網路交換機硬體(資深)工程師(土城/新竹)

We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs.  

Responsibilities include:  

• Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. 

• Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. 

• Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. 

• Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes 

• Contribute to validation team on improving test plan/method to validate features and verify fixes 

• Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool 

• Define and drive the system debug process implementation and ingredient owner engagement and alignment 

Qualifications: 

The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following:  

• Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform 

• Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels 

• Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred 

• Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. 

• Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. 

• Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; 

• Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.

1. Server Liquid Cooling System Control Firmware Development 

2. Server Liquid Cooling System Control Circuit Design 

3. Server Liquid Cooling System Control System Analysis

嵌入式系統軟韌體開發/產測程式開發BMC 韌體開發

針對行動通訊5G模組與5G Mi-Fi產品 

1. 進行PTCRB/GCF 3GPP RF/Protocol 一致性測試 (到PTCRB/GCF Lab). 

2. 到美、歐、日進行各國電信業者入網測試.(一致性/IOT/Field Trial測試). 

3. 研究與了解各國電信業者入網流程或技術需求.

1. BMC韌體測試 

2. BMC韌體測試規劃、計劃書撰寫 

3. BMC自動測試程式開發 

4. BMC問題定位與溝通

【工作內容】 

1.資訊機房維運管理，熟悉虛擬主機ESXi管理、維護與備份。 

2.伺服器、網路規劃、維護與管理。 

3.系統事件處理、日誌監控分析與管理。 

4.資訊安全管理系統執行及持續改善。 

5.支援IT專案任務及主管交辦事項。 

6.熟悉電腦與伺服器硬體與規格，TCP/IP網路、防火牆、Router、Switch、VPN。 

7.Kubernetes/Openstack/Red hat 管理、維護與備份。

1. 企業等級WiFi 7 AP router硬體開發 

2. IOT 無線相關產品開發

1. Cable design and cable routing fitting  

2. Board level TAL maintain and system BOM maintain 

3. Board level & system assembly SOP design 

4. Label matrix design and management 

5. Manufacture trouble shooting

1. Cable design and cable routing fitting  

2. Board level TLA maintain and system BOM maintain 

3. Board level & system assembly SOP design 

4. Label matrix design and management 

5. Manufacture trouble shooting

1. 產品線路設計 

2. 產品 PCB佈局設計 

3. 生產 BOM發行 

4. 零件評估選用 

5. 產品 bring up onsite support 

6. 產品功能性驗證, 製作測試報告 

7. 產品 issue 分析 debug 

8. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計 

9. Design study and Design proposal

1. 網通/影音相關產品RF設計 

2. 電路圖設計/ PCB佈局設計 

3. WiFi/BT/Tuner RF電路設計/ 調校/ 驗證/ 除錯 

4. 4G/5G Antenna fine tune and design

主要職責： 

開發各種新世代寬頻通訊設備之軟體/韌體。 

1. 資工/電子/電機/通訊系所專業尤佳，熟C/C++、Java、Linux、Embedded System、TCP/IP等網路通訊協定 

2. 二年以上網路通訊產品軟體開發經驗尤佳

1. 系統平台上的使用者介面視覺設計  

2. 以使用者中心設計為原則，設計直覺又優美的使用者介面  

3. 使用者介面上的共用元件視覺設計及相關使用文件產出  

4. 軟體介面上所需的圖像及動態設計  

5. 使用者介面設計的易用性評估與改善

* 雲平台產品的售前與售後支持 

* 提供維運團隊技術支援 

* 對用戶需求做分析及提供解決作法 

* 對團隊內部及合作單位進行教育訓練

開發各種新世代寬頻通訊設備VoIP, ADSL, WLAN, Cable Modem, Ethernet、Home Lans, Internet Appliances, STB, WiMax, IP Phone, Video Phone, Smart Phone ....之軟體/韌體

Ethernet Switch Development : 

1. Linux related device drivers 

2. Linux Kernel/driver/BSP Porting and Integration 

3. BMC/IPMI related firmware

1. 根據客戶應用需求,提供雲端產品技術整合之系統架構,提供符合客戶需求之產品服務 

2. 跨部門協調研發及生產單位,提供系統整合產品服務 

3. 研究及分析雲服務市場需求並設計符合客戶需求之產品

Hardware circuit design, layout, pilot run and debug of telecomm / datacomm products. (Router / Switch / Server)

1. Discuss with customer, come out proposal, review and negotiate design spec. if any change 

2. Survey & review proper compoents for system design. 

3. Schematic design, come out constrain guideline for layout and layout design/review 

4. Measure signal integrity and address them if any issues. 

5. Collaborate with functional teams for product qualification and troubleshooting. 

6. Cooridinate with MFG team for material pipeline, manufacturing proto unit and manufacturing test.

1. 負責無線產品天線研發設計測試 

2. 新產品研發到量產的技術轉移及製程改善 

3. 新技術量測規劃(5G及毫米波量測)