AMB Technology Co., Ltd., founded in Taiwan in Jun 2007. AMB Technology's mission is to create innovative Wafer Level Chip Scale Packaging (CSP) concepts, methods and products for manufacturing, licensing and distribution.
AMB has developed innovative Redistribution Layer Technology which with unmatched benefits for Flash Memory, DRAM Modules and other applications; and enables revolutionary TSV Technology which creates multiple benefits to the product, such likes smaller form factor, better package electrical performance, flexibility to Multi-Chip Packages or die stacking; all those benefits can be achieved under low process cost and high efficiency, various package requirements can be met for now and future.
AMB's management policies are Integrity, Innovation and Services, our teams are continuously providing innovative technologies and keep improving our manufacture ability, we are entrusted to provide reliable solution to the industrial.
Milestone
． 2007 Jun AMB Technology founded
． 2008 Nov TSV/RDL technology applied multiple country patent
． 2008 Sep ISO 9001 certification
． 2009 Dec ISO 14001/OHSAS 18001 certification
． 2010 Mar Smart Card Module Ramp-up
． 2011 Jan Lift-Off process set up and start BIZ
