RF/IC PA(功率放大器) module design, FEM (射頻前端模組)package design. Experience of Business Development is a plus.  

2. 8 -years experience in PA/FEM module develop  

3. Master 以上電子、電機、電信相關科系畢  

4.具五年以上管理經驗為佳  

6) Role and Responsibility:  

1.Responsible for Manage FEM Module development  

2. Responsible for FEM Module business and partnership development  

3.Responsible for FEM technology development  

4.Responsible for team training and leading  

該公司為全球第一大IC設計公司，第一個產品和服務包括OmniTRACS衛星定位和傳訊服務，廣泛應用於長途貨運公司，和專門研究積體電路的無線電數字通訊技術。 

JD  

• The candidate needs to engage a team across geos and possesses solid knowledge of 802.11AX/BE MAC protocols, embedded systems, and testing infrastructure.  

• The job requires following the timeline strictly and having the capability of a fast turn-around for solutions to highly complex, challenging issues. 

• The responsibilities cover overall chip lifecycle development, including FPGA emulation for MAC mainly, involve with worldwide design team to complete the pre-silicon verification, ASIC bring-up for MAC/FW/Host, as well as system performance tuning and customer support.  

Qualification 

• Master’s degree in Engineering, Electronic Engineering, Computer Science, or a related field.  

• 2+ years of proven Firmware Engineering, IEEE802.11 MAC/PHY design, or related work experience. 

• Comprehensive understanding of IEEE802.11 MAC protocol design, including data transfer sequence, MSDU/MPDU/PPDU, CSMA/CA. Experience with 11AX/BE is a plus. 

• Linux/firmware/embedded-system design, kernel driver development. 

• Pre-silicon bring-up and verification. PHY layer experience is a plus.  

• Understanding of the ASIC verification process, and WIFI testing/issue analysis. IEEE Lab certification experience is a plus. 

• Source code management systems such as Perforce, and GIT. 

• Electrical Engineering or Computer Science/Networking 

• Solid understanding of WIFI networks and IEEE802.11 stds. 

• Solid knowledge of using bench equipment (e.g. oscilloscope, Litepoint tester, sniffer,…). 

• C/C++ programming skills. Python/Perl/Shell script is a plus. 

• Fluent English capability. 

此職缺為派遣職，一年一簽

Skills/Experience： 

• With working experience in the class 1000 or higher level clean room. 

• With experience of equipment operation on the process equipment such as coater, printers, dispensers, cleaners, or ovens. 

• Or experience working on instrument operation as an optical microscope, surface profiler, or other electrical testing instrument. 

• Familiar with the tool operation principles, troubleshooting, and maintenance in the slit coater or photolithography, ACF bonder, COF bonder, and Resin laminator. 

• Good communication skills in both written and oral. 

Responsibilities： 

• Line operation Mon-Fri. AM9:00 to PM 6:00.  

• Daily tools startup, calibration, and setup for processes. 

• Tool troubleshooting and PM. 

• Process setup for the experiments and execution. 

• Data collection and/or basic analysis. 

• Mask/Screen design capability with CAD is a plus. 

此職缺為派遣職，一年一簽