【竹南】測試工程支援工程師

【職缺】 

一、應屆畢業(學士)職缺為產品/設備/配件工程師 :  

◆產品工程師：  

1.產品分析報告  

2.新產品導入  

3.測試程式撰寫、維護  

4.異常分析及處理  

5.良率改善  

6.報表製作及工程分析  

◆設備工程師：  

1.機器設備的異常排除/維修  

2.機器設備的日常保養/維護  

3.異常分析及報表製作  

◆配件工程師：  

1.Probe card異常維修/保養與分析  

2.熟電子電路分析異常排除配件管理與維護  

二、應屆畢業(碩士)職缺為產品/資訊/研發/測試開發工程師 :  

◆產品工程師：  

1.產品分析報告  

2.新產品導入  

3.測試程式撰寫、維護  

4.異常分析及處理  

5.良率改善  

6.報表製作及工程分析  

◆資訊工程師： 

1、協助跨部門資訊整合 

2、協助工程資料收集、生產狀況監控 

3、協助生產資訊系統開發與維護 

4、協助確保客戶生產資訊傳送正確與即時性 

◆研發工程師： 

1、測試設備(機台)研發 

2、電子電路設計 

3、軟硬體整合測試 

◆測試開發工程師： 

1. 處理案子之硬體線路繪製、製作、除錯及測試。  

2. 電子電路設計及測試程式設計。  

3. 操作測試設備，並評估元件、模組或系統的正確性和性能。  

4. 與產線工程師和客戶工程人員合作、鑑定、確認及解決相關研發的問題。  

5. 提供電子方面的技術協助和解決方法。  

6. 開發進度訂定、管理與產品規格書編寫。  

7. 協助業務單位瞭解客戶需求。

1、生產計畫實施與改善。 

2、製程異常分析與改善。 

3、生產效率提升與改善 

4、生產出貨達交掌握。

此角色需與多單位協作支援整體運作，適合能在制度與流程中溝通協調、為系統穩定提供支持的人。 

1.IM應用導入－執行IM提案內容修訂 

2.IM應用導入－修訂URD&UAT Spec 文件 

3.IM應用導入－執行整合測試 

4.IM應用導入－執行UAT 

5.IM應用導入－執行標準化(產出技術/管理/操作規範) 

6.IM應用導入－執行POC與Fan out 

7.IM應用導入－執行&回復機台電腦防護能力 

8.其他上級交辦事項

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. 

Responsibilities: 

1. Advanced panel level packaging development for CoPoS technology. 

2. Exploratory panel level packaging process/material/tool development for new applications. 

3. Process stability/manufacturability improvement for yield and reliability qualification. 

4. Responsible for transferring the process/material/tool for mass production. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.