可靠度工程師(土城)

1. 負責帶領團隊規劃與建置Layer 2 Ethernet Switch系統整合測試 

2. 測試人力分配、測試涵蓋度與測試時程規劃與掌控 

3. 規劃建立自動化測試及改善研發驗證流程  

4. 團隊測試技術提升與規劃 

5. 跨部門溝通與協調

〝1. Layer 2/ 3 Switch 網路系統功能整合測試  

2. 規劃撰寫/編修測試計畫與測試架構  

3. Switch自動化測試與架構開發  

4. 測試驗證系統效能、壓力測試  

5. 建立測試環境與維護、改善測試程式與方法 〝

Server, storage產品之DC-DC 電路設計, layout / placement review, 除錯, 驗證

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.數位邏輯設計並熟悉RTL Coding架構。 

2.熟悉 Xilinx、Altera FPGA 架構與設計。 

3.研發設計網通應用IP。 

4.協助開發與驗證FPGA電路(Schematic)。

1. 負責雲端Server的專案工作 

2. 與一線大廠合作機會 

任何都會更新在粉絲專頁上喔！粉絲專頁如下↓↓ 

粉絲專頁：https://www.facebook.com/鴻海集團-鴻佰科技實習生新幹班專案-109654178264949 

• 鴻海集團 Fii 雲運算產品事業群提供有志朝產業發展的同學實習之工作機會。 

• 同學將與專業團隊一起工作學習，以得到更多將理論應用到實際工作的機會！ 

• 計畫介紹： 

• 職缺內容： 新幹班 (大學四年級或碩士二年級畢業生) 

• 應徵時間：即日起至2024/4/26(五) 

• 報到日 ：2024/6~ (依學生時程狀況調整) 

※若有個人中英文履歷，歡迎與應徵申請一起寄出 

實習生/新幹班職缺表: https://lnkd.in/g5SNPyxR 

投遞履歷表時, 煩請同時回覆 

1.申請表格  

https://docs.google.com/document/d/1ifPNL70V77wvSGYWXHV57Ftq3sxhmyK3/edit 

2.有興趣職缺類型或編號

1.產品定義規劃 

2.線材設計 

3.產品組立SOP及零件清單BOM編寫 

4.新產品導入生產

1.Diecut料-PSA/TSA/BC/Stiffener等標貼與編帶規格定義設計 

2.解讀客戶文件MCO/Gerber評估生產流程 

3.各工藝需求定義，標準規格定義 

4.異常分析反饋客戶並改善 

5.Panel layout guideline 建立

1.電控系統整合設計開發 

2.三電系統整合設計開發

FPGA-數位電路研發/整合/驗證 

工作內容包含: 

1. SoC FPGA架構設計 

2. SoC FPGA整合 

3. 數位電路設計 

4. 數位電路驗證 

5. 系統平台驗證

1. Smartphone新產品導入階段硬體研發和測試驗證 

2. 聲學、光學相關模組設計、驗證和試產 

3. 負責聲學、攝像模組、觸屏等相關模組失效分析與技術驗證 

4. 具備英文溝通能力以與客戶技術研討 

5. 配合出差美國協助客戶設計開發與測試驗證 

6. 因業務需求可能要出差或長駐海外

‘- Serve as a PM for Product Design team. 

- Working closely with customers and back-end teams to create quality products 

- Providing design insight and innovative ideas to teams 

- Supporting customers through out the design and manufacturing stages with organized reports and efficient management of resources.

Hardware circuit design, layout, pilot run and debug of telecomm / datacomm products. (Router / Switch / Server)

1. 企業等級WiFi 7 AP router硬體開發 

2. IOT 無線相關產品開發

1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 

2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 

3. Lead the FA/critical issues & find out the root cause 

4. Global EC handling 

5. JIRA handle & response  

6. New Product Transfer/Enablement into global factories 

7. 2nd Source technical evaluation

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 產品 bring up  

5. 產品功能性驗證, 製作測試報告 

6. 產品 RMA 分析 

7. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計

1. 熟悉電路設計與pcb layout 軟體,,  

2. 熟悉VNA/SCOPE操作, DEBUG能力佳, 

3. 具獨立思考與解決問題能力,  

4. 需有團隊合作精神。 

5. 其他主管交辦事項。

1. PCBA、PCB、2nd Source 

2. 2nd Source Library 

3. Release PCBA BOM 

4. Maintain SKU BOM 

5. Release PCBA BOM(PST) 

6. CIS 零件審核

1. 協助新產品開發＆替代料導入 

2. 替代料驗証進度追蹤及記錄 

3. 零件品質管理  

4. 供應商關係管理 (供應鏈狀態/專業技術諮詢) 

5. 零件系統與流程優化與管理,包含PCN/ECN/EOL管理 

6. 2nd source零件資料庫維護 

7. 溝通與協調零件驗證事宜, 報告給 Dell CE team 

8. 2nd CM (contract Manufacturer) project (OEM)

1. BOM製作 

2. 尋找component 2nd source 

3. 與工廠協調物料問題