【PI-DQE】可靠性測試工程師

1.測試環境架設2.測試問題除錯3.測試報表收集與分析4.信號量測5.辦公室/實驗室事務處理

1. Design, develop, and maintain test automation codebase such as Python/Bash/Powershell scripts 

2. Experience in manual/automation testing of server centric/rack-level validation 

3. Extensive communication and collaboration with stakeholders from firmware/BIOS/BMC/Silicon-Vendor teams for planning and developing solutions.

CESBG-產品線Server  

1.工程師職缺: 

a. 負責x86-64伺服器操作測試，涵蓋的有: 測試與驗證系統功能(functional test)、相容性(options compatibility test)、效能(performance)、壓力承載(stress loading)、可靠度(RAS feature test)以及整合測試BIOS、BMC、與伺服器硬體所有配件 

b. 對發現的產品Defect能有初步的分析與Isolation test去收斂問題點 

c. 填寫並描述專案上發現的issue至Tracking system 

d. 基本溝通技巧和有邏輯/逆向思維 , 譬如能舉一反三或是反向思考 

2. 有Intel and AMD x86或ARM伺服器或x86 storage server, networking switch等硬體類產品經驗者尤佳 

3. 有伺服器當中主機板的研發與測試過程，具備問題診斷偵錯能力且對Defect敏感經驗者尤佳 

*. 畢業新生擁有電腦硬體裝修軟體應用證照亦可，1年以上電腦系統整合測試工程師經驗尤佳

1. 負責帶領團隊規劃與建置Layer 2 Ethernet Switch系統整合測試 

2. 測試人力分配、測試涵蓋度與測試時程規劃與掌控 

3. 規劃建立自動化測試及改善研發驗證流程  

4. 團隊測試技術提升與規劃 

5. 跨部門溝通與協調

〝1. Layer 2/ 3 Switch 網路系統功能整合測試  

2. 規劃撰寫/編修測試計畫與測試架構  

3. Switch自動化測試與架構開發  

4. 測試驗證系統效能、壓力測試  

5. 建立測試環境與維護、改善測試程式與方法 〝

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1. Server Liquid Cooling System Control Firmware Development 

2. Server Liquid Cooling System Control Circuit Design 

3. Server Liquid Cooling System Control System Analysis

嵌入式系統軟韌體開發/產測程式開發BMC 韌體開發

針對行動通訊5G模組與5G Mi-Fi產品 

1. 進行PTCRB/GCF 3GPP RF/Protocol 一致性測試 (到PTCRB/GCF Lab). 

2. 到美、歐、日進行各國電信業者入網測試.(一致性/IOT/Field Trial測試). 

3. 研究與了解各國電信業者入網流程或技術需求.

1. BMC韌體測試 

2. BMC韌體測試規劃、計劃書撰寫 

3. BMC自動測試程式開發 

4. BMC問題定位與溝通

1.公司品質總體方針政策製定，品質戰略目標﹑指標製定﹐客戶滿意度計划(指標)製定 

2.對接客戶處理品質問題，能夠靈活、快速應對客戶需求； 

3.品質成本分析評估，品質費用管控 

4.品質事件的協調與處理，客戶抱怨處理，品質資源統籌

1. 建立和完善製程質量管理體系，監督過程PPAP/ 5M1E變更管理 

2. 製程品質風險識別和改進 

3. 製程品質團隊管理和能力建設  

4. 指導各階段品質標準的制定和維護 

5. 指導生產過程中品質異常分析與改進 

6. 工作流程、方法、工具、系統的優化和完善 

7. 內外部品質相關標準拉通

主要職責： 

開發各種新世代寬頻通訊設備之軟體/韌體。 

1. 資工/電子/電機/通訊系所專業尤佳，熟C/C++、Java、Linux、Embedded System、TCP/IP等網路通訊協定 

2. 二年以上網路通訊產品軟體開發經驗尤佳

1. 參與高階網路交換機的硬體架構設計與系統規劃 

2. 設計並驗證 PCB 電路板，確保高速訊號完整性與可靠性 

3. 整合 ASIC/FPGA、SerDes、PHY 等高速晶片模組 

4. 開發與測試 100G/400G/800G Ethernet 介面及光模組整合 

5. 進行硬體 bring-up、功能驗證與效能測試 

6. 與韌體/軟體工程師合作，確保硬體與系統整合順暢 

7. 撰寫技術文件、測試報告，並支援量產與品質控管

負責產品：網路交換機/網卡 

主要職責： 

1.架設與維護自動化測試機台，確保系統穩定與可擴充性 

2.開發與維護測試腳本（Shell Script、Python），提升測試效率 

3.在 Linux 平台上進行系統安裝、配置與效能調校 

4.整合測試工具與框架，支援持續整合 (CI/CD) 流程 

5.分析測試結果，撰寫報告並提出改善建議 

6.與研發團隊合作，設計並優化測試流程 

7.支援越南工廠測試平台建置與維運（需配合出差）

1. 執行並跟進 AI 數據中心的驗收與品質管控規範。 

2. 規劃並執行測試計劃：硬體、軟體、系統整合。 

3. 跟進測試流程及成果, 確保AI 數據中心可靠性與安全性。 

4. 與產品、專案、工程團隊合作，追蹤缺陷並推動修復。 

5. 定期提供品質數據報告，持續優化產品穩定性與運行效率。

1.機器人／智慧設備之品質保證規劃與執行（含軟體、硬體、系統整合）。 

2.建立與維護測試計畫、測試案例（Test Plan / Test Case），執行功能、系統、整合與回歸測試。 

3.協助產品開發階段之品質風險分析（如 FMEA、問題追蹤與改善）。 

4.與研發、產品管理、製造及供應商跨部門溝通，確認品質需求與改善對策。 

5.協助撰寫與審查品質相關文件（測試報告、規格書、驗證文件）。 

6.與日方團隊或客戶進行技術溝通，支援日文會議與文件對應。

1. 儲存器/伺服器系統整合測試及功能驗證 

2. 軟/軔體測試規劃與執行 

3. 客戶問題分析與驗證. 

4. 自動化測試程式開發 

5. 撰寫測試報告及擔任與客戶的溝通窗口.

負責ODM產品於開發過程中之設計品質監控、分析、確認與管理，確保產品設計階段符合品質標準與專案進度要求 

主要職責： 

1.參與新產品設計需求及規格問題的討論及改善對策 

2.協調及確認新產品驗證測試計劃和資料庫 

3.定期稽核研發部門設計審查執行情況 

4.DFMEA,PFMEA等問題彙總及跟蹤 

5.判定產品研發狀態是否符合進階門檻 

6.產品設計質量問題的跟蹤，督促和協調各部門解決問題的進度 

7.產品設計問題的客訴案件跟進

(embedded Linux experience acceptable if no prior OpenBMC exposure). 

2.Implement and integrate low-level drivers (U-Boot, Device Tree, Kernel), covering I2C, SPI, PMBus, GPIO, and other interfaces. 

3.Build and maintain BMC sensor monitoring, FRU/SDR tables, fan/power control, and event log systems. 

4.Implement management protocols and firmware update mechanisms (IPMI, Redfish, PLDM, MCTP). 

5.Integrate Secure Boot / TPM / SPDM security frameworks. 

6.If experienced with NVIDIA HGX/DGX/NVSwitch projects, support GPU power/thermal control, firmware updates, and OOB management integration. 

7.Prepare design documents, test plans, mass production support materials, and debug reports.