機構研發處主管

Thermal Department Leader 

[工作內容] 

Ø 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak) 

Ø Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. 

Ø Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. 

Ø Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. 

Ø Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. 

Ø Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. 

Ø Develop, review and edit project reports, and report to customers. 

Ø Assist with developing proposals and new business leads. 

Ø Maintain and grow existing customer contact and relations. 

Ø Extensive knowledge about heat transfer and energy conversion system is a must. 

Ø Ability to independently learn new engineering analysis tools and apply them into projects. 

Ø Previous research and development experience is preferred. 

Ø Software developing experience is requested, but not required.

[工作內容] 

1. 3 years or more experience design batteries for consumer electronics. 

2. Knowledge of pack design and electonic battery management system. 

3. Selection, characterization, and validation of cell materials and components, including cell in packing. 

4. Manage pack vendor and cell vendor for quality and performance ensurance for product. 

5. Providing engineering support to proeject team to select/design proper cell/pack to optimize performance to different applications. 

6. Work closely with project team to inceasing understanding of failure modes, performance and life expectancy of battery for different applications. 

7. Develop and create report, comprehesive technical specifications, and DFMEA for resolving design/manufacturing on product. 

8. Previously demonstrated strong technical knowledge, analysis, and communication skills. 

9. Strong interpersonal skills, be a self-starter and have demonstrated high levels of initiative and innovation. 

[工作能力需求] 

1. Fluent English  

[其他說明] 

1. Bachelors degree in Electrical Engineering, Mechanical Engineering, or Engineering Phyics. 

2. Working experience with Quality & Reliability of batteries/cell) 

3. Familarity with Statical analysis and Design of Experiments preferred.

大專以上機械/航空/物理/系/所畢，具10/6年以上Notebook PC或相關產品熱模組熱流設計/測試/熱事件排處經驗，具3/1年主管經驗者佳，略通英文。

大學以上電子/電機/機械相關系/所畢，具NB相關產品6年以上開發經驗，其中含1年以上主管經驗，精通英文。

車用電子製造主管能外派  

工作內容  

1. 車用電子產品生產管理。  

2. 生產人員管理及培訓。  

3. 建立和執行車用電子TS16949規範  

4. 負責車用電子生產團隊工作職能手冊建立與績效考核作業  

5. 車用電子相關教育訓練執行  

6. 客戶稽核確保與回應  

需求條件  

1. 5年以上車用電子生產製造管理主管經驗,若有SMT產線規劃及管理經驗更佳.  

2. 車用電子相關產業經驗(車用娛樂系統產品經驗尤佳).  

3. 大專/大學以上,電子專業學歷.  

伺服器零件工程(CE)設計經/副理  

大專以上電子,電機或資工等相關科系畢業, 熟悉Server產品架構,俱有10年以上CE零件工程設計實務經驗,其中含3年以上主管經驗,俱備  

英文聽,說,讀,寫等溝通能力  

Optical HW Leader理級  

Bachelor’s or Master's degree in EE, Optical-electronics/Optical-mechanical Science or similar major.  

3~5+ years in deparment management experience.  

Demonstrated ability to design, build, and deliver complex, successful performance achieval and/or customer experiences efficiently  

Proven team leadership, interpersonal skills, and ability to get things done  

Ability to clearly communicate high level strategy and technical details effectively across disciplines, locations, and organizations, including to senior leadership  

Strong technical foundation with demonstrated willingness and capability to learn new technologies quickly  

Burning desire to build great experiences for our customers.  

Significant experience as a successful technical program manager or development leader  

Proven track record of effectively working with and growing geo-distributed partner teams  

Superior ability to interact and collaborate with high quality, highly technical, multi-disciplinary teams  

Expert on hardware design, optical related component design.  

