
此職缺的所有相似工作:
(共6筆)
類比射頻積體電路佈局設計(高速類比SerDes電路)
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合高速類比SerDes電路全客製化佈局設計及自動化流程設計
Fully custom layout design for analog high-speed SerDes circuit and layout automation flow development.
要求條件
- ● 電機工程學類,電子工程學類 相關科系
類比射頻積體電路佈局設計工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合類比、射頻、3D-IC矽中介層等電路全客製化佈局設計及自動化流程設計
要求條件
- ● 電機工程學類,電子工程學類 相關科系
Advanced Substrate/PCB technology Expert
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops
2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
3. Common strip format unification management
4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
5. PCB technology development and DRM owner
要求條件
- ● 其他工程學類 相關科系
<Data center>混合信號數位IC設計工程師(Serdes, 高速介面)
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Serdes PMA IP architecture planning
2. Serdes PMA IP RTL coding
3. Serdes PMA IP front-end and back-end integration
4. Co-work with PCS and MAC design team and DV team for IP verification
5. Co-work with Analog design team for PHY co-simulation
6. Co-work with Algorithm team for algorithm implementation and bit-true verification
DFT Engineer for Advance Process Node & Package Technology
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:
* Scan chain insertion & ATPG pattern generation
* Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
* Diagnosis to help manufacture process improvement
2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:
* PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
* Develop & integrate DFT-related RTL design modules to test chip
IO Circuit Design Engineer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合28nm及以下先進製程(含FinFET) IO電路和ESD防護設計, 工作內容包含
(1) GPIO電路設計(包含ESD/LU防護)
(2) 特殊應用IO (SD3.0/SIM card/eMMC等)電路設計(包含ESD/L防護)
(3) 高速IO和特殊應用IO在事業部專案上展開和執行
- Advance node (28nm and beyond, including FetFET) IO circuitry and ESD protection design covering fields for
(a) General purpose IO circuit design (with ESD/LU protection)
(b) Specialty IO (SD3.0/SIM card/eMMC etc.) circuit design (with ESD/LU protection)
(c) Project related implementation for high speed/specialty IO Interface - High speed IO, specialty IO circuit design, ESD protection circuit design and simulation.
Work with project leader, layout, packaging and system engineers to meet design and system specifications.
Work with IO library modeling, characterization teams closely for IP release.
要求條件
- ● 物理學類,通信學類,電機工程學類 相關科系
- 精選精選職缺
- 1天企業預估回應您的時間為「1個工作天」(2~7天以此類推)
- 急此職務急徵人才
- 習企業實習職缺
- 替研發替代役職缺
- 身接受身障職缺
- 職職場新聞,企業有發布新聞稿,文章,活動等訊息
- 溫溫馨職場,企業有提供職場環境及公司文化等簡介
