[Server]機櫃系統工程師(大溪)

負責企業 AI 平台（多雲 + 地端）的建置與維運，提供 GPU 運算、模型訓練與推論，以及 AI 服務能力。此角色涵蓋平台架構設計、資源管理與系統整合，並與內部使用單位、IT 團隊及外部廠商協作，推動 AI 平台穩定落地與持續優化。工作內容如下： 

1. 建置與維運企業 AI 平台 

2. 管理 GPU 資源與訓練/推論環境 

3. 部署與整合 Kubernetes、Run:ai、NVIDIA AI 平台相關元件 

4. 建置 AI 服務對外存取架構（Ingress / API Gateway） 

5. 建置監控系統，確保平台穩定性 

6. 與內部單位、IT與原廠協作，推動需求落地 

7. 撰寫架構文件、SOP 與維運文件 

8. 進行平台測試（HA、Autoscaling、Failover、資源隔離與權限控管） 

9. 支援基礎 IT Infra（Server / Network / Storage / Linux）

我們正在尋找對流程自動化有興趣的 RPA工程師，加入我們的團隊， 一起用 RPA 與 AI 解放大家的時間與想像力！主要的工作內容如下: 

1. 與各部門合作導入流程自動化，優化作業流程、提升效率 

2. 分析現有流程，設計並開發 RPA 機器人（如 UiPath、Power Automate） 

3. 維護與優化自動化流程，處理錯誤並提升執行穩定度 

4. 撰寫流程設計文件與操作手冊，協助團隊落地執行 

5. 協助評估導入效益，整理分析數據與報告 

6. 參與 RPA 結合 AI 的應用開發，讓流程更智慧、更高效

1. Datacenter Server or Automotive power DC to DC , HSC,.. circuit schematic & layout design. 

2. PowerDC / Simplis / PDN simulation. 

3. LDO/POL/Multiphase VRD power circuit debug & optimize solution implement. 

4. CPU / chipset IC spec & document study & review check. 

5. Project schedule follow up and issue tracking. 

6. CN/EN communication with tier-1 customer/team. 

7. Future & Innovation DC regulation technology development.  

8. LabView / Python automation SW development.

參與新世代 液冷式 AI 伺服器機架（Liquid Cooling Rack） 之規劃、設計與導入，主要工作包含： 

•液冷管路佈局設計：負責 Rack 或 Server Node 內液冷管路（Tubing）配置與路徑規劃。 

•機構設計整合：將管路、Manifold、Quick Disconnect（QD）、CDU、Pump 等液冷元件整合至 Node／Rack 結構中。 

•液冷模組組裝與成本分析：BOM 編製、組裝流程設計、維修性與可製造性評估。 

•跨團隊協作：與 Thermal、Power、AE 及供應鏈廠商協作，完成整櫃液冷方案導入與量產。

1. Handle ECRs/ECOs for Cross Design-sites/ Projects/ Customers 

2. Collaborate the change requests throughout lifecycle of a given product 

3. Assure the change(s) are comply with Product spec/ MFG process / World-Wide MFG activities/ MFG plant specific requirements / Service activities 

4. Assure the change(s) of the engineering drawings, other related documentation, and applicable databases are adequately and accurately described in each ECO 

5. PDM/SAP/MCL/KM platform operation and building part library

1. 專案設計：負責 AWS 伺服器相關產品（包含 PCBA、系統與機櫃）之機構與 Cable 設計。 

2. 解決方案提供：依據產品規格與設計規範，提供機構零件、系統及 PCBA 的最佳設計解決方案。 

3. 驗證與量產：鐵/塑膠等模具試模；樣品試組驗證；機構零組件承認，使產品符合量產標準。 

4. 技術文件管理：提供內部團隊、客戶及供應商機構相關的產品規格與要求（如 2D/3D 工程圖）。 

5. 系統維護：負責 BOM 表的建立與維護，並操作 PDM 系統進行相關管理。 

6. 問題分析：分析並解決產品機構相關問題，匯整資料並提供建議報告或解決方案。 

7. 跨部門協作：與跨部門團隊、客戶及供應商進行溝通協調，確保設計與物料時程順暢。

1. Responsible for schematics capture, layout checking , BOM generating, and debugging and testing of server mother boards/add-in cards/backplane / GPU products. 

2.Collaborate with layout engineers, validation engineers, software engineers, firmware engineers, power engineers and other teams to discover and solve any issues of designs in early stage to ensure and enhance the quality of the products. 

3.Accomplish the products to conform to engineering specifications , customer performance expectations. 

