元件模型工程師

R&D Pilot Line Fab 

• Updating the Fab engineers on customer issues and technology needs. 

• Supporting root cause defect and unique fail mode analysis. 

Process Integration 

• Delivering advanced technology to meet future product nodes. 

• Developing recipes to meet structural & electrical requirements. 

• Managing wafers though Wet&Dry etch levels in support of special requirements. 

Other Process Areas 

• Working in cross-functional teams to jointly develop device structures. 

• Supporting cross-functional failure analysis and yield improvement. 

Wet or Dry Etch peers 

• Maintaining or developing expertise in multiple process, hardware, or technology areas. 

• Serving as a resource for peers in recipe & process development. 

Qualifications:  

• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena 

• Solid trouble shooting, experimental design and data analysis skills 

• Strong computer skills, including MS Office 

• Basic understanding of wet process /plasma etching 

• Understanding in the principles of wet etch or dry etch processing 

• Rudimentary understanding of process control and Statistical Process Control (SPC) 

Education/Experience:  

MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 

『具工作經驗者，薪資另議』

1.監控線上SPC Chart，並針對異常部分即時處理。 

2.製程異常分析，並維護產品品質。 

3.可以輪替值班為佳，協助線上處理異常。 

『具工作經驗者，薪資另議』

1.半導體晶圓TF薄膜製程開發工程師。2.需配合輪班工作。3.理工相關科系，有經驗者佳。 

『具工作經驗者，薪資另議』

R&D Pilot Line Fab 

• Updating the Fab engineers on customer issues and technology needs. 

• Supporting root cause defect and unique fail mode analysis. 

Process Integration 

• Delivering advanced technology to meet future product nodes. 

• Developing recipes to meet structural & electrical requirements. 

• Managing wafers though Dry Etch levels in support of special requirements. 

Other Process Areas 

• Working in cross-functional teams to jointly develop device structures. 

• Supporting cross-functional failure analysis and yield improvement. 

Dry Etch peers 

• Maintaining or developing expertise in multiple process, hardware, or technology areas. 

• Serving as a resource for peers in recipe & process development. 

Qualifications:  

• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena 

• Solid trouble shooting, experimental design and data analysis skills 

• Strong computer skills, including MS Office 

• Basic understanding of plasma sources used in plasma etching 

• Understanding in the principles of dry etch processing 

• Rudimentary understanding of process control and Statistical Process Control (SPC) 

Education/Experience:  

MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 

『具工作經驗者，薪資另議』

1.新製程機台保養技術導入。 

2.設備規範建立與維護。 

3.設備異常處理,設備保養維修系統建立&執行。 

4.保養料件收送及維修。 

5.需配合輪班 

『具工作經驗者，薪資另議』

1.良率提升分析 

2.製程技術改善 

3.實驗數據分析 

4. In-line/Final WAT 值班 

5. 異常case 及線上機台分析比較. 

『具工作經驗者，薪資另議』

1.廠內晶圓測試機/針測機/晶圓目檢機..等機台異常維修與保養作業。 

2.廠內產品換線調機、與針測卡保養等工作。 

3.廠內測試良率監控作業。 

4.外包廠FATC CP機台異常問題回覆與維修support作業。 

5.外包廠FATC/TPW/PTI針測卡異常處理、送修與產品調配之收/送卡作業。 

6.需輪班 

『具工作經驗者，薪資另議』

FDC(Fault Detection Classification) 是一套偵測機台或產品異常的即時處理系統。收集機台的各種參數資料來分析並監控生產過程中是否有異常發生,在發生異常時能立即對機台或產品進行異常管制, 協助Module工程師能即時處理機台與產品的異常。本單位主要的工作如下所示。 

1)維持FDC系統正常運作 

2)針對異常的案件進行分析 

3)規劃並執行改善專案 

『具工作經驗者，薪資另議』

1. 產品後段測試程式開發與驗證 

2. 產品後段測試程式改版,維護與偵錯 

3. 產品後段良率分析與異常處理,以及電性測試分析 

4. 『具工作經驗者，薪資另議』

1. In-line/Final WAT 值班. 

2. 異常case 及線上機台分析比較.  

3. 實驗分析及導入提升良率. 

『具工作經驗者，薪資另議』