Application Specialist (Chemical Metrology) (新竹)

【Internship】2026 Lam Research 美商科林研發實習生計畫  

\ Launch Your Semiconductor Journey /  

為畢業在即的學士及碩士生，提供銜接職場的絕佳實習機會  

☆★☆ 3/14交大 3/21清大 現場面試 有機會當場獲得offer ! ☆★☆ 

若未得到通知，可現場排隊先搶先贏，現場履歷書審通過直接排主管面試  

(需準備紙本履歷 進行現場書審)  

實習計畫亮點：  

■專屬資深Buddy同事一對一指導  

■體驗外商文化 提升職場所需的國際視野與溝通能力  

■深入了解關鍵製程最先進設備 提前踏入半導體產業  

■優於市場的實習薪資 學習滿滿 + 賺多多  

■實習表現優異有機會直接獲得正職Offer  

職缺類別：  

Field Process Engineer (FPE) Interns 製程工程師實習生  

Field Service Engineer (FSE) Interns 設備工程師實習生  

暑期實習期間：2026/7/6 - 8/28 (全職實習)  

全年實習期間：2026/7/6 - 2027/06/30  

(暑假共8周，一周需到班5天 / 學期間可與主管協調一周可工作1-3天)  

申請資格：  

半導體相關科系，碩二以上在學生或應屆畢業生

o Supply/sustain on-site OCD / XPS / Raman / SIMS metrology solution support multiple modules, i.e., Litho/CMP/Etch/Dep.  

o Communicate and establish good relationship with customers for process & issue understanding.  

o Involve up-to-date new metrology technics / products / applications and perform pre-sales demo / presentations to customers.  

o Co-work with HQ or other subsidiaries (i.e., IL/US/CN/JP/SG) to develop new application solutions, able to support / work abroad.  

o Pro-actively maintain semiconductor knowledge from industry and international academic conferences.  

o Be highly sensitive in collecting market information.  

o Own presales activities for tools adoption/utilization.  

o Be flexible to cross-divisional activities per company’s requirements.  

if you are interested of this position please send your CV of below link:  

https://www.novami.com/comeetitem/3984c/

新產品/製程導入開發與優化

1.研究新技術、材料與解決方案 

2.新產品開發與導入

1.元件電性測試與分析 

2.TPL (Test Programming Language) 撰寫與 Debug  

3.Device tuning and model prepare  

4.跨部門溝通合作 

5.新產品電性測試 testkey 開發

1. Project schedule 制定與管控 

2. 協助新產品導入及驗證 

3. 熟悉 WP/AP/WT/FT 流程 

4. 熟悉產品應用及規格

1. 新產品導入 

2. 控制線上產品及異常分析 

3. 產品良率的提昇 

4. 元件電性測試與分析

1.蝕刻先進製程開發,熟悉實驗流程(實驗、評價解析、方案報告) 

2.協同客戶導入新裝置製程及新技術開發。 

3.維持現有Process Of Record及Trouble-shooting解決問題的能力。 

4.具良好溝通能力,理解客戶需求及跨部門有效溝通。

1.新產品導入 

2.控制線上產品及異常分析 

3.產品良率的提昇 

4.元件電性測試與分析

負責假日及夜間值班，依SOP執行機台保養、SPC異常及機況排除，並記錄機台參數 

1.假日及夜間值班 

2.依SOP執行機台保養,零件組裝與校正 

3.依SOP排除機況 

4.依SOP 處理SPC相關異常 

5.協助工程師生產管理之運作 

6.彙整報表與重要機台參數紀錄

聘僱期間預計至2026/12月 

1.依SOP執行機台保養、SPC異常及機況排除，並記錄機台參數 

2.依SOP執行機台保養,零件組裝與校正 

3.依SOP排除機況 

4.依SOP 處理SPC相關異常 

5.協助工程師生產管理之運作 

6.彙整報表與重要機台參數紀錄

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 

Responsibilities: 

Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 

1. Develop and maintain baselines, including setting up recipes. 

(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. 

(2) Responsible for transferring metrology solutions to volume manufacturing. 

2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. 

(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. 

(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.