
此職缺的所有相似工作:
(共17筆)
研發替代役(115年)_研發整合工程師
力晶積成電子製造股份有限公司((力積電))
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.新技術與結構研發
2.晶圓整合結構開發
3.整合流程設計
4.實驗設計
5.物性與電性測試分析
要求條件
- ● 材料工程學類,電子工程學類,電機工程學類 相關科系
元件整合製程開發工程師
力晶積成電子製造股份有限公司((力積電))
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.邏輯元件製程開發
2.整合製程
3.良率提升
4.光罩設計
要求條件
- ● 電子工程學類,電機工程學類,光電工程學類 相關科系
元件研發工程師
力晶積成電子製造股份有限公司((力積電))
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.邏輯元件開發 (LV/ SRAM device design and development)
2.元件開發工作 (EDR, SPICE, Reliability, Testkey design, WAT analysis, Device characteristics)
3.良率與製程相關性分析 (Yield & process correlation analysis)
要求條件
- ● 電子工程學類,電機工程學類,物理學類 相關科系
先進DRAM開發整合工程師
力晶積成電子製造股份有限公司((力積電))
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. DRAM research and layout design/ tape out.
2. DRAM process flow setup and optimize.
3. DRAM architecture & characteristic development for advance generation
4. DRAM process tuning(co-work with module) and improvement
要求條件
- ● 電子工程學類,電機工程學類,材料工程學類 相關科系
客戶工程服務工程師AccountManager
力晶積成電子製造股份有限公司((力積電))
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. 客戶與公司內部單位的溝通橋樑
2. 負責處理客戶產品pre-tapeout, tape-out, pilot run到mass production的相關事務
要求條件
- ● 物理學類,化學學類,工程學門 相關科系
先進製程及元件工程師/專案副理/專案經理
瑞昱半導體股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合工作項目:
先進製程元件工程、可靠度分析與驗證、製程平台整合與管理
應徵條件:
1. 具6年以上先進製程整合/元件技術/元件可靠度知識與可靠度驗證經驗之相關經驗者 (以上具任一專長即可)
2. 有HKMG/FinFET/Nanosheet先進製程相關經驗者尤佳
3. 碩士以上,電機、電子、物理、光電、材料、化學等相關科系畢業者尤佳
要求條件
- ● 物理學類,數學統計學門,電算機學門 相關科系
元件研發RFSOI_Characterization工程師_竹科/南科
聯華電子股份有限公司(聯電)
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.RF/mm-wave Device Characterization; Measurement, Data Analysis and Reporting.
2.Device pcell design, test structure creation and tape out.
3.Work with modeling & PDK team for design enablement, model validation and pcell improvement.
4.Liaise with vendor, assist lab manager for measurement tool set up, calibration, maintain good measurement quality.
要求條件
- ● 電機工程學類,電子工程學類,光電工程學類 相關科系
Modeling Engineer_竹科
聯華電子股份有限公司(聯電)
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.Spice model generation and verification for advanced and specialty technologies
2.Spice Model Parameter Extraction
3.Test key design
4.Internal and external customer support
5.Advanced modeling tools, extraction algorithms and model equation benchmarking
要求條件
- ● 電機工程學類,電子工程學類,物理學類 相關科系
樣品製備
衡陞科技股份有限公司(MESOSCOPE)
新竹市東區|面議(經常性薪資4萬/月含以上)面議(經常性薪資4萬/月含以上)|經驗不拘|碩士展開收合1.RIE製程
2.Laser decap 製程
3.MIP製成
4.ion milling製程
要求條件
- ● 電子工程學類,物理學類,電機工程學類 相關科系
故障分析工程師
衡陞科技股份有限公司(MESOSCOPE)
新竹市東區|面議(經常性薪資4萬/月含以上)面議(經常性薪資4萬/月含以上)|3年工作經驗以上|碩士展開收合1.Has electrical failure analysis experience (C-AFM, I-V curve 等測試
EMMI / InSB / OBIRCH / nano probing等機台操作經驗
2.Strong analytical and problem-solving skills.
