Technical Instructor (ECP) - Hsinchu

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=541&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

The Role: 

Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. 

Responsibilities: 

1. Implement the features and services of backend for TSMC software products 

2. Develop state-of-the-art code 

3. Continue to refactor existing applications 

4. Contribute to write tests to ensure software quality 

5. Apply software design principles to ensure software quality 

6. Ensure sustainability and performance of software applications 

7. Willing to learn new IT technologies 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=545&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Responsibilities: 

1. Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 

2. Develop IC design methodology 

3. Chip tape-out; Design methodology development 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. 

Responsibilities: 

1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology:  

(1) Process integration across process modules, including test key design, tape out, device analysis,  

simulation, model, and robust.  

(2) Test key designs for design rule validation, electrical modeling, and yield learning.  

(3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench  

measurement.  

(4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling. 

2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program. 

3. Advanced integration baseline process transfer to volume production. 

4. Data analysis to identify the issue and issue owner. 

5. Co-work with various teams to evaluate new processes and solve the issue. 

6. Routine integration logistic job. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 

請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: 

https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 

Responsibilities: 

1. Advanced 2.5D and 3D packaging technology development. 

2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 

3. Design kits generation and QA. 

4. 3DIC solution adoption support with key customers. 

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.