AI Server-CPLD/FPGA Engineer工程師 (土城)

* 負責雲端Server伺服器的相關工作 

1. Server platform BIOS development, validation, debugging. 

2. BIOS requirements implementation and issues fixed. 

3. Project handle and collaborate with customer and cross-functional teams.

Server & Storage Power validation:  

1. CPU Validation 

2. DDR5 Validation 

3. POL Validation 

4. E-fuse Validation 

5. System power consumption testing 

6. BMC fault log testing

CESBG 產品線: Server產品 

1.技術可行性分析  

2.硬體線路設計  

3.硬體設計審查和BOM產出  

4.審查 PCB Layout  

5.執行開機測試和執行除錯

1.工程師職缺: 

a. 負責x86-64伺服器操作測試，涵蓋的有: 測試與驗證系統功能(functional test)、相容性(options compatibility test)、效能(performance)、壓力承載(stress loading)、可靠度(RAS feature test)以及整合測試BIOS、BMC、與伺服器硬體所有配件 

b. 對發現的產品Defect能有初步的分析與Isolation test去收斂問題點 

c. 填寫並描述專案上發現的issue至Tracking system 

d. 基本溝通技巧和有邏輯/逆向思維 , 譬如能舉一反三或是反向思考 

2. 有Intel and AMD x86或ARM伺服器或x86 storage server, networking switch等硬體類產品經驗者尤佳 

3. 有伺服器當中主機板的研發與測試過程，具備問題診斷偵錯能力且對Defect敏感經驗者尤佳 

*畢業新生擁有電腦硬體裝修軟體應用證照亦可，1年以上電腦系統整合測試工程師經驗尤佳

1.測試環境架設2.測試問題除錯3.測試報表收集與分析4.信號量測5.辦公室/實驗室事務處理

1. Design, develop, and maintain test automation codebase such as Python/Bash/Powershell scripts 

2. Experience in manual/automation testing of server centric/rack-level validation 

3. Extensive communication and collaboration with stakeholders from firmware/BIOS/BMC/Silicon-Vendor teams for planning and developing solutions.

1. 負責帶領團隊規劃與建置Layer 2 Ethernet Switch系統整合測試 

2. 測試人力分配、測試涵蓋度與測試時程規劃與掌控 

3. 規劃建立自動化測試及改善研發驗證流程  

4. 團隊測試技術提升與規劃 

5. 跨部門溝通與協調

〝1. Layer 2/ 3 Switch 網路系統功能整合測試  

2. 規劃撰寫/編修測試計畫與測試架構  

3. Switch自動化測試與架構開發  

4. 測試驗證系統效能、壓力測試  

5. 建立測試環境與維護、改善測試程式與方法 〝

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.電控系統整合設計開發 

2.三電系統整合設計開發

主要是負責客戶的 SERVER/STORAGE 及 AI 產品 ODM 開發及製造。 

1. 線路及LAYOUT設計及REVIEW. (OrCAD及Allegro) 

2. 零件選用及規格評估. 

3. CPLD修改 (VerilogHDL) 

4. BOM建立及2nd source驗證. (CE協助導入系統) 

5. 短期On-site support for NPI bring up. (越南, 美國聖荷西等) 

6. debug, validation and provide report.

FPGA-數位電路研發/整合/驗證 

工作內容包含: 

1. SoC FPGA架構設計 

2. SoC FPGA整合 

3. 數位電路設計 

4. 數位電路驗證 

5. 系統平台驗證

1. 通訊設備系統研發 

2. IPCAM開發 

3. 物聯網產品研發(LPWAN GW, module/sensor, IoT platform)

1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 

2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 

3. Lead the FA/critical issues & find out the root cause 

4. Global EC handling 

5. JIRA handle & response  

6. New Product Transfer/Enablement into global factories 

7. 2nd Source technical evaluation

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 產品 bring up  

5. 產品功能性驗證, 製作測試報告 

6. 產品 RMA 分析 

7. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計

1. PCBA、PCB、2nd Source 

2. 2nd Source Library 

3. Release PCBA BOM 

4. Maintain SKU BOM 

5. Release PCBA BOM(PST) 

6. CIS 零件審核

負責產品：IP cam、Dash cam 

1. 影像品質調整 

2. 影像品質測試驗證 

3. 產線測試結果分析與確認 

4. 開發相機產品相關測試項目

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 零件評估選用 

5. 產品 bring up onsite support 

6. 產品功能性驗證, 製作測試報告 

7. 產品 issue 分析 debug 

8. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計 

9. Design study and Design proposal

1. 客戶技術問題的對應窗口。  

2. 對量產產品生命中期功能增強提供技術支援及物料驗證 (例如: 新硬件及軟件的驗證)。 

3. 重大客訴品質異常緊急介入，分析RMA不良數據，找出根本原因及給出解決方案。 

4. 工廠生產支援 (物料替代料評估，FW導入及EC發行)。

1.負責NB安規能耗前期設計與評審，確保産品符合安規能耗法規要求，降低Safety&Energy風險； 

2.負責NB安規能耗測試，制定測試計劃； 

3.執行Safety&Energy認證，確保產品如期取證； 

4.各階段協助安規能耗相關問題點分析，提供有效的整改方案