Technical Support Manager

Role Summary/Purpose 

Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. 

Job Description 

• Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers 

• Collect and analyze customer input, make sure it is complete and feasible 

• Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project 

• Evaluate and provide project sizing including schedule, cost, resource, feasibility 

• Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly 

• Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control 

• Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication 

• Execute assigned technical roadmap research and development 

• Support team development through mentoring, knowledge sharing and training 

• Deliver hardware design training and seminars to customers 

• Keep close communication with worldwide Teradyne teams and customers

Role Summary/Purpose: 

Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. 

Responsibilities: 

• Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers 

• Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost 

• Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. 

• Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) 

• Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage 

• Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. 

• Responsible for global end to end hardware project management to ensure best quality and on time delivery  

-Device testing requirement assessment and Feasibility study 

-Risk analysis and mitigation planning 

-Schedule planning and project management 

-Design execution 

-Regular review with global internal and external customers 

-Quality Control and Verification 

• Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate 

• New technology research, new products, new materials evaluation for next generation device testing 

• Deliver hardware design training and seminars to customers