技術工程類 - HW/硬體應用工程師FAE【台北/高雄】

1. Participate in the design and development of Base-Band or RF HW System-in-Package(SiP) modules 

2. Use simulation tools such as Cadence, HFSS, Siwave and ADS for design verification and optimization 

3. Electrical measurements using power supplies, oscilloscopes, VNAs, and signal generators 

4. SiP module schematic design, layout planning and BOM release 

5. Collaborate with packaging, layout, and process teams to evaluate the impact of SiP, fan-out, and substrate structures on electrical performance

1.產品相關功能研發、相容性測試及驗證  

2.設計與評估機板硬體、線路、訊號量測/Debug  

3.規劃 PCB layout 佈局、線路繪製  

4.選擇符合品質需求之電子料零件(BOM release)  

5.時程安排、專案管理及流程掌控，與客戶進行溝通並瞭解需求