EMC工程師

1. 負責帶領團隊規劃與建置Layer 2 Ethernet Switch系統整合測試 

2. 測試人力分配、測試涵蓋度與測試時程規劃與掌控 

3. 規劃建立自動化測試及改善研發驗證流程  

4. 團隊測試技術提升與規劃 

5. 跨部門溝通與協調

〝1. Layer 2/ 3 Switch 網路系統功能整合測試  

2. 規劃撰寫/編修測試計畫與測試架構  

3. Switch自動化測試與架構開發  

4. 測試驗證系統效能、壓力測試  

5. 建立測試環境與維護、改善測試程式與方法 〝

Server, storage產品之DC-DC 電路設計, layout / placement review, 除錯, 驗證

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1.數位邏輯設計並熟悉RTL Coding架構。 

2.熟悉 Xilinx、Altera FPGA 架構與設計。 

3.研發設計網通應用IP。 

4.協助開發與驗證FPGA電路(Schematic)。

1. 負責雲端Server的專案工作 

2. 與一線大廠合作機會 

任何都會更新在粉絲專頁上喔！粉絲專頁如下↓↓ 

粉絲專頁：https://www.facebook.com/鴻海集團-鴻佰科技實習生新幹班專案-109654178264949 

• 鴻海集團 Fii 雲運算產品事業群提供有志朝產業發展的同學實習之工作機會。 

• 同學將與專業團隊一起工作學習，以得到更多將理論應用到實際工作的機會！ 

• 計畫介紹： 

• 職缺內容： 新幹班 (大學四年級或碩士二年級畢業生) 

• 應徵時間：即日起至2024/4/26(五) 

• 報到日 ：2024/6~ (依學生時程狀況調整) 

※若有個人中英文履歷，歡迎與應徵申請一起寄出 

實習生/新幹班職缺表: https://lnkd.in/g5SNPyxR 

投遞履歷表時, 煩請同時回覆 

1.申請表格  

https://docs.google.com/document/d/1ifPNL70V77wvSGYWXHV57Ftq3sxhmyK3/edit 

2.有興趣職缺類型或編號

1. 負責伺服器與機櫃佈線規劃與cable設計開發。 

2. 伺服器與機櫃系統整合、組裝與可操作性評估。 

3. 提供產品生產相關文件(組裝文件, BOM...)並解決工廠組裝製造問題。 

4. 負責伺服器與機櫃上的相關label設計。 

********** 

1. Design Server internal cable. 

2. Server and Rack cabling evaluation and design.  

3. Server and Rack manufacturing assembly processes and serviceability evaluation. 

4. Release manufacture document and solve DFx problem.  

5. Design label for server and rack system.

【工作內容】 

1.資訊機房維運管理，熟悉虛擬主機ESXi管理、維護與備份。 

2.伺服器、網路規劃、維護與管理。 

3.系統事件處理、日誌監控分析與管理。 

4.資訊安全管理系統執行及持續改善。 

5.支援IT專案任務及主管交辦事項。 

6.熟悉電腦與伺服器硬體與規格，TCP/IP網路、防火牆、Router、Switch、VPN。 

7.Kubernetes/Openstack/Red hat 管理、維護與備份。

1.電控系統整合設計開發 

2.三電系統整合設計開發

主要是負責客戶的 SERVER/STORAGE 及 AI 產品 ODM 開發及製造。 

1. 線路及LAYOUT設計及REVIEW. (OrCAD及Allegro) 

2. 零件選用及規格評估. 

3. CPLD修改 (VerilogHDL) 

4. BOM建立及2nd source驗證. (CE協助導入系統) 

5. 短期On-site support for NPI bring up. (越南, 美國聖荷西等) 

6. debug, validation and provide report.

FPGA-數位電路研發/整合/驗證 

工作內容包含: 

1. SoC FPGA架構設計 

2. SoC FPGA整合 

3. 數位電路設計 

4. 數位電路驗證 

5. 系統平台驗證

1.獨立進行自動化電控專案開發 

2.自動化電氣整體方案規劃及評估 

3.電子電路設計及Layout、電氣原理圖設計、PLC&HMI編程 

4.新技術開發&驗證 

5.驗證問題點收集反饋及進度追蹤

1. Smartphone新產品導入階段硬體研發和測試驗證 

2. 聲學、光學相關模組設計、驗證和試產 

3. 負責聲學、攝像模組、觸屏等相關模組失效分析與技術驗證 

4. 具備英文溝通能力以與客戶技術研討 

5. 配合出差美國協助客戶設計開發與測試驗證 

6. 因業務需求可能要出差或長駐海外

‘- Serve as a PM for Product Design team. 

- Working closely with customers and back-end teams to create quality products 

- Providing design insight and innovative ideas to teams 

- Supporting customers through out the design and manufacturing stages with organized reports and efficient management of resources.

1. 通訊設備系統研發 

2. IPCAM開發 

3. 物聯網產品研發(LPWAN GW, module/sensor, IoT platform)

1. 企業等級WiFi 7 AP router硬體開發 

2. IOT 無線相關產品開發

1. RFP Technical response: Generate H/W Documents as FRU Spec., Qual-Checklist, ProgramIC List, DMI spec., etc… 

2. Manufacture Engineering: Technical support/debug for global factories especially for testing. 

3. Lead the FA/critical issues & find out the root cause 

4. Global EC handling 

5. JIRA handle & response  

6. New Product Transfer/Enablement into global factories 

7. 2nd Source technical evaluation

* 負責雲端Server伺服器的相關工作 

- 硬體/電源/ 訊號量測/ 系統整合測試/ 專案管理/ 各項職務 

• 計畫介紹：  

• 實習期間：即日起-2026/6 (長期實習-半年or 一年) 

• 職缺內容: 實習生 (在學學生) 

• 實習薪資: 時薪(一週2天以上)，優於基本工資 

※完整一年期滿轉正過試用期另外有奬金哦~~ 

實習生職缺表: https://reurl.cc/Xq0OX3

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 產品 bring up  

5. 產品功能性驗證, 製作測試報告 

6. 產品 RMA 分析 

7. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計

1. 熟悉電路設計與pcb layout 軟體,,  

2. 熟悉VNA/SCOPE操作, DEBUG能力佳, 

3. 具獨立思考與解決問題能力,  

4. 需有團隊合作精神。 

5. 其他主管交辦事項。