【外商】半導體設備工程師（CMP_高雄）

• Act as the primary representative of the Field Service Head to customers, fostering strong relationships and ensuring service operations align with company goals.  

• Oversee the performance of the installed base within assigned functions to meet product specifications and system performance targets.  

• Direct and manage field service and technical support activities related to installation, servicing, and modification of company products.  

• Collaborate closely with sales, service teams, process engineering, and product groups to support customer technical and production requirements, evaluate product performance, and deliver optimal solutions.  

• Forecast and control Installation & Warranty (I&W) within the ISR plan, ensuring efficient engineer utilization for balanced absorption results.  

• Serve as a key liaison between customers and product groups, providing clear issue statements and support needs to drive continuous improvement in system performance, availability, and reliability.  

• Coordinate escalations with local and support teams, allocate resources effectively to minimize downtime and production interruptions.  

• Ensure a zero-incident safety record by maintaining a hazard-free environment and delivering ongoing training and guidance to the service team.  

• Understand customers’ equipment-related technology roadmaps, upgrade requirements, and operational challenges to identify opportunities for hardware improvements and value-added services.  

• Work with customers and account teams to identify hardware-related business opportunities, including:  

o Positioning the company’s equipment, capabilities and technical advantages. 

o Supporting penetration and defense strategies for hardware solutions. 

o Coordinating with Global Product Groups for equipment demonstrations and upgrades. 

• Manage hardware penetration and defense projects:  

o Develop and execute project strategies with account teams. 

o Drive local and corporate teams to deliver hardware solutions within committed timelines and resources. 

o Oversee competency and manpower allocation for hardware projects. 

• Act as a trusted advisor to customers for equipment performance, reliability, and productivity improvements.  

• Lead training, motivation, development, and discipline of assigned employees to build a high-performing team.  

• Manage competency and manpower resources to fulfill customer needs across multiple projects.  

• Mentor high-potential personnel to strengthen team capability and create growth opportunities for internal talent. 

• Lead training, motivation, development, and discipline of assigned employees to build a high-performing team.

1. 雷射源（如光纖雷射、CO2雷射、固態雷射等）性能評估與選型。 

2. 設計光學鏡組（聚焦鏡、掃描振鏡、光學濾波器等）在雷射加工應用。 

3. 整合雷射源與光學系統，並設計穩定的光路架構以滿足加工需求。 

4. 分析與改善雷射參數（脈衝、能量、波長等）對複合材料（如碳纖維、玻璃纖維、金屬基材等）的切割和鑽孔效果。 

5. 協助自動化控制系統與機械結構的整合，開發高精度雷射機台。 

6. 解決研發及製程中相關的技術問題，確保設備的可靠性與穩定性。

1.半導體高速測試座(Socket)研發 

2.測試用探針與導電膠設計開發 

3.設計轉製造的試量產製程參數驗證 

4.客戶送樣產品認證案執行 

6.測試介面相關研發專案執行

1.解決生產中設備機況與機構異常處理 

2.提升設備稼動與設備製程良率 

3.設備MTBF分析與不良改善 

4.協助新人設備操作訓練 

5.訂定各類設備保養程序書並落實執行

【菁英培育獎學金】 

日月光 ASE｜碩士生專屬｜最高 31 萬元獎學金 

提前培育半導體關鍵工程人才，畢業即可就業，研發替代役可合併申請。 

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【申請資格】 

1.日間部碩士在學生 

2.理工／資訊／數理相關科系，包括但不限於：電子、電機、機械、物理、化學、材料、數學 

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【獎學金金額】 

1.每月補助 10,000 元，補助 21 個月，共 21 萬元 

2.早鳥加碼：於收到訊息後 1 個月內完成報名，加發 10 萬元 

3.最高可拿 31 萬元獎學金 

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【申請程序】 

1.線上填寫報名問卷（必要） https://www.surveycake.com/s/oZoKK 

2.投遞 1111 履歷 

3.初步資格審查，通過者將另行通知面試日期 

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【預聘未來任用職務】 

1.製程工程師 

2.資訊工程師 

3.自動化工程師 

4.廠務工程師 

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【工作內容（包括不限於）】 

1.製程工程師 

(1)協助製程計畫執行與條件優化 

(2)製程良率分析、異常改善與品質提升 

(3)提升產品製程能力、穩定度與生產效率 

(4)材料改善、材料評估及新材料導入 

(5)跨部門協作，支援量產導入與技術改善專案 

2.資訊工程師 

(1)系統與程式開發：企業應用平台、資訊系統、Web 系統、API 與微服務開發、維護及架構設計 

(2)文件與系統管理：撰寫、維護與管理系統技術文件及作業紀錄 

(3)資料、AI 與自動化應用：資料前處理、分析、視覺化、特徵工程，開發自動化程式與 RPA 

(4)AI／機器學習與 LLM 應用：建置 AI／機器學習模型，導入 LLM 平台，包括 Prompt、SDK/API 與開源模型整合 

(5)進階技術與系統優化：參與 Edge AI、輕量型 AI 演算法、Big Data、IoT 架構、嵌入式運算與前後端框架整合 

(6)數據分析與專案支援：系統數據分析、異常追蹤改善，支援跨部門專案及主管指派工作 

3.自動化工程師 

(1)自動化系統與軟體開發：開發、測試與維護 Web 系統、MES 系統、資料視覺化平台與 HMI 

(2)AI 與智慧製造應用：導入 AI、機器學習、影像辨識與資料分析，支援數位化及智慧製造，整合供應鏈與客戶系統 

(3)設備與產線自動化設計：開發與導入自動化設備，治具／載具設計與改善，規劃與優化產線物流及資訊流 

(4)電控設計與產線效能提升：設計與整合 PC／PLC 電控系統，應用 AI 提升產線效率與穩定度 

(5)機器視覺與系統整合：開發視覺演算法，系統整合與軟硬體評估，規劃軟體架構與人機介面設計 

(4)專案執行與跨部門合作：參與 AI 與數位轉型專案、新技術研發與系統開發，專案管理、資料分析與系統優化，並執行主管指派工作 

4.廠務工程師 

(1)生產設備及廠房設施之維護、巡檢與改善 

(2)產線支援、效率提升及廠務運作管理 

(3)廠務安全、環境衛生與法規遵循之監控與落實 

(4)物料、物流與資源運用管理 

(5)數據分析及異常追蹤改善，文件、報告及作業紀錄維護，跨部門協作及專案支援 

(6)其他主管指派之廠務或專案相關工作