3.有在 fab / lab / FA-house 尤佳
4.Equipment installation and maintenance.
要求條件
- ● 電機工程學類,電子工程學類,光電工程學類 相關科系
R&D IIP 3DIC Metrology Engineer
台灣積體電路製造股份有限公司(台積電)(台積電)
新竹市|面議(經常性薪資4萬/月含以上)展開收合【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
Responsibilities:
Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency.
1. Develop and maintain baselines, including setting up recipes.
(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications.
(2) Responsible for transferring metrology solutions to volume manufacturing.
2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel.
(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency.
(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
要求條件
- ● 化學工程學類,材料工程學類,物理學類 相關科系
A14 R&D Device Engineer
台灣積體電路製造股份有限公司(台積電)(台積電)
新竹市|面議(經常性薪資4萬/月含以上)展開收合【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=5354&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
We invite you to become an integral part of our forward-thinking team, where you will be at the vanguard of nanosheet transistor device design for our prestigious A14 technology initiative. This role offers a unique opportunity to work on the frontier of semiconductor innovation, collaborating with industry leaders and contributing to technologies that define the next generation of electronics.
Responsibilities:
1. Pioneering Nanotechnology Development:
(1) Seamless Integration: Integrate devices across various process modules, including the creation of test keys, execution of tape-outs, meticulous device analysis, advanced simulations, and fortification of model integrity.
(2) Innovative Design: Craft precision test key designs to facilitate accurate electrical modeling and comprehensive device characterization.
(3) Advanced Characterization: Define the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting occasional bench measurements.
(4) Experimentation: Design experiments to meet device KPIs for performance and periodically serve as the on-duty engineer to coordinate device process management.
2. Diagnostic Analysis:
Critical Data Assessment: Apply your analytical expertise to dissect transistor electrical and physical data, pinpointing issues and identifying responsible parties for targeted resolution.
3. Collaborative Problem-Solving:
Interdisciplinary Teamwork: Join forces with a spectrum of specialized teams to scrutinize and appraise new processes, driving the resolution of complex challenges through collective insight and expertise.
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
要求條件
- ● 電子工程學類,電機工程學類,物理學類 相關科系
TCAD Engineer (Programming)
台灣積體電路製造股份有限公司(台積電)(台積電)
新竹市|面議(經常性薪資4萬/月含以上)展開收合【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=344&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers.
Responsibilities:
1. Develop scientific computing software for multi-physics simulations and explore applications in semiconductor technology.
2. Engage with cross-function teams for process development to meet the target product requirements.
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
要求條件
- ● 材料工程學類,電機工程學類,電子工程學類 相關科系
A10/A14 RD Integration Engineer
台灣積體電路製造股份有限公司(台積電)(台積電)
新竹市|面議(經常性薪資4萬/月含以上)展開收合【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers.
Responsibilities:
1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology:
(1) Process integration across process modules, including test key design, tape out, device analysis,
simulation, model, and robust.
(2) Test key designs for design rule validation, electrical modeling, and yield learning.
(3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench
measurement.
(4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling.
2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program.
3. Advanced integration baseline process transfer to volume production.
4. Data analysis to identify the issue and issue owner.
5. Co-work with various teams to evaluate new processes and solve the issue.
6. Routine integration logistic job.
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
要求條件
- ● 電子工程學類,光電工程學類,物理學類 相關科系
- 精選精選職缺
- 1天企業預估回應您的時間為「1個工作天」(2~7天以此類推)
- 急此職務急徵人才
- 習企業實習職缺
- 替研發替代役職缺
- 身接受身障職缺
- 職職場新聞,企業有發布新聞稿,文章,活動等訊息
- 溫溫馨職場,企業有提供職場環境及公司文化等簡介