產品專案整合、審核及執行  

1. 大學以上，理工相關科系畢 (機械/航太/造船/工工)  

2. 英文精通  

3. 有產品開發、產品應用經驗或有做過OEM/ODM產業的PM 5年以上(其一)  

4. 團隊至少有帶領10人以上經驗  

5.個性開朗、 願意合作，表達與整合能力佳  

機構開發設計理級主管能外派 

一、需求條件 

l 8 年以上機構設計相關經驗,手機,穿戴,攜帶式電子產品 

l 具沖壓、射出模具、成型等相關知識 

l 具ODM, OEM 經驗 

l 具10人以上團體領導經驗 

二、工作內容 

l 與客戶合作並領導手機機構設計 

l 協助模具開發及量產 

l 部門級事務統整 

l 設計規範制定 

l 人力培養 

註：管理幅度約25人左右

伺服器機構設計 (課級~經理)  

條件:  

Minimum qualifications  

- BS in Mechanical Engineering or equivalent practical experience.  

Excellent 3D CAD skills - Experience with ProE  

5~8 years’ experience for the mechanical detail design on assigned components for server or PC  

- Experience with computer electro-mechanical assembly.  

Responsible for testing, analysis and debug on assigned mechanical prototypes.  

Preferred qualifications  

Understanding of precision sheet metal fabrication processes (NC punching, press brake forming, hardware insertion processes), hard tooling fabrication processes (metal stamping) and plastic injection molding processes.  

Excellent communication and interpersonal skills.  

Ability to analyze options for critical design elements and features and determines optimum selection.  

伺服器 CPLD設計 (副)課長 / 設計主任 / 高級工程師 --- 1員  

- 熟悉Server產品架構, 俱有6年以上Server CPLD設計實務經驗,其中含3年以上主管經驗 {(副)課長 / 設計主任}  

- 大專以上電子,電機或資工等相關科系畢業  

- 俱備英文聽,說,讀,寫等溝通能力  

伺服器 MB硬體設計 (副)課長 / 設計主任 / 高級工程師 --- 1員  

- 熟悉Server產品架構, 俱有6年以上Server MB硬體設計及測試實務經驗,其中含3年以上主管經驗 {(副)課長 / 設計主任}w  

- 大專以上電子,電機或資工等相關科系畢業  

- 俱備英文聽,說,讀,寫等溝通能力  

專科以上電子/電機系/所畢，具  

NB 產品7年以上電源設計經驗、1年以上主管經驗，  

具備英文溝通能力，  

需有配合公司外派的意願。  

伺服器熱處理(Thermal)設計經(副)理  

熟悉Server熱處理(Thermal)原理及仿真分析, 俱有7年以上Server Thermal設計以及Simulation實務經驗,其中含3年以上主管經驗  

大專以上電機, 機械或物理等相關科系畢業  

俱備英文聽,說,讀,寫等溝通能力  

伺服器硬體設計經(副)理  

熟悉Server硬體架構,俱有7年以上Server硬體設計實務經驗,其中含3年以上主管經驗  

大專以上電子,電機或資工等相關科系畢業  

俱備英文聽,說,讀,寫等溝通能力  

大專以上機械工程系/所畢，具10年以上Notebook PC或相關產品機構設計經驗，具主管經驗者佳，略通英文，熟Pro/E和設計研發流程。  

大學以上電子/電機相關系/所畢，  

具Notebook PC或PC相關產品10年以上開發經驗，  

其中含5年以上主管經驗，  

精通英文。

1.新專案規劃  

2.設計團隊領導與管理  

3.客戶溝通與協調  

大學以上機械工程科/系/所畢。  

具8年以上Notebook PC設計與開發經驗(含1年以上專案主導及客戶溝通經驗，2年以上模具(塑膠、板金)發包製作流程管制經驗)。  

熟PRO-E及設計流程。

1. 大學以上電子、電機、電信相關科系畢，英文精通。  

2. 具七年以上無線通訊產業RF設計工作經驗。  

3. 熟悉無線或衛星通訊模組及其它應用模組架構  

4. 熟悉半導體設計流程和測試為佳  

5. 具有三年以上管理職經驗  

1. Hand-on並帶領團隊成員進行RF設計、量測及模擬  

2 .熟悉無線產業生態並能建立團隊  

3. 對半導體封裝之電性進行設計與測試  

4.以系統的角度規劃與設計SIP模組  

5.與晶片技術廠商規劃與設計SIP模組  

1. Over 10 years work experiences in IT industry(加工製造產業) automation field.  

2. Familiar with robot design and development  

3. 5 years management experience,can design and develop a cross sites automation plan  

4. Bachelor and above degree  

5. Major in Automation engineering or EE, Mechanical