電子工程師 (光電事業處)

1.載板良率分析 

2.新產品開發期參數優化並順利導入量產 

3.整合產品異常問題並聯合製程改善 

4.客戶端產品面問題技術支援 

5.載板主導載板新製程技術與新產品開發、量產導入 

6.製程能力提昇、測試實驗規劃與結果分析 

7.新製程專案執行 

8.新產品樣品生產規劃

1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro 

2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison. 

3. Mechanical drawing for manufacturing process with AutoCAD. 

4. Customers TV/DUT design integration and collaboration. 

5. Impedance simulation and measurement for transmission line.

1. Electromagnetic simulation and electrical modeling by using Ansys EM suite. 

2. SI/PI high frequency / high speed signal integrity / power integrity / antenna radiation with Ansys EM/ADS systems. 

3. 3D full wave FEM/FDTD large-scale simulation and validation with EMpro and HFSS HPC. 

4. Signal emulation and performance simulation in PCB/Substrat of optical module.

1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation. 

2. amelioration by using Ansys optimization algorithm. 

3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding. 

4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.