4. Perform other duties as assigned.

1.伺服器相關系統板卡硬體規劃與設計 

2.AI加速卡JDM/ODM 專案硬體設計 

3.硬體線路分析與debug 

4.客戶需求分析與規劃

1.負責機器人（例如機械手臂、腿部機器人或機器狗）設備及週邊設備的電氣控制，包括系統設計、配電測試和訊號整合。 

2.負責機器人產品控制器板/電源管理板/感測器集線板/馬達驅動的電路設計(Schematic)、佈局檢查(Layout)、BOM物料清單、驗證與除錯。 

3.負責機器人手臂的電控箱配電與placement規劃。 

4.協助架構師完成系統硬體架構設計。 

5.跨部門合作與軟體、機構、AI等團隊協作，確保機電整合的有效性並支持整體系統的開發需求。

1.依據規格及設計規範提供機構解決方案 

2.參與樣品測試與驗證，確保設計可靠度，讓量產順利 

3.專案量產後，機構部件的變更及BOM維護

1.Design and integrate automotive power electrical systems, considering performance, reliability, and cost-effectiveness. 

2.Conduct simulation and modeling of power electronic circuits and components. 

3.Perform testing and validation of power electronics hardware and software. 

4.Collaborate with cross-functional teams to integrate power electronics into vehicle systems. 

5.Ensure compliance with automotive industry standards and regulations. 

6.Troubleshoot and resolve issues related to power electronics systems. 

7.Develop and maintain technical documentation and design specifications. 

8.Participate in design reviews and provide technical input and guidance.

1.Review electronic circuit designs and PCB layouts to ensure EMC compliance. 

2.Recommend and implement design modifications to mitigate potential EMI issues. 

3.Collaborate with cross-functional teams (hardware, software, power, RF, etc.) to integrate EMC strategies into product development. 

4.Ensure product compliance with relevant EMC standards and regulatory requirements (CISPR, ISO, FCC, etc.). 

5.Stay updated on emerging EMC standards, technologies, and industry practices. 

6.Train team members on EMC best practices and design methodologies. 

7.Work with test labs and certification bodies to define EMC validation plans and ensure regulatory compliance for automotive products. 

8.Develop and manage EMC design requirements, guidelines, and documentation.

1. 伺服器產品結構CAE設計分析 

2. 伺服器產品結構振動衝擊測試

Role/Job Name: Server Product Planning Management / Server System Architect  

1. Early Engagement and POC(Proof of Concept) with customers. 

2. Key components survey and industrial technology study. 

3. Cross-function collaboration to generate proposal based on Customer’s RFP/RFQ. 

4. Provide total solution for customers by integrate key partners solutions. 

5. Work with team as system lead(SL) from design proposal to early design stage. 

6. 3 years of Server EE/ME background is preferred. Be familar with Server system. 

7. Positive, proactive, optimistic, outgoing and willing to take any challenge.

1.機構設計：負責機械手臂、自主移動機器人之機構設計，包含結構架構設計、部件布局、減震設計與散熱管理，確保機構穩定性與高效性能。 

2.機電整合：進行機器人機電整合，包含驅動系統（馬達、驅動器）與傳感器配置，並整合動力學與控制系統，確保機器人運動過程之各項性能(速度/精度等)。 

3.原型製作與測試：負責設計並製作機器人原型，並進行性能測試與驗證，對設計進行持續優化，確保達到應用需求。 

4.跨部門合作：與軟體、電子、控制系統、AI等團隊協作，確保機電整合的有效性並支持整體系統的開發需求。

1.負責電子、PCB或機構料件承認與品質管理  

2.建立進料檢驗標準，協助IQC零件異常判定  

3.處理材料品質異常與異常改善  

4.建立料件資料庫與供應商平台維護與管理  

5.召開供應商品質會議，推動品質持續改善活動執行零部件供應商定期稽核活動  

6.偕同RD及採購部門執行新供應商遴選/評鑑  

7.負責供應商品質管理、輔導、稽核與評鑑 8.執行零部件供應商定期稽核活動

1.Acoustics-related product design. 

2.Automotive-related product design. 

3.Schematic design on board level. 

4.Hardware specification writing , schematic drawing using Concept tool 

5.Set signals routing constrain, Co- work with layout engineer, FA analysis

1. PCB疊構與阻抗設計.  

2. Signal Integrity與Power Integrity的模擬與分析. 

3. Layout 的rule制定與審核. 

4. 訊號量測的審核與除錯. 

5. 流程自動化改進與in-house utilities開發. 

6. TDR/VNA量測.

(1)Responsible for automotive product development: part survey,  

schematics capture, layout checking, simulation, BOM  

generating, debugging and testing. 

(2)Responsible for automotive product development documents:  

DFMEA, PPAP…etc 

(3)Collaborate with layout engineers, validation engineers,  

software engineers, firmware engineers, power engineers and  

other teams to discover and solve any issues of designs in  

early stage to ensure and enhance the quality of the products. 

(4)Accomplish the products to conform to engineering  

specifications, customer performance expectations. 

Understand the vehicle certification/regulations/customer  

testing requirements. 

(5)Understand the factory production process and testing  

methods.