產品工程師PMIC

1.設計測試硬體配件  

2.IC驗證  

3.CP/FT 測試程式開發  

4.量產維護

• New product implementation, especially in Flip Chip related products​ 

• Assembly yield improvement, issue and RMA resolving​ 

• Package technology development and process improvement

CPU IC 產品發展, 產品量產管理與良率改善, 除錯與問題的解決

IC 測試工程師負責工作為: CP/FT ATE 測試程式撰寫與開發 CP/FT 量產導入與維護, 及良率分析 熟悉SOC digital mixed signal/ RF 測試. 熟UltraFlex/V93K 者佳.

1. Burn in process flow set up & qualification plan​ 

2. Qualification failure electrical & physical analysis​ 

3. Product reliability concern engagement with customer​ 

4. New test supplier audit & qualification​ 

5. Testing house supplier quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)​ 

6. New product/technology introduction quality & reliability management​ 

7. Testing house supplier quality improvement project

1. Conducting quality check procedures to ensure high-quality deliverables.​ 

2. Coordinating product quality issue to provide best-fit disposition for quality event impact material.​ 

3. Ensure lessons learned from prior projects are used to improve quality management process.​ 

4. Customer quality communication and RMA/FA management.

對於DFT晶片測試有興趣者，特別是 Automotive low DPPM DFT 以及 RISC-V DFT 領域， 

負責開發與實行DFT流程，以降低測試成本、提高產品品質為目的 

As a member of DFT engineering team, the candidate will develop methodologies and implement DFT for pre/post-silicon DFT flow and contribute to Automotive/RISC-V product test quality. 

Work with senior engineers across disciplines (DE, IMP, PE, TE) to meet low cost and high quality testing

Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development

1.CP/FT/SLT testing flow development  

2.負責CP/FT/SLT/Burn-in 測試配件開發與驗證

Develop advanced package technologies for MediaTek‘s HPC business

1. Develop systematic methodology to alleviate design challenges, including FIP development, synthesis, DFT, physical implementation, sign-off, process what-if assessment, system performance evaluation, in advanced nodes or package.  

2. Closely work with foundry and EDA vendors to define innovative HPC, Chiplet design methodologies. 

3. Explore new circuit architecture, EDA features and define improvement direction from MTK product requirements.

• 新產品導入量產 (IC 封裝部分) 

• 良率持續改善 

• 解決製程異常, 工程問題 

• 技術開發與製程改善

負責新產品開發、產品製造管理、良率改善，及產品開發時的問題分析及解決。