Server硬體助理工程師

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.數位邏輯設計並熟悉RTL Coding架構。 

2.熟悉 Xilinx、Altera FPGA 架構與設計。 

3.研發設計網通應用IP。 

4.協助開發與驗證FPGA電路(Schematic)。

1.電控系統整合設計開發 

2.三電系統整合設計開發

FPGA-數位電路研發/整合/驗證 

工作內容包含: 

1. SoC FPGA架構設計 

2. SoC FPGA整合 

3. 數位電路設計 

4. 數位電路驗證 

5. 系統平台驗證

1. Smartphone新產品導入階段硬體研發和測試驗證 

2. 聲學、光學相關模組設計、驗證和試產 

3. 負責聲學、攝像模組、觸屏等相關模組失效分析與技術驗證 

4. 具備英文溝通能力以與客戶技術研討 

5. 配合出差美國協助客戶設計開發與測試驗證 

6. 因業務需求可能要出差或長駐海外

1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 

2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 

3. Lead the FA/critical issues & find out the root cause 

4. Global EC handling 

5. JIRA handle & response  

6. New Product Transfer/Enablement into global factories 

7. 2nd Source technical evaluation

1. Cable design and cable routing fitting  

2. Board level TAL maintain and system BOM maintain 

3. Board level & system assembly SOP design 

4. Label matrix design and management 

5. Manufacture trouble shooting

1. Cable design and cable routing fitting  

2. Board level TLA maintain and system BOM maintain 

3. Board level & system assembly SOP design 

4. Label matrix design and management 

5. Manufacture trouble shooting

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 產品 bring up  

5. 產品功能性驗證, 製作測試報告 

6. 產品 RMA 分析 

7. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計

1. 熟悉電路設計與pcb layout 軟體,,  

2. 熟悉VNA/SCOPE操作, DEBUG能力佳, 

3. 具獨立思考與解決問題能力,  

4. 需有團隊合作精神。 

5. 其他主管交辦事項。

1. PCBA、PCB、2nd Source 

2. 2nd Source Library 

3. Release PCBA BOM 

4. Maintain SKU BOM 

5. Release PCBA BOM(PST) 

6. CIS 零件審核

1. 協助新產品開發＆替代料導入 

2. 替代料驗証進度追蹤及記錄 

3. 零件品質管理  

4. 供應商關係管理 (供應鏈狀態/專業技術諮詢) 

5. 零件系統與流程優化與管理,包含PCN/ECN/EOL管理 

6. 2nd source零件資料庫維護 

7. 溝通與協調零件驗證事宜, 報告給 Dell CE team 

8. 2nd CM (contract Manufacturer) project (OEM)

1.與客戶討論擬定測試項目 

2.Server 可靠度測試及分析 

3.專案前期:RFQ/polling/NRE/測試規劃評估 

4.專案中期:Test Plan/Test Report/專案執行 

5.專案後期:問題追蹤及分析驗證

CESBG 產品線: Server產品 

1. 伺服器BOM管理及維護 

2. 存儲器BOM管理及維護 

3. 電子元件PCN 管理作業

負責產品：IP cam、Dash cam 

1. 影像品質調整 

2. 影像品質測試驗證 

3. 產線測試結果分析與確認 

4. 開發相機產品相關測試項目

1. 系統架構可行性評估。 

2. 電路設計。 

3. 偵錯除錯。 

4. 與各function team合作完成測試。

1. Product EMC Design and Verification test. 

2. Product EMC Issue Analysis and Debug. 

3. Product EMC World-wide Certification.

1.新產品客制芯片失效分析 

2.新產品硬件電路及系統設計失效分析 

3.新產品維修手冊撰寫及產線工程師培訓 

4.協助量產維修良率提升

1.負責產品硬體可靠度驗證並對產品問題追蹤、分析及改善 

2.按照時程完成專案所需驗證 

3.訂定測試計劃並撰寫測試報告 

4.相關國際法規的研讀與了解 

5.與客戶討論並確定相關測試要求 

6.開發與產品有關之可靠度驗證技術

產品：Gateway/STB/OTT 

1. 產品解決方案可行性研究 

2. 產品硬體規格制訂與報價 

3. 產品硬體線路設計與測試 

4. 產品法規認證與生產支援 

5. 專案計畫會議討論 

6. 產品2nd source導入