Material Analysis Engineer_新加坡

At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose. 

With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments. 

With us, you can expect at UMC: 

• Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times 

• Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility 

• Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation 

Main Responsibilities 

You’ll lead work that powers the day-to-day technologies behind modern life, from mobility and connectivity to smart systems and sustainable design. As a Procurement Engineer in our team, you will: 

Job Description 

• Collaborate with internal stakeholders to understand their procurement needs and provide support and guidelines as required. 

• Conducts timely market reviews and request for price proposal (RFQ) in accordance with internal purchasing rules and guidelines. 

• Negotiates quantities, prices, delivery schedule, terms and conditions of delivery and payment/contractual terms. 

• Ensure timely PO execution to meet production needs. 

• Drives resolution to supply chain issues affecting quality, cost, delivery or lead-time, which may includes engagement with manufacturers/sub-tiers in the supply chain. 

• Identifies and realizes cost savings opportunities and execute cost reduction initiatives assigned 

• Prepare all relevant weekly, monthly reports 

• Other duties as assigned

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 

2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 

3.Generate BCD active and passive device P-cell layouts based on application specifications. 

4.Collaborate with the Modelling team to develop accurate SPICE models. 

5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 

6.Enhance BCD device performance to meet evolving application needs.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 

2.Render support in Production ramp-up, New process implementation and process characterization for project success 

3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 

4.Define and deploy inspection tool recipes BKM to ensure detection capability 

5.Assist in Customer audits on inspection strategy deployment and execution 

6.Perform baseline defect improvement

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 

2.Assist in productivity and yield improvement projects through data analysis and process experiments. 

3.Support the establishment and maintenance of key process parameters for semiconductor tools. 

4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 

2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 

3.Define and implement standard operating procedures (SOPs) for production. 

4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 

5.Work cross-functionally to develop customized process flows that meet customer need.

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 

2.Lead the development and qualification of new unit modules and device structures. 

3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 

4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 

5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 

2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 

3.Align device and process requirements with customers through technical discussions and solution deep dives. 

4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 

5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 

2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 

3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 

4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 

5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.