封裝技術開發工程師

1. 2.5D/3.5D package technology development​ 

2. SoC/Memory heterogeneous integration package development​ 

3. Package technology integration, NPI and MP​ 

4. Project management​

IC 測試工程師負責工作為: CP/FT ATE 測試程式撰寫與開發 CP/FT 量產導入與維護, 及良率分析 熟悉SOC digital mixed signal/ RF 測試. 熟UltraFlex/V93K 者佳.

1. Burn in process flow set up & qualification plan​ 

2. Qualification failure electrical & physical analysis​ 

3. Product reliability concern engagement with customer​ 

4. New test supplier audit & qualification​ 

5. Testing house supplier quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)​ 

6. New product/technology introduction quality & reliability management​ 

7. Testing house supplier quality improvement project

1.CP/FT/SLT testing flow development  

2.負責CP/FT/SLT/Burn-in 測試配件開發與驗證