伺服器熱流Thermal 設計主任/設計經理(內湖/平鎮) - TWIR16240

1. Seeking finite element analysis engineers. You will work on engineering design and analysis projects focused on mobile device. 

2. Candidates must be able to work independently and in a project team environment.*You should feel comfortable working directly with the customer and mechanical engineer to define requirements, discuss tasks, and report results. 

3. Daily responsibilities include developing FEA models as tools to provide fundamental understanding, advancing product designs, and making design recommendations. 

※依學經歷、工作年資敘薪

【Job Description】 

1. 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Anasys and Flotherm, preferred Flotherm.) 

2. Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products. 

3. Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design. 

【Core Responsibilities】 

1. Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs. 

2. Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications. 

3. Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions. 

4. Develop, review and edit project reports, and report to customers. 

5. Assist with developing proposals and new business leads. 

6. Maintain and grow existing customer contact and relations.

1. Familiar in design for active cooling and passive cooling. 

2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 

3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion.  

4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 

5. New technology research and study in thermal fields.

1. 專案成果掌控、團隊人員及專案進度管理 

2. NB四大件暨相關產品(如PAD、AIO)之機構設計 

3. 掌握、理解需求材料特性進行設計，如塑膠、金屬、五金零件或新材質等 

4. 客戶對應、供應商及工廠溝通協調 

※依學經歷、工作年資敘薪

1. 負責機構相關專案之整體規劃、執行與進度控管 

2. 協調跨部門資源，確保專案如期如質完成 

3. 管理機構設計變更（ECO / ECN） 

4. 主導試產與量產導入流程 

5. 與供應商及製造端合作，解決技術與品質問題 

6. 控管專案成本、風險與品質 

7. 定期向內部或客戶報告專案進度

1. Mechanical Design  

2. Project Management  

3. Issue Analysis and Solution Capability  

4. Cross Function Communication

1. Mechanical Design  

2. Project Management  

3. Issue Analysis and Solution Capability  

4. Cross Function Communication  

※依學經歷、工作年資敘薪

1. Mechanical Design 

2. Project Management 

3. Issue Analysis and Solution Capability 

4. Cross Function Communication 

※依學經歷、工作年資敘薪

1. Server related products packaging design and test. 

2. BOM management.  

3. Cross function communication and issue solving.

1. Lead cross-functional development of L11 rack-level and CDU projects, including coordination of L12 data center integration and management. Candidates must demonstrate deep familiarity with L11/ L12 data center infrastructure design standards and deployment best practices. 

2. Architect and optimize thermal solutions at the L11 rack level, encompassing both air-cooled and liquid-cooled configurations. Proven experience in balancing performance, reliability, and manufacturability is essential. 

3. Drive the design and development of CDU systems supporting both air and liquid cooling technologies. Candidates should have hands-on experience in component selection, system validation, and supplier collaboration. 

4. Next gen innovation in thermal and mechanical technologies. 

5. Well team leading and lab management skill.

1.筆記型電腦喇叭音效音質設計 

2.筆記型電腦麥克風錄音品質設計 

3.Audio issue分析解決 

※依學經歷、工作年資敘薪

1. 衝擊、振動及結構強度相關實驗。 

2. 產品結構設計評估及數值分析。 

3. 專案分析討論、模擬結果解析及設計變更建議。 

4. 實驗設計操作及報告撰寫。 

5. 帶領團隊成員，進行研發議題研究與報告(管理2-5人)。 

※依學經歷、工作年資敘薪

1. 衝擊、振動及結構強度相關實驗。 

2. 產品結構設計評估及數值分析。 

3. 專案分析討論、模擬結果解析及設計變更建議。 

4. 實驗設計操作及報告撰寫。 

5. 臨時交辨事項。 

※依學經歷、工作年資敘薪

1. NB placement 

2.領導工程師Notebook 機構零件設計與整機組裝設計（A/B/C/D Cover, Hinge, Bracket 等） 

3.模具開發與量產異常分析（Injection, Die-casting, Stamping, CNC） 

4.結構強度與可製造性評估（DFM / DFA / DOE / CAE 分析） 

5.與跨部門（ID, EE, DQA, MFG）協作進行設計驗證與問題解決

1. 研發、設計server及storage等系統散熱。 

2. 熟悉各類散熱器及散熱產品之應用。 

3. 依系統所需，制定散熱器之規格。 

4. 開發新的散熱技術。 

5. 進行熱傳分析及溫度量測。 

※依學經歷、工作年資敘薪

1. Notebook 機構零件設計與整機組裝設計（A/B/C/D Cover, Hinge, Bracket 等） 

2. 模具開發與量產異常分析（Injection, Die-casting, Stamping, CNC） 

3. 結構強度與可製造性評估（DFM / DFA / DOE / CAE 分析） 

4. 與跨部門（ID, EE, SI, MFG）協作進行設計驗證與問題解決 

5. 新材料與新製程技術研究與導入（如可回收材料、低碳工藝）  

※依學經歷、工作年資敘薪

1.針對NB/PC產品進行前期熱模組細部設計與評估  

2.NB熱模組測試規劃，提供實驗數據結果  

3.進行issue debug以確保產品品質  

4.執行研發階段驗證產品功能,以確保產品功能之完整性 

※依學經歷、工作年資敘薪

1. CDU與機櫃解熱方案設計 (CDU and rack thermal solution design) 

2. 專案在熱對策部分的執行與驗證 (Project execution and validation of thermal related portion)  

3. 帶領小組成員專案執行與管理彙報 (Team member leading, project execution and manegement) 

4. 開發新技術 (New technology research and study in thermal fields.)  

5. 專案週期管理 (Project Mileston control)

1. 實驗室熱流及溫度量測與驗證 

2. 3D /2D圖面繪圖與確認 

3. 專案文件撰寫及管理

1. Notebook 機構零件設計與整機組裝設計（A/B/C/D Cover, Hinge, Bracket 等） 

2. 模具開發與量產異常分析（Injection, Die-casting, Stamping, CNC） 

3. 結構強度與可製造性評估（DFM / DFA / DOE / CAE 分析） 

4. 與跨部門（ID, EE, SI, MFG）協作進行設計驗證與問題解決 

5. 新材料與新製程技術研究與導入（如可回收材料、低碳工藝）  

※依學經歷、工作年資敘薪