【竹南】製程工程師

1.安排及確認產出-確認及督導人員&機台作業/處置產出不足 

2.執行DRB/追蹤異常處置&反應及協助處理品質異常。 

3.反應或回饋內外部/客戶需求資訊。 

4.督導產品Q-TIME管制符合規範。 

5.工作交接-交接進度/WIP/品質/相關事項 

6.檢討異常-檢討異常人員。 

7.稽核產線-確認人員工作紀律/6S。

1.新產品導入 

2.控制線上產品及異常分析 

3.產品良率的提昇 

4.元件電性測試與分析

1. 產品異常處理：解決線上製程問題，協助新製程導入與技術移轉。 

2. 製程良率改善及生產成本降低之專案。

【職缺】 

一、應屆畢業(學士)職缺為產品/設備/配件工程師 :  

◆產品工程師：  

1.產品分析報告  

2.新產品導入  

3.測試程式撰寫、維護  

4.異常分析及處理  

5.良率改善  

6.報表製作及工程分析  

◆設備工程師：  

1.機器設備的異常排除/維修  

2.機器設備的日常保養/維護  

3.異常分析及報表製作  

◆配件工程師：  

1.Probe card異常維修/保養與分析  

2.熟電子電路分析異常排除配件管理與維護  

二、應屆畢業(碩士)職缺為產品/資訊/研發/測試開發工程師 :  

◆產品工程師：  

1.產品分析報告  

2.新產品導入  

3.測試程式撰寫、維護  

4.異常分析及處理  

5.良率改善  

6.報表製作及工程分析  

◆資訊工程師： 

1、協助跨部門資訊整合 

2、協助工程資料收集、生產狀況監控 

3、協助生產資訊系統開發與維護 

4、協助確保客戶生產資訊傳送正確與即時性 

◆研發工程師： 

1、測試設備(機台)研發 

2、電子電路設計 

3、軟硬體整合測試 

◆測試開發工程師： 

1. 處理案子之硬體線路繪製、製作、除錯及測試。  

2. 電子電路設計及測試程式設計。  

3. 操作測試設備，並評估元件、模組或系統的正確性和性能。  

4. 與產線工程師和客戶工程人員合作、鑑定、確認及解決相關研發的問題。  

5. 提供電子方面的技術協助和解決方法。  

6. 開發進度訂定、管理與產品規格書編寫。  

7. 協助業務單位瞭解客戶需求。

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 

Responsibilities: 

1. Advanced panel level packaging development for CoPoS technology. 

2. Exploratory panel level packaging process/material/tool development for new applications. 

3. Process stability/manufacturability improvement for yield and reliability qualification. 

4. Responsible for transferring the process/material/tool for mass production. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.