
此職缺的所有相似工作:
(共179筆)
<Data center>Technology Engineer(3.5D methodology)
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Develop 3.5D methodology from RTL to GDS and Package
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phases
<Data center>On-die IR integrator
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. 整合IR 資訊和內部團隊合作解決 IR 問題
2. 產生並分析 power 資訊
3. 和客戶溝通 IR 相關的 methodology 並開發流程解決問題
<Data center>HBM 記憶體數位IC設計工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Develop and implement DRAM controller/PHY solutions for data-center applications. Validate functionality, improve design to optimize performance, power, latency and efficiency.
2. Memory controller/PHY Integration: Design and integration memory system.
<Data center>DFT senior engineer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合We are looking for a Senior DFT Engineer to define and implement DFT architectures for data center ASIC products. The role involves developing test strategies, integrating DFT features, and improving test coverage for mass production. You will work closely with design teams to ensure robust DFT solutions, yield improvement, and quality.
Key Responsibilities
• Develop and optimize test strategies to achieve coverage and manufacturing goals; analyze and improve test coverage.
• Integrate DFT features at RTL and gate-level, supporting both top and block-level DFT planning and implementation.
• Perform ATPG, fault simulation, and coverage analysis.
• Collaborate with BE and PD teams to ensure DFT-friendly timing and support IR convergence in test mode.
• Lead silicon bring-up and debug of test features; conduct failure and yield analysis.
• Work with product teams to facilitate pattern generation, validation, and DPPM improvement.
<Automotive>數位IC整合設計工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. 旗艦智慧型手機晶片整合
2. 車用系統晶片整合
3. Clock架構
4. Timing收斂與分析
5. DFT/Test mode整合驗證
<Automotive>車用智慧座艙暨智慧型手機 SoC 數位 IC 設計工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Architecture design and RTL implementation of Automotive/Smartphone chipset
2. SoC system power and performance analysis
3. SoC system bus and memory subsystem design, integration, and modeling
4. SoC low power design, integration, and modeling
5. SoC functional safety analysis, design, integration, and modeling
6. SoC cyber security analysis, design, integration, and modeling
要求條件
- ● 電機工程學類,電子工程學類,光電工程學類 相關科系
<Automotive>車用設計流程技術經理
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合車用相關 IC 設計流程專家。 具備車用SoC/ASIC RTL2GDS 實做經驗和問題解決能力。 同時具備車用IC設計流程中 Safety mechanism 的專業知識。
<Automotive>SOC數位IC設計工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Architecture design and RTL implementation for Smartphone and automotive chip
2. Smartphone SoC and mobile computing platform design.
3. System bus and high speed interface designs
<Automotive>SoC Chip Design Engineer for DFT/DFM
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合We are seeking a highly skilled DFT/DFM Engineer to join our automotive ADAS SoC chip design team.
The successful candidate will be responsible for DFT and DFM methodologies, design, and implementation for our advanced automotive system-on-chip (SoC) designs.
The candidate will also collaborate with the design and layout teams to integrate DFT/DFM requirements.
• SoC testing architecture design
• Support project NPI(new product introduction) to MP(mass production) (test program development, coverage enhancement, yield improvement, cost reduction)
• Cowork w/ IP, test engineer, process team, board design to fulfill CP/FT/SLT test requirement.
<Automotive>Senior digital designer and power architect
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Smartphone (Low Power Architect) and Automotive (Power control)
2. Not a management position
3. Short term:digital IP design/integration of power control IPs with zero bugs
Long term:define power control arch for smartphone or automotive products
develop new tech for power control
<Automotive>Memory System Architect / Designer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Develop and implement tailored DRAM controller/PHY solutions for automotive applications. Validate functionality, improve design revisions and meet performance targets as well as system requirements.
2. Perform rigorous design testing and debugging in automotive environments. Troubleshoot and propose solutions for any issues occurring in post-silicon validation.
3. System Level Cache Design & Implementation: Design and implement system level cache strategies to optimize performance and efficiency across our product range.
4. System-Level Understanding: Exhibit a system-level understanding of performance trade-offs, system architecture, memory subsystems, and various memory technologies (DDR3, DDR4, DDR5, LPDDR3, LPDDR4, LPDDR5 etc.).
5 . Ensure that all designs comply with automotive industry standards and regulations, such as ISO 26262 and Automotive SPICE.
<Automotive>High Speed Interface (PCIe, USB, MIPI, DisplayPort) Digital Designer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Develop high speed interface subsystem architecture and integrate PCIe, MIPI, or DisplayPort subsystem.
2. Develop security and FuSa function on PCIe, MIPI, or DisplayPor degital circuit.
<Automotive>Hardware Platform Security Architect
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合解讀客戶的網絡安全需求
從網絡安全需求中推導出功能和安全概念
制定和審查安全系統架構
與 IP 團隊和客戶溝通和協調安全設計
執行系統安全分析(例如:TARA)
<Automotive>Functional Safety Engineer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Interpret customers’ functional safety requirements
2. Derive functional and technical safety concepts from functional safety requirements
3. Develop and review the safety IP design
4. Communicate and coordinate safety designs with IP teams
5. Perform system safety analysis (ex: FMEDA)
要求條件
- ● 電機工程學類,電子工程學類,光電工程學類 相關科系
<Automotive>Functional Safety Architect
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Interpret customers’ functional safety requirements into SoC requirements
2. Define the SoC level architectures to meet functional safety requirements
3. Communicate and coordinate safety designs with cross-function IP teams
4. Perform system safety analysis (ex: FMEDA)
要求條件
- ● 電機工程學類,電子工程學類,光電工程學類 相關科系
<Automotive> Multimedia Digital IC Design Engineer
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1.數位電路設計
2.多媒體架構與電路設計
3.多媒體系統整合
1.Digital IC Design
2.Multimedia Architecture and Design
3.Multimedia System Integration
要求條件
- ● 資訊工程學類,電機工程學類,電子工程學類 相關科系
數位IC設計工程師_HsinChu
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合Wi-Fi架構和數位電路設計
整個晶片的時鐘、測試和重置規劃
低功耗數位設計
從RTL到閘級的SoC晶片整合,包括時序收斂和可測試性
設計方法和整合流程改進
MCU/DSP 設計驗證工程師
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Processor core, cache and peripheral verification
2. Verification flow and methodology
3. Advanced tool and verification technology survey
混合信號數位IC設計工程師(Serdes, 高速介面)
聯發科技股份有限公司
新竹市東區|面議(經常性薪資4萬/月含以上)展開收合1. Serdes/High speed interface related PHYD IP architecture planning.
2. Serdes/High speed interface related PHYD IP RTL coding.
3. Serdes/High speed interface related PHYD IP front-end and back-end integration.
4. Co-work with MAC design team and DV team for IP verification.
5. Co-work with Analog design team for PHY co-simulation.
要求條件
- ● 資訊工程學類,電機工程學類,電子工程學類 相關科系
- 精選精選職缺
- 1天企業預估回應您的時間為「1個工作天」(2~7天以此類推)
- 急此職務急徵人才
- 習企業實習職缺
- 替研發替代役職缺
- 身接受身障職缺
- 職職場新聞,企業有發布新聞稿,文章,活動等訊息
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