【竹南】製程助理工程師

1、生產計畫實施與改善。 

2、製程異常分析與改善。 

3、生產效率提升與改善 

4、生產出貨達交掌握。

1.新產品導入 

2.控制線上產品及異常分析 

3.產品良率的提昇 

4.元件電性測試與分析

1. 產品異常處理：解決線上製程問題，協助新製程導入與技術移轉。 

2. 製程良率改善及生產成本降低之專案。

1. 定期維護、保養生產設備機台，並進行故障排除、異常分析與追蹤處理。 

2. 規劃生產設備之操作順序，以便正確使用設備，進而提升生產效率。 

3. 進行設備改造、升級或開發，以便提升設備的生產力。 

4. 規劃有關設備空間的安排，並說明規劃的功效。 

5. 評估新設備之整體效能，並將通過評估的新設備導入產線。

1.巡檢異常查核-系統巡檢抄表及設備運轉操作 

2.巡檢異常查核-執行能資源供應及化學品用量統計分析 

3.巡檢異常查核-執行例行日常設備維護/操作及作業環境6S 

3.巡檢異常查核-各單位反應事項應急處理 

4.巡檢異常查核-執行異常發生時系統的轉換機及收集三現資料 

5.其他上級交辦

1. 修訂規範文件 

2. a. 負責新進員工訓練 / 定期員工回訓 

b. 評鑑專有技能修訂/訓練教材增刪修 

3. 執行新人面試/定期訪談新人 

4. 執行工廠巡檢稽核, 配合客戶年度稽核 / ARR audit 

5. 其他上級交辦事項

1. 確認STR下線合理性 

2. 把關特殊作業需求,規劃產線執行 

3. 問題點蒐集-作業問題點追蹤&改善 

4. 製造面變更需求合理性確認 

5. 執行面問題點蒐集 

6. fanout進度追蹤

1、產品分析報告 

2、新產品導入 

3、測試程式撰寫、維護 

4、異常分析及處理 

5、良率改善 

6、報表製作及工程分析

生產排程控管、進出貨進度掌握及與客戶溝通協調

1、機器設備的異常排除/維修 

2、機器設備的日常保養/維護 

3、異常分析及報表製作

1. 處理案子之硬體線路繪製、製作、除錯及測試。 

2. 電子電路設計及測試程式設計。 

3. 操作測試設備，並評估元件、模組或系統的正確性和性能。 

4. 與產線工程師和客戶工程人員合作、鑑定、確認及解決相關研發的問題。 

5. 提供電子方面的技術協助和解決方法。 

6. 開發進度訂定、管理與產品規格書編寫。 

7. 協助業務單位瞭解客戶需求。

1、產品分析報告 

2、新產品導入 

3、測試程式撰寫、維護 

4、異常分析及處理 

5、良率改善 

6、報表製作及工程分析

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 

Responsibilities: 

1. Advanced panel level packaging development for CoPoS technology. 

2. Exploratory panel level packaging process/material/tool development for new applications. 

3. Process stability/manufacturability improvement for yield and reliability qualification. 

4. Responsible for transferring the process/material/tool for mass production. